Tamper-resistant wireless article including an antenna
First Claim
1. A tamper-resistant article comprising:
- a substrate having first and second opposing broad planar surfaces, said substrate including at least one layer of a strong dielectric adhesive on the first broad planar surface thereof having an exposed surface adapted for adhesively attaching said substrate to an object;
a pattern of electrically-conductive material including an elongated electrical conductor on the first or the second broad planar surface of said substrate and having at least one electrical contact; and
at least one electronic device attached to the first or the second broad planar surface of said substrate by a strong adhesive and having at least one contact electrically connected to the contact of said pattern of electrically-conductive material, whereby at least one of the at least one layer of strong dielectric adhesive of said substrate and the strong adhesive attaching said electronic device render said article resistant to tampering.
4 Assignments
0 Petitions
Accused Products
Abstract
A wireless article, such as an identification tag or badge, includes an electronic device mounted on a substrate and connected a loop antenna for receiving and/or transmitting radio frequency signals. Electrically conductive material disposed on the substrate or in holes through the substrate of the wireless article connect the antenna terminals to the electronic device contacts. The structure and materials of the wireless article may be rugged and strong to provide a tamper-resistant article, and/or may include one or more weakened or frangible portions that easily break to provide a tamper-destruct article. The wireless article may be arranged to resist heat, moisture and/or solvents, to function in severe environments such as laundering and industrial processes.
507 Citations
57 Claims
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1. A tamper-resistant article comprising:
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a substrate having first and second opposing broad planar surfaces, said substrate including at least one layer of a strong dielectric adhesive on the first broad planar surface thereof having an exposed surface adapted for adhesively attaching said substrate to an object;
a pattern of electrically-conductive material including an elongated electrical conductor on the first or the second broad planar surface of said substrate and having at least one electrical contact; and
at least one electronic device attached to the first or the second broad planar surface of said substrate by a strong adhesive and having at least one contact electrically connected to the contact of said pattern of electrically-conductive material, whereby at least one of the at least one layer of strong dielectric adhesive of said substrate and the strong adhesive attaching said electronic device render said article resistant to tampering.
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2. The tamper-resistant article of claim 1 wherein said elongated electrical conductor includes at least one of a deposited electrically-conductive adhesive and a metal foil.
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3. The tamper-resistant article of claim 2 wherein said metal foil is laminated to the one surface of said substrate and is patterned to define said elongated electrical conductor.
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4. The tamper-resistant article of claim 1 wherein at least one of said pattern of electrically conductive material and the electrical connection of the contact of said electronic device to said substrate includes at least one frangible region.
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5. The tamper-resistant article of claim 4 wherein said frangible region includes at least one of a thin region, a narrowed region, a notch, a thin foil of copper or silver, electroless plated silver on activated plastic, and electrically-conductive adhesive bridging a gap in the pattern of electrically-conductive material.
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6. The tamper-resistant article of claim 1 wherein said elongated electrical conductor includes a spiral conductor having at least one turn.
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7. The tamper-resistant article of claim 1 wherein at least the at least one electrical contact of said pattern of electrically-conductive material is coated with an oxidation-resistant metal.
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8. The tamper-resistant article of claim 1 wherein said pattern of electrically-conductive material is formed by one of (a) roll coating, screen printing, stenciling, mask printing, ink jet printing and laminating an electrically conductive adhesive, and (b) hot stamping and electroless plating a conductive metal.
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9. The tamper-resistant article of claim 1 wherein the at least one contact of said electronic device is electrically connected to the contact of said pattern of electrically conductive adhesive by one of solder and an electrically-conductive adhesive.
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10. The tamper-resistant article of claim 1 wherein the strong adhesive by which said electronic device is attached to said substrate includes at least one of a strong electrically-conductive adhesive connecting the contact of said electronic device to the contact of said pattern of electrically-conductive material and a strong dielectric adhesive underill.
