Micromechanical die attachment surcharge
First Claim
1. A structure for attaching a pair of substrates together, with at least one of the substrates comprising a semiconductor, the structure comprising:
- (a) a first plurality of shaped barbless pillars of a substantially uniform width extending outward from and supported by a first surface of a first substrate of a pair of substrates; and
(b) engagement means formed on a second surface of a second substrate of the pair of substrates for engaging with the outward-extending barbless pillars and forming a mechanical attachment thereto when the first and second surfaces are urged together.
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Accused Products
Abstract
An attachment structure is disclosed for attaching a die to a supporting substrate without the use of adhesives or solder. The attachment structure, which can be formed by micromachining, functions purely mechanically in utilizing a plurality of shaped pillars (e.g. round, square or polygonal and solid, hollow or slotted) that are formed on one of the die or supporting substrate and which can be urged into contact with various types of mating structures including other pillars, a deformable layer or a plurality of receptacles that are formed on the other of the die or supporting substrate, thereby forming a friction bond that holds the die to the supporting substrate. The attachment structure can further include an alignment structure for precise positioning of the die and supporting substrate to facilitate mounting the die to the supporting substrate. The attachment structure has applications for mounting semiconductor die containing a microelectromechanical (MEM) device, a microsensor or an integrated circuit (IC), and can be used to form a multichip module. The attachment structure is particularly useful for mounting die containing released MEM devices since these devices are fragile and can otherwise be damaged or degraded by adhesive or solder mounting.
121 Citations
37 Claims
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1. A structure for attaching a pair of substrates together, with at least one of the substrates comprising a semiconductor, the structure comprising:
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(a) a first plurality of shaped barbless pillars of a substantially uniform width extending outward from and supported by a first surface of a first substrate of a pair of substrates; and
(b) engagement means formed on a second surface of a second substrate of the pair of substrates for engaging with the outward-extending barbless pillars and forming a mechanical attachment thereto when the first and second surfaces are urged together. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34)
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35. A structure for attaching at least one semiconductor die to a supporting substrate, comprising:
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(a) a plurality of downward-extending barbless pillars having a substantially uniform width formed on a lower surface of each semiconductor die in a spaced arrangement; and
(b) a plurality of upward-extending barbless pillars formed on an upper surface of the supporting substrate and spaced for engagement with the downward-extending pillars to provide a mechanical attachment of the upward-extending pillars with the downward-extending pillars. - View Dependent Claims (36, 37)
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Specification