Contactless interconnection system
First Claim
1. A contactless interconnecting system between a computer chip package and a circuit board, comprising:
- a computer chip package including a silicon wafer;
a support structure mounting the silicon wafer, the support structure including a wall with a substantially planar upper surface, the wall being fabricated of a dielectric material, a pattern of discrete conductive terminal lands disposed on the upper surface of said wall and electrically coupled to the silicon wafer; and
, a circuit board positioned below said wall of the computer chip package, the circuit board including a substantially planar upper surface having a pattern of discrete, conductive circuit pads aligned with said chip package terminal lands, said circuit pads and terminal pads being separated from each other by said support structure wall and not being conductively connected.
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Accused Products
Abstract
A contactless interconnecting system is provided between a computer chip package and a circuit board. The system includes a computer chip package having a silicon wafer mounted on a support structure which includes a wall with a substantially planar upper surface. The wall is fabricated of a dielectric material. A pattern of discrete terminal lands are disposed on the upper surface of the wall and are electrically coupled to the silicon wafer. A circuit board is juxtaposed below the wall of the chip package and includes a substantially planar upper surface having a pattern of discrete circuit pads aligned with the terminal lands.
113 Citations
7 Claims
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1. A contactless interconnecting system between a computer chip package and a circuit board, comprising:
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a computer chip package including a silicon wafer;
a support structure mounting the silicon wafer, the support structure including a wall with a substantially planar upper surface, the wall being fabricated of a dielectric material, a pattern of discrete conductive terminal lands disposed on the upper surface of said wall and electrically coupled to the silicon wafer; and
,a circuit board positioned below said wall of the computer chip package, the circuit board including a substantially planar upper surface having a pattern of discrete, conductive circuit pads aligned with said chip package terminal lands, said circuit pads and terminal pads being separated from each other by said support structure wall and not being conductively connected. - View Dependent Claims (2, 3)
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4. A contactless interconnecting system between a computer chip package and a circuit board, comprising:
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a computer chip package including a housing having an exterior wall including a substantially planar inner surface, the wall being fabricated of a dielectric material, and a silicon wafer mounted in the housing, a pattern of discrete, conductive terminal lands on the interior surface of said wall and electrically coupled to the silicon wafer; and
,a circuit board juxtaposed against the exterior of said wall, the circuit board including a substantially planar surface, said circuit board further including a pattern of discrete, conductive circuit pads disposed on a surface thereof that lies against said wall, the circuit pads being aligned with said terminal lands through the wall. - View Dependent Claims (5)
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6. A contactless interconnecting system between a computer chip package and a circuit board, comprising:
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a computer chip package including a silicon wafer, a support structure mounting the silicon wafer and including a dielectric wall with a substantially planar upper surface and a lower surface, a pattern of discrete terminal lands disposed on the upper surface of said wall and electrically coupled to the silicon wafer; and
,a circuit board below said wall of the computer chip package and including a substantially planar upper surface having a pattern of discrete circuit pads aligned with said terminal lands, said lower surface of said wall engaging said discrete circuit pads, said circuit pads and terminal lands being separated from each other by said dielectric wall and not being conductively connected together.
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7. A contactless interconnecting system between a computer chip package and a circuit board, comprising:
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a computer chip package including a silicon wafer, a support structure mounting the silicon wafer, said support structure including at least one solid dielectric wall with a substantially planar upper surface, a pattern of discrete terminal lands disposed on the upper surface of said wall and electrically coupled to the silicon wafer; and
,a circuit board below said wall of the computer chip package and including a substantially planar upper surface having a plurality of discrete circuit pads disposed thereon in a pattern matching that of said terminal lands so that said circuit pads are aligned with said terminal lands and separated therefrom by said dielectric wall.
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Specification