Integrated filter feed-thru

• US 6,459,935 B1
• Filed: 07/13/2000
• Issued: 10/01/2002
• Est. Priority Date: 07/13/2000
• Status: Active Grant

• Current Assignee: AVX Corporation (Kyocera Corporation)
• Original Assignee: AVX Corporation (Kyocera Corporation)
• Inventors: Piersma, Randall J.
• Primary Examiner(s): Schaetzle, Kennedy
• Assistant Examiner(s): DROESCH, KRISTEN L
• Application Number:
  US09/616,147
• Time in Patent Office: 810 Days
• Field of Search: 607/36-37, 128/901, 361/302, 361/306.1, 333/182, 333/184
• US Class Current: 607/37
• CPC Class Codes: A61N 1/3754 Feedthroughs
• CPC Class Codes: H01G 4/35 Feed-through capacitors or anti-noise capacitors
• CPC Class Codes: H01L 23/055 the leads having a passage through the base H01L23/057 takes precedence
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A multi-leaded, filter feed-thru assembly for implantable medical devices, such as heart pacemakers, defibrillators, and neurostimulators, which integrates both multi-element semiconductor devices and passive component devices, or multi-element combinations thereof, together with a discoidal capacitive filter device to provide filtration of electromagnetic interference is provided. The assembly additionally provides for the suppression of high voltage transients from defibrillation and electrocautery procedures, as well as providing additional circuit and network functions.

Claims

1. A filtered feed-thru assembly for implantable medical devices, the assembly comprising:

(a) a header having a supportive surface with a flange on the outer perimeter thereof for attachment to an implantable housing and a first opening defined through said header;

(b) multiple electrically conductive terminal pins disposed within and extending through said first opening, said terminal pins each having respective first and second ends;

(c) an electrically insulative support for said multiple electrically conductive terminal pins, said electrically insulative support being disposed within said first opening;

(d) a discoidal capacitive device with an upper and lower side, said lower side connected to said support surface of said header, comprising a first set of electrode plates arranged to be suitable for parallel connections with said multiple electrically conductive terminal pins, a second set of electrode plates arranged to be suitable for series connections with said multiple electrically conductive terminal pins, and a second set of openings defined through said discoidal capacitive device for passage of said terminal pins, wherein said first opening through said header aligns with said second set of openings in said discoidal capacitive device when they are bonded; and

(e) wherein electrically conductive patterns are disposed on said upper side of said discoidal capacitor and an electrical component is connected to said electrically conductive patterns.

2. The assembly of claim 1, wherein said electrically insulative supports comprise a single multi-hole insulator.

3. The assembly of claim 1, wherein said multiple electrically conductive terminal pins are in-line.

4. The assembly of claim 1, wherein said multiple electrically conductive terminal pins are on a bolt circle.

5. The assembly of claim 1, wherein said supportive surface comprises a canister.

6. The assembly of claim 1, wherein said lower side of said discoidal capacitive device is bonded to said supportive surface by a nonconductive bonding and electrical connections are made by means of conductive polymers.

7. The assembly of claim 6, wherein said electrically conductive patterns included wire bondable pads for connection to circuitry in said implantable housing.

8. The assembly of claim 6, wherein said electrical component is a semiconductor and is attached to said upper side of said discoidal capacitive device by solder reflow.

9. The assembly of claim 6, wherein said electrical component is a multi-element passive component attached to said upper side of said discoidal capacitive device by epoxy bonding and conductive polyamide.

10. The assembly of claim 6, wherein said electrical component is a thick film resistor attached to said upper side of said discoidal capacitive device by firing.

11. The assembly of claim 6, wherein said electrical component is an inductor attached to said upper side of said discoidal capacitive device by firing.

12. The assembly of claim 1, wherein said header forms a portion of an outer surface of said implantable medical device.

13. The assembly of claim 12, wherein said header is connected to said implantable housing by welding.

14. The assembly of claim 12, wherein said header is connected to said implantable housing by brazing.

15. The assembly of claim 12, wherein said assembly is hermetically sealed within said implantable housing.

16. The assembly of claim 12, wherein said multiple electrically conductive terminal pins are hermetically sealed in said first opening through said header.

17. The assembly of claim 16, wherein said first ends of said multiple electrically conductive pins are external to said implantable housing.

18. A filtered feed-thru assembly for implantable medical devices, the assembly comprising:

(a) a header with a flange around the outer perimeter thereof for attachment to an implantable housing and a first set of openings through said header;

(b) electrically conductive pins disposed within and extending through said first set of openings, each of said pins having respective first and second ends;

(c) a discoidal capacitive device with an upper and lower surface, said device connected to said header, said device further comprising a first set of electrode plates arranged to be suitable for electrical parallel connections with said electrically conductive pins and a second set of electrode plates arranged to be suitable for electrical series connections with said electrically conductive pins, a second set of openings formed therethrough for passage of said pins, wherein said first set of openings in said header align with said second set of openings in said discoidal capacitive device when bonded, and wherein said electrical connections are made by means of conductive polymers; and

(d) wherein electrically conductive patterns are disposed on said upper side of said discoidal capacitor and an electrical component connected to said electrically conductive patterns.