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11. The tamper-resistant article of claim 1 wherein the electronic device is attached to said substrate one of (a) while the electrically-conductive adhesive is wet, and (b) after the electrically-conductive adhesive is dried or B-staged and wherein one of said substrate and said electronic device is heated to melt flow said electrically-conductive adhesive.
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12. The tamper-resistant article of claim 1 wherein said substrate further comprises a sheet of one of poly-vinyl-chloride (PVC), polyimide, poly-ethylene terephthallate (PET), FR4 material, acrylonitrile-butadiene-styrene (ABS), high-impact polystyrene (HIPS), polyimide, polybutylene terephthallate, polyester, polyester terephthallate, polymer blends, polyphynylene sulfide, polysulfone, polyether sulfone, paper film, dried insulating adhesive, B-staged insulating adhesive, and cured insulating adhesive.
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13. The tamper-resistant article of claim 1 further comprising an insulating adhesive underfill attaching said electronic device to said substrate.
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14. The tamper-resistant article of claim 1 wherein said at least one layer of strong dielectric adhesive of said substrate encapsulates said electronic device.
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15. A tamper-resistant article comprising:
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a substrate including at least one layer of a strong dielectric adhesive having an exposed surface adapted for attaching said substrate to an object and having at least two holes;
a pattern of electrically-conductive material including an elongated electrical conductor on one surface of said substrate and having at least one electrical contact; and
at least one electronic device attached to said substrate by a strong adhesive and having at least one contact electrically connected to the contact of said pattern of electrically-conductive adhesive, whereby at least one of the strong dielectric material of said substrate and the strong adhesive attaching said electronic device render said article resistant to tampering, and a second pattern of electrically-conductive material having at least two additional electrical contacts on a second surface of said substrate, each of said at least two additional contacts being electrically connected to said pattern of electrically-conductive material on the one surface of said substrate through the at least two holes, respectively, wherein said electronic device has at least two contacts electrically connected respectively to the at least two additional contacts of the electrically-conductive material.
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16. The tamper-resistant article of claim 15 wherein said second pattern of electrically-conductive material includes electrically-conductive adhesive extending into the at least two holes of said substrate to provide electrical connection between the contacts of said electronic device and said pattern of electrically-conductive material on the one surface of said substrate.
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17. A tamper-destruct article comprising:
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a substrate having first and second opposing broad planar surfaces, said substrate including at least one layer of a dielectric adhesive on the first broad planar surface thereof having an exposed surface adapted for adhesively attaching said substrate to an object;
a pattern of electrically-conductive material including an elongated electrical conductor on the first or the second broad planar surface of said substrate and having at least one electrical contact; and
at least one electronic device attached to the first or the second broad planar surface of said substrate by an adhesive and having at least one contact electrically connected to the contact of said pattern of electrically-conductive material;
wherein at least one of said pattern of electrically conductive material and the electrical connection of the contact of said electronic device to said substrate includes at least one frangible region, whereby tampering with said article tends to break at least one of the frangible regions of said pattern of electrically-conductive material and the adhesive attaching said electronic device.
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18. The tamper-destruct article of claim 17 wherein said frangible region includes at least one of a thin region, a narrowed region, a notch, a thin foil of copper or silver, electroless plated silver on activated plastic, and electrically-conductive adhesive bridging a gap in the pattern of electrically-conductive material.
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19. The tamper-destruct article of claim 17 wherein said elongated electrical conductor includes at least one of a deposited electrically-conductive adhesive and a metal foil.
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20. The tamper-destruct article of claim 19 wherein said metal foil is laminated to the one surface of said substrate and is patterned to define said elongated electrical conductor.
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21. The tamper-destruct article of claim 17 wherein said elongated electrical conductor includes a spiral conductor having at least one turn.
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22. The tamper-destruct article of claim 17 wherein at least the at least one electrical contact of said pattern of electrically-conductive material is coated with an oxidation-resistant metal.
