Method of realizing machining results

• US 6,388,703 B1
• Filed: 07/27/1999
• Issued: 05/14/2002
• Est. Priority Date: 08/03/1998
• Status: Expired due to Term

• Current Assignee: Disco Corporation
• Original Assignee: Disco Corporation
• Inventors: Negishi, Katsuharu
• Primary Examiner(s): BRITTON, HOWARD W
• Application Number:
  US09/361,208
• Time in Patent Office: 1,022 Days
• Field of Search: H04/N.718, 348/87, 348/126, 348/129, 348/161, 382/145
• US Class Current: 348/87
• CPC Class Codes: G05B 19/41875 characterised by quality surveillance of production
• CPC Class Codes: G05B 2219/37578 Compare images of workpiece before and after machining
• CPC Class Codes: G05B 2219/45031 Manufacturing semiconductor wafers
• CPC Class Codes: H01L 22/20 Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
• CPC Class Codes: Y02P 90/02 Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Abstract

Disclosed is a method of realizing machining results of a given workpiece. It comprises the steps of: obtaining an image of a selected area in the workpiece before a required machining is performed; obtaining an image of the selected area in the workpiece after the required machining has been performed; making a comparison between these pre- and post-machining images of workpiece to derive non-common portions from the comparison; and realizing how the machined portion or portions in the selected area are like.

Claims

1. A method of realizing machining results of a given workpiece comprising the steps of:

obtaining an image of a selected area in the workpiece with picture-taking means before a required machining is performed on the workpiece;

obtaining an image of the selected area in the workpiece with picture-taking means after the required machining has been performed on the workpiece;

making a comparison between the image prior to the required machining and the image post of the required machining to derive non-common portions from the comparison; and

realizing how the machined portion or portions in the selected area are like.

2. A method of realizing machining results of a given workpiece according to claim 1 wherein the workpiece is a semiconductor wafer;

the required machining is dicing of the semiconductor wafer;

the selected area is streets on which cutting is effected to separate the semiconductor wafer into small squares or dice; and

state of grooves in the semiconductor wafer resulted by cutting is realized.

3. A method of realizing machining results of a given workpiece according to claim 1 wherein the workpiece is a semiconductor wafer;

the required machining is dicing of the semiconductor wafer;

the selected area is anywhere in the semiconductor wafer; and

state of contaminant scattered and attached on the semiconductor wafer is realized.