19. The assembly of claim 18, further comprising electrically insulative supports for said electrically conductive pins, said insulative supports being disposed within said first set of openings in said header.

20. The assembly of claim 19, wherein said electrically insulative supports comprise a single multi-hole insulator.

21. The assembly of claim 18, wherein said electrically conductive pins comprise terminal pins.

22. The assembly of claim 18, wherein said electrically conductive pins are in-line.

23. The assembly of claim 18, wherein said electrically conductive pins are on a bolt circle.

24. The assembly of claim 18, wherein said header comprises a canister.

25. The assembly of claim 18, wherein said header comprises a portion of an outer surface of said implantable medical device.

26. The assembly of claim 25, wherein said header is connected to said implantable housing by welding.

27. The assembly of claim 25, wherein said header is connected to said implantable housing by brazing.

28. The assembly of claim 25, wherein said assembly is hermetically sealed within an opening in said implantable housing.

29. The assembly of claim 25, wherein said electrically conductive pins are hermetically sealed in said first set of openings through said header.

30. The assembly of claim 29, wherein said first ends of said electrically conductive pins are external to said implantable housing.

31. The assembly of claim 18, wherein said lower side of said discoidal capacitive device is bonded to said header by a nonconductive bonding and wherein electrical connections are made by means of conductive polymers.

32. The assembly of claim 31, wherein said electrically conductive patterns included wire bondable pads for connection to circuitry in said implantable housing.

33. The assembly of claim 31, wherein said electrical component is a semiconductor and is attached to said upper side of said discoidal capacitive device by solder reflow.

34. The assembly of claim 31, wherein said electrical component is a multi-element passive component attached to said upper side of said discoidal capacitive device by epoxy bonding and conductive polyamide.

35. The assembly of claim 31, wherein said electrical component is a thick film resistor attached to said upper side of said discoidal capacitive device by firing.

36. The assembly of claim 31, wherein said electrical component is an inductor attached to said upper side of said discoidal capacitive device by firing.

37. A filtered feed-thru assembly for implantable medical devices, the assembly comprising:

(a) a header having a supportive surface with a flange around the outer perimeter thereof and a first set of openings defined through said header, said header forming a portion of an outer surface of an implantable housing;

(b) multiple electrically conductive terminal pins disposed within and extending through said first set of openings, said terminal pins each having respective first and second ends and being hermetically sealed within said first set of openings through said header;

(c) electrically insulative supports for said multiple electrically conductive terminal pins, said insulative supports being disposed within said first set of openings;

(d) a discoidal capacitive device with a lower side bonded to said supportive surface of said header by a nonconductive bonding with electrical connections made by means of conductive polymers and an upper side opposite said lower side, such that electrically conductive patterns including wire bondable pads for connection to circuitry in said implantable housing are provided, said discoidal capacitive device comprising a first set of electrodes arranged to be suitable for parallel connections with said multiple terminal pins, and a second set of electrodes arranged to be suitable for series connections with said multiple terminal pins, and said discoidal capacitive device having a second set of openings formed therethrough for passage of said terminal pins, wherein said first set of openings through said header align with said second set of openings in said discoidal capacitive device when they are bonded; and

(e) an electrical component connected to said upper side of said discoidal capacitive device.

38. The assembly of claim 37, wherein said header is connected to said implantable housing by welding.

39. The assembly of claim 37, wherein said header is connected to said implantable housing by brazing.

40. The assembly of claim 37, wherein said assembly is hermetically sealed within said implantable housing.

41. The assembly of claim 40, wherein said first ends of said electrically conductive pins are external to said implantable housing.

42. The assembly of claim 37, wherein said electrically insulative supports comprise a single multi-hole insulator.

43. The assembly of claim 37, wherein said multiple electrically conductive terminal pins are in-line.

44. The assembly of claim 37, wherein said multiple electrically conductive terminal pins are on a bolt circle.

45. The assembly of claim 37, wherein said supportive surface is a canister.

46. The assembly of claim 37, wherein said electrical component is a semiconductor attached to said upper side of said discoidal capacitive device by solder reflow.

47. The assembly of claim 37, wherein said electrical component is a multi-element passive component attached to said upper side of said discoidal capacitive device by epoxy bonding and conductive polyamide.

48. The assembly of claim 37, wherein said electrical component is a thick film resistor attached to said upper side of said discoidal capacitive device by firing.

49. The assembly of claim 37, wherein said electrical component is an inductor attached to said upper side of said discoidal capacitive device by firing.