SMIF pod including independently supported wafer cassette

• US 6,398,032 B2
• Filed: 05/05/1998
• Issued: 06/04/2002
• Est. Priority Date: 05/05/1998
• Status: Expired due to Fees

• Current Assignee: Entegris Incorporated
• Original Assignee: Asyst Technologies Incorporated (Azenta, Inc.)
• Inventors: Peterson, Perry, Bonora, Anthony C., Martin, Raymond S., Fosnight, William J.
• Primary Examiner(s): Brahan, Thomas J.
• Application Number:
  US09/073,101
• Publication Number:
  US 20020015633A1
• Time in Patent Office: 1,491 Days
• Field of Search: 206/710, 206/711, 206/712, 414/217, 414/937, 414/938, 414/416, 414/711
• US Class Current: 206/711
• CPC Class Codes: G03F 7/7075 Handling workpieces outside exposure position, e.g. SMIF box
• CPC Class Codes: H01L 21/67379 characterised by coupling elements, kinematic members, handles or elements to be externally gripped
• CPC Class Codes: H01L 21/67383 characterised by substrate supports
• CPC Class Codes: H01L 21/67386 characterised by the construction of the closed carrier

Abstract

A SMIF pod capable of supporting a cassette at points in the pod located directly over or near a kinematic coupling between the pod and a surface on which the pod is supported. Even if the pod shell warps or otherwise deforms, the three points of contact between the pod and the support surface at the kinematic couplings will always remain at a fixed, controllable and repeatable position. The present invention makes use of this fact by supporting the cassette at or near the three kinematic coupling points. Moreover, the support structure is not affixed to the top or sides of the pod shell. Thus, the position of the cassette, and wafers supported therein, will similarly remain at a fixed, controllable and repeatable position, substantially unaffected by any pod shell deformation which may occur.

Claims

1. A system for positioning a workpiece with respect to a support surface having kinematic pins protruding from the support surface, comprising:

a pod, including a pod shell and a support plate, said support plate having kinematic grooves positioned to engage said kinematic pins; and

a cassette having a pair of support columns, each support column being concentric with a respective one of said kinematic pins.

2. The system according to claim 1, wherein said cassette further comprises a top plate extending between and connecting said pair of support columns.

3. The system according to claim 2, further comprising a bottom plate, wherein said support columns are seated on said bottom plate.

4. The system according to claim 1, wherein said cassette further has a bottom plate, and said pair of support columns are seated on said bottom plate.

5. The system according to claim 1, said cassette further including a first fin extending from a surface of said cassette, and said pod shell including a second fin extending from a surface of said pod shell, wherein said first fin is capable of engaging said second fin to limit movement of said cassette with respect to said pod shell.

6. A system for positioning a semiconductor wafer within a container, comprising:

a pod including a pod shell and a pod door, said pod shell having a top surface, a bottom surface, sides between said top surface and bottom surface, and at least one fin extending from said pod shell; and

a cassette capable of supporting the semiconductor wafer, said cassette is affixed only with said pod door, and further having at least one fin extending from said cassette so that the movement of said fin extending from said cassette is restrained by said fin extending from said pod shell to limit movement of said cassette with respect to said pod shell.

7. A system as recited in claim 6, wherein said wafer cassette comprises a pair of support columns for supporting said wafer, and a top plate extending between and connecting said pair of support columns.

8. A system according to claim 7, further comprising a bottom plate, wherein said support columns are seated on said bottom plate.

9. A system according to claim 6, wherein said wafer cassette comprises a bottom plate, and a pair of wafer support columns seated on said bottom plate.