Method for separating non-metallic substrates

  • US 6,420,678 B1
  • Filed: 01/29/1999
  • Issued: 07/16/2002
  • Est. Priority Date: 12/01/1998
  • Status: Expired due to Fees
First Claim
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1. A method of separating a non-metallic substrate along a separation line by propagating a microcrack, the method comprising:

  • generating an incident beam of coherent energy;

    splitting at least a portion of the beam to form first and second distinct beams of coherent energy;

    directing at least a portion of the first beam onto the substrate to impinge at a first beam spot;

    directing at least a portion of the second beam onto the substrate to impinge at a second beam spot separate from the first beam spot;

    projecting a coolant stream onto the substrate so that the coolant stream contacts the substrate at a cooling locality;

    moving the first and second beams and the coolant stream relative to the substrate so that the first and second beam spots and the cooling locality move across the substrate;

    wherein the splitting step causes the first and second beam spots to be separated from each other in a direction along the separation line; and

    splitting the second beam into distinct beam portions that impinge upon the substrate at the second beam spot and a third beam spot, the second and third beam spots being located on opposite sides of the separation line.

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