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23. The tamper-destruct article of claim 17 wherein said pattern of electrically-conductive material is formed by one of (a) roll coating, screen printing, stenciling, mask printing, ink jet printing and laminating an electrically conductive adhesive, and (b) hot stamping and electroless plating a conductive metal.
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24. The tamper-destruct article of claim 17 wherein the at least one contact of said electronic device is electrically connected to the contact of said pattern of electrically conductive adhesive by one of solder and an electrically-conductive adhesive.
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25. The tamper-destruct article of claim 17 wherein the adhesive by which said electronic device is attached to said substrate includes at least one of a electrically-conductive adhesive connecting the contact of said electronic circuit to the contact of said pattern of electrically-conductive material and a dielectric adhesive underfill.
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26. The tamper-destruct article of claim 17 wherein the electronic device is attached to said substrate one of (a) while the electrically-conductive adhesive is wet, and (b) after the electrically-conductive adhesive is dried or B-staged and wherein one of said substrate and said electronic device is heated to melt flow said electrically-conductive adhesive.
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27. The tamper-destruct article of claim 17 wherein said substrate further comprises a sheet of one of poly-vinyl-chloride (PVC), polyimide, poly-ethylene terephthallate (PET), FR4 material, acrylonitrile-butadiene-styrene (ABS), high-impact polystyrene (HIPS), polyimide, polybutylene terephthallate, polyester, polyester terephthallate, polymer blends, polyphynylene sulfide, polysulfone, polyether sulfone, paper film, dried insulating adhesive, B-staged insulating adhesive, and cured insulating adhesive.
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28. The tamper-destruct article of claim 17 further comprising an insulating adhesive underfill attaching said electronic device to said substrate.
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29. The tamper-destruct article of claim 17 wherein said at least one layer of dielectric adhesive of said substrate encapsulates said electronic device.
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30. A tamper-destruct article comprising:
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a substrate including at least one layer of a dielectric adhesive having an exposed surface adapted for adhesively attaching said substrate to an object and having at least two holes;
a pattern of electrically-conductive material including an elongated electrical conductor on one surface of said substrate and having at least one electrical contact; and
at least one electronic device attached to said substrate by an adhesive and having at least one contact electrically connected to the contact of said pattern of electrically-conductive material;
wherein at least one of said pattern of electrically conductive material and the electrical connection of the contact of said electronic device to said substrate includes at least one frangible region, whereby tampering with said article tends to break at least one of the frangible regions of said pattern of electrically-conductive material and the adhesive attaching said electronic device, and a second pattern of electrically-conductive material having at least two additional electrical contacts on a second surface of said substrate, each of said at least two additional contacts being electrically connected to said pattern of electrically-conductive material on the one surface of said substrate through the at least two holes, respectively, wherein said electronic device has at least two contacts electrically connected respectively to the at least two additional contacts of the electrically-conductive material.
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31. The tamper-destruct article of claim 30 wherein said second pattern of electrically-conductive material includes electrically-conductive adhesive extending into the at least two holes of said substrate to provide electrical connection between the contacts of said electronic device and said pattern of electrically-conductive material on the one surface of said substrate.
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32. A wireless article having an electronic device embedded therein and adapted to evidence tampering therewith comprising:
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a substrate having first and second opposing broad planar surfaces;
an electronic device mounted on the first broad planar surface of said substrate;
a patterned electrically-conductive material on one of the first and second broad planar surfaces of said substrate electrically coupled to said electronic device, said patterned electrically-conductive material including a frangible region susceptible to breaking upon tampering therewith; and
a layer of melt-flowable adhesive on the first broad planar surface of said substrate covering said electronic device, whereby said electronic device is encapsulated by said layer of melt-flowable adhesive, said layer of melt-flowable adhesive being adapted for adhesively attaching said substrate to a utilization object.
