Led component group with heat dissipating support

• US 6,375,340 B1
• Filed: 06/26/2000
• Issued: 04/23/2002
• Est. Priority Date: 07/08/1999
• Status: Expired due to Fees

• Current Assignee: CAMCAR Intellectual Properties, LLC
• Original Assignee: Patent-Treuhand-Gesellschaft Fuer Elektrische Gluehlampen MbH (Siemens AG)
• Inventors: Biebl, Alois, Hirschmann, Guenther
• Primary Examiner(s): O'Shea, Sandra
• Assistant Examiner(s): Negron, Ismael
• Application Number:
  US09/604,423
• Time in Patent Office: 666 Days
• Field of Search: 362/487, 362/543, 362/545, 362/547, 362/249, 362/294, 362/373, 362/800
• US Class Current: 362/294
• CPC Class Codes: F21S 45/47 Passive cooling, e.g. using fins, thermal conductive elements or openings
• CPC Class Codes: F21V 29/85 characterised by the material liquid coolants F21V29/56
• CPC Class Codes: F21V 29/86 Ceramics or glass
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/641 characterized by the materials

Abstract

An optoelectronic component group has at least two LEDs (2) which are mounted on a support (3). The support is composed of a material having a thermal conductivity of better than 1.5 W/K×m, for example ceramic or composite material.

Claims

1. An optoelectronic component group which is mounted on a support (3) and which comprises plural LEDs (2) at a prescribed distance (a) have a packing density of at least 4 LEDs per square centimeter, and associated connecting lines (4), wherein the support (3) has a thermal conductivity of at least 1.5 W/K×

m.

2. The optoelectronic component group according to claim 1, wherein the support is composed of a material which is selected from the group consisting of ceramic, non-conducting cermet, plastic and composite material.

3. The optoelectronic component group according to claim 1, wherein the support is mounted on a further heat-dissipating, separate thermal plate.

4. The optoelectronic component group according to claim 1, wherein the plural LEDs (2) are arranged regularly on the support.

5. The optoelectronic component group according to claim 4, wherein the plural LEDs (2) form an array, with a prescribed distance (a and b) in the rows and columns, respectively.

6. The optoelectronic component group according to claim 1, wherein the component group is a component part of a surface lighting luminaire or lamp.

7. The optoelectronic component group according to claim 6, wherein the distance between adjacent LEDs is less than 2 mm.

8. The optoelectronic component group according to claim 6, wherein a structural height of the group is less than 10 mm.

9. The optoelectronic component group of claim 1, wherein said support has an exterior mounting surface and said plural LEDs are mounted directly on said exterior mounting surface.

10. The optoelectronic component group according to claim 9, wherein the support is composed of a material which can be populated on said exterior mounting surface by means of SMD technology.

11. The optoelectronic component group according to claim 2, further comprising electronic component parts integrated on said exterior mounting surface.

12. The optoelectronic component group according to claim 9, wherein at least one further component (7) is fixed on said exterior mounting surface.

13. The optoelectronic component group according to claim 12, wherein the further component is an integrated circuit.

14. An LED component group comprising:

a support that has a thermal conductivity of at least 1.5 W/K×

m and that has an exterior mounting surface;

plural LEDs mounted directly on said exterior mounting surface, a distance between adjacent ones of said plural LEDs being no more than 5 mm, said plural LEDs having a packing density of at least 4 LEDs per square centimeter; and

connections for said plural LEDs mounted directly on said exterior mounting surface.

15. The LED component group of claim 14, further comprising an integrated circuit mounted directly on said exterior mounting surface.

16. The LED component group of claim 14, wherein said support comprises a material selected from the group of materials consisting of ceramic, non-conducting cermet, plastic, and composite material.

17. The LED component group of claim 14, wherein said support has a thermal conductivity of at least 3 W/K×

m.

18. An optoelectronic component group which is mounted on an exterior mounting surface of a support (3) and which comprises plural LEDs (2), which are spaced apart from one another and have a packing density of at least 4 LEDs per square centimeter, and associated connecting lines (4), wherein the support (3) dissipates heat well enough to realize a distance between adjacent LEDs of less than 2 mm, without limiting the specified forward current of the LEDs and without further aids.