Optoelectronic structural element

CAFC
  • US 6,376,902 B1
  • Filed: 01/31/2000
  • Issued: 04/23/2002
  • Est. Priority Date: 07/29/1997
  • Status: Expired due to Term
First Claim
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1. An optoelectronic surface-mountable structural element (SMD), comprising:

  • a lead frame having a chip carrier part, external connections, and a connection part disposed at a distance from said chip carrier part, at least three of said external connections being heat-conducting connections thermally conductively connected to said chip carrier part;

    an optoelectronic chip heat-conductively connected to said chip carrier part of said lead frame, said optoelectronic chip having an electrical contact electrically conductively connected to said connection part; and

    a casing having a foundation encasing said optoelectronic chip and a part of said lead frame, said foundation having a first main surface and an outward facing second main surface disposed opposite said first main surface, said external connections and said connection part project outside of said casing, said external connections and said connection part being bent outside of said foundation toward said outward-facing second main surface of said foundation and in a further course being further bent one of below said foundation toward a center of said outward-facing second main surface and away from said foundation for forming rocker-shaped connection stumps, said at least three of said external connections projecting from said casing on at least two sides of said casing at different places at a distance from each other, said heat-conducting connections as seen in a top view of said lead frame projecting from said casing on at least two sides and starting from said chip carrier part run toward the outside in a stellate form within said casing and separately from each other.

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