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33. The wireless article of claim 32 wherein said frangible region includes at least one of a thin region, a narrowed region, a notch, a thin foil of copper or silver, electroless plated silver on activated plastic, and electrically-conductive adhesive bridging a gap in the pattern of electrically-conductive material.
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34. The wireless article of claim 32 wherein said patterned electrically-conductive material is on the first surface of said substrate and includes an elongated electrical conductor having first and second ends electrically connected to said electronic device.
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35. The wireless article of claim 34 wherein said elongated electrical conductor is a loop antenna of one of (a) a deposited pattern of conductive adhesive and (b) a hot-stamped foil of copper or silver on the first surface of said substrate.
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36. The wireless article of claim 32 wherein said layer of melt-flowable adhesive is one of a laminated sheet and a deposited layer, wherein the deposited layer is deposited by one of roll coating, screen printing, stenciling, masking, and ink-jet printing.
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37. The wireless article of claim 32 wherein said melt-flowable adhesive has a bond strength greater than about 200 psi (14 kg/cm2) at temperatures less than about 45°
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38. The wireless article of claim 32 wherein said substrate is of a material selected from the group consisting of polyvinyl chloride, acrylonitrile-butadiene-styrene polymer, high-impact polystyrene, polyester, and polyimide.
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39. The wireless article of claim 32 further comprising a layer of adhesive on the second surface of said substrate adapted for attaching said wireless article to a utilization object.
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40. A wireless article having an electronic device embedded therein and adapted to evidence tampering therewith comprising:
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a substrate having first and second opposing surfaces;
an electronic device mounted on the first surface of said substrate;
a patterned electrically-conductive material on said substrate electrically coupled to said electronic device, said patterned electrically-conductive material including a frangible region susceptible to breaking upon tampering therewith; and
a layer of melt-flowable adhesive on the first surface of said substrate covering said electronic device, whereby said electronic device is encapsulated by said layer of melt-flowable adhesive, said layer of melt-flowable adhesive being adapted for attaching said substrate to a utilization object;
wherein said patterned electrically-conductive material includes an elongated electrical conductor, and wherein said elongated electrical conductor is a loop antenna of one of (a) a deposited pattern of conductive adhesive and (b) a hot-stamped foil of copper or silver on the second surface of said substrate, and electrically connected to said electronic device by electrically-conductive adhesive vias through said substrate.
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41. A wireless article having an electronic device embedded therein and adapted to evidence tampering therewith comprising:
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a substrate having first and second opposing surfaces;
an electronic device mounted on the first surface of said substrate;
a patterned electrically-conductive material on said substrate electrically coupled to said electronic device, said patterned electrically-conductive material including a frangible region susceptible to breaking upon tampering therewith; and
a layer of melt-flowable adhesive on the second surface of said substrate, said layer of melt-flowable adhesive being adapted for attaching said substrate to a utilization object.
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42. The wireless article of claim 41 wherein said frangible region includes at least one of a thin region, a narrowed region, a notch, a thin foil of copper or silver, electroless plated silver on activated plastic, and electrically-conductive adhesive bridging a gap in the pattern of electrically-conductive material.
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43. The wireless article of claim 41 wherein said patterned electrically-conductive material is on the first surface of said substrate and includes an elongated electrical conductor having first and second ends electrically connected to said electronic device.
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44. The wireless article of claim 43 wherein said elongated electrical conductor is a loop antenna of one of (a) a deposited pattern of conductive adhesive and (b) a hot-stamped foil of copper or silver on the first surface of said substrate.
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45. The wireless article of claim 43 wherein said elongated electrical conductor is a loop antenna of one of (a) a deposited pattern of conductive adhesive and (b) a hot-stamped foil of copper or silver on the second surface of said substrate, and electrically connected to said electronic device by electrically-conductive adhesive vias through said substrate.
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46. The wireless article of claim 41 wherein said layer of melt-flowable adhesive is one of a laminated sheet and a deposited layer, wherein the deposited layer is deposited by one of roll coating, screen printing, stenciling, masking, and ink-jet printing.
