Multi-strand substrate for ball-grid array assemblies and method

CAFC
  • US 6,465,743 B1
  • Filed: 12/05/1994
  • Issued: 10/15/2002
  • Est. Priority Date: 12/05/1994
  • Status: Expired due to Term
First Claim
Patent Images

1. A method for assembling ball-grid array (BGA) packages, comprising the steps of:

  • providing a plurality of BGA substrates arranged in an N by M array within a printed circuit board having a thickness, wherein N and M are greater than or equal to 2, each of the plurality of BGA substrates having a plurality of bond posts on one side and a plurality of contact pads on an opposite side;

    attaching a semiconductor die to each of the plurality of BGA substrates, the semiconductor die having a plurality of bond pads;

    encapsulating the semiconductor die with an encapsulant;

    curing the encapsulant;

    attaching conductive solder balls to each of the plurality of contact pads; and

    dividing the N by M array into separate BGA packages, and wherein each of the separate BGA packages is substantially planar.

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