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Contactless interconnection system

  • US 6,362,972 B1
  • Filed: 04/13/2000
  • Issued: 03/26/2002
  • Est. Priority Date: 04/13/2000
  • Status: Expired due to Term
First Claim
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1. A contactless interconnecting system between a computer chip package and a circuit board, comprising:

  • a computer chip package including a silicon wafer;

    a support structure mounting the silicon wafer, the support structure including a wall with a substantially planar upper surface, the wall being fabricated of a dielectric material, a pattern of discrete conductive terminal lands disposed on the upper surface of said wall and electrically coupled to the silicon wafer; and

    , a circuit board positioned below said wall of the computer chip package, the circuit board including a substantially planar upper surface having a pattern of discrete, conductive circuit pads aligned with said chip package terminal lands, said circuit pads and terminal pads being separated from each other by said support structure wall and not being conductively connected.

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