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47. The wireless article of claim 41 wherein said melt-flowable adhesive has a bond strength greater than about 200 psi (14 kg/cm2) at temperatures less than about 45°
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48. The wireless article of claim 41 wherein said substrate is of a material selected from the group consisting of polyvinyl chloride, acrylonitrile-butadiene-styrene polymer, high-impact polystyrene, polyester, and polyimide.
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49. The wireless article of claim 41 further comprising a layer of melt-flowable adhesive on the first surface of said substrate covering said electronic device and adapted for attaching said wireless article to a utilization object, whereby said electronic device is encapsulated by said layer of melt-flowable adhesive on the first surface of said substrate.
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50. An electronic article comprising:
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a layer of electrically insulating adhesive providing a planar adhesive substrate, the adhesive having an adhesive bond strength that substantially exceeds the intrinsic strength of the adhesive, whereby attempting to remove the planar adhesive substrate from an object to which it is adhesively attached by said adhesive results in damage to the planar adhesive substrate before separation of the planar adhesive substrate from the object;
an electronic device that is one of mounted to and embedded in said planar adhesive substrate; and
an antenna on a surface of said planar adhesive substrate and electrically connected to said electronic device.
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51. The electronic article of claim 50 wherein said antenna includes a patterned metal foil of one of copper, aluminum and silver, and electroless silver plating thereon for providing an antenna having a resistance of less than about 2 ohms.
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52. An electronic article comprising:
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a layer of electrically insulating adhesive providing a substrate, the adhesive having an adhesive bond strength that substantially exceeds the intrinsic strength of the adhesive, whereby attempting to remove the substrate from an object to which it is attached by said adhesive results in damage to the substrate before separation of the substrate from the object;
an electronic device that is one of mounted to and embedded in said adhesive substrate; and
an antenna on a surface of said adhesive substrate and electrically connected to said electronic device, wherein said electronic device is electrically connected to said antenna by electrically-conductive adhesive that is one of (a) of substantially lower intrinsic strength than the intrinsic strength of the adhesive of said substrate, and (b) soluble in a solvent that dissolves the adhesive of said substrate, whereby attempting to remove the electronic article from a utilization object by physical force or solvent tends to damage the electrical connection of the antenna to the electronic device.
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53. An electronic article comprising:
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a layer of electrically insulating adhesive providing a substrate, the adhesive having an adhesive bond strength that substantially exceeds the intrinsic strength of the adhesive, whereby attempting to remove the substrate from an object to which it is attached by said adhesive results in damage to the substrate before separation of the substrate from the object;
an electronic device that is one of mounted to and embedded in said adhesive substrate; and
an antenna on a surface of said adhesive substrate and electrically connected to said electronic device, wherein at least a portion of said antenna is a frangible region having a strength substantially less than the intrinsic strength of the adhesive of said substrate, whereby attempting to remove the electronic article from the object by physical force tends to damage the antenna.
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54. The electronic article of claim 53 wherein said frangible region includes at least one of a thin region, a narrowed region, a notch, a thin foil of copper, aluminum or silver, electroless plated silver on activated plastic, electroless plated silver on activated ABS, and electrically-conductive adhesive bridging a gap in the pattern of electrically-conductive material.
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55. The electronic article of claim 54 wherein at least said frangible region has at least one of a thickness less than about 0.025 mm and a width less than about 0.10 mm.
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56. The electronic article of claim 53 wherein said antenna includes a patterned metal foil of copper, aluminum or silver, having a thickness of at least about 0.025 mm and wherein at least a part of said patterned metal foil has a width of at least about 0.10 mm.
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57. The electronic article of claim 53 wherein said antenna includes a pattern of one of electroless plated silver on activated plastic and electroless plated silver on activated ABS, the electroless silver having a thickness of less than about 0.025 mm and a width at least in part of at least about 0.10 mm.
Specification