Deep infrared photodiode for a CMOS imager

• US 6,465,786 B1
• Filed: 09/01/1999
• Issued: 10/15/2002
• Est. Priority Date: 09/01/1999
• Status: Expired due to Term

• Current Assignee: Aptina Imaging Corporation (ON Semiconductor Corporation)
• Original Assignee: Micron Technology, Inc.
• Inventors: Rhodes, Howard E.
• Primary Examiner(s): Hannaher, Constantine
• Assistant Examiner(s): Gabor, Otilia
• Application Number:
  US09/388,193
• Time in Patent Office: 1,140 Days
• Field of Search: 250/338.4, 250/332, 250/349, 250/370.08
• US Class Current: 250/338.4
• CPC Class Codes: G01J 1/44 Electric circuits for command of an exposure part G03B7/02
• CPC Class Codes: H01L 27/14609 Pixel-elements with integrated switching, control, storage or amplification elements scanning details of imagers (circuitry of solid-state image sensors H04N25/00); circuitry of imagers H04N25/70
• CPC Class Codes: H01L 27/14632 Wafer-level processed structures
• CPC Class Codes: H01L 27/1464 Back illuminated imager structures
• CPC Class Codes: H01L 27/14649 Infrared imagers
• CPC Class Codes: H01L 27/14687 Wafer level processing
• CPC Class Codes: H01L 27/14689 MOS based technologies

Abstract

A photodiode photosensor for use in a CMOS imager exhibiting improved infrared response. The photosensor is a diode with an infrared sensitive silicide layer, such as an iridium silicide, formed on a doped substrate. The infrared sensitive silicide is highly sensitive to infrared radiation, especially in the deep infrared spectral range. A reflective layer may be used on the infrared sensitive silicide layer so that infrared radiation entering the diode from the bottom is reflected back to the photodiode. Also disclosed are processes for forming the photodiode.

Claims

1. A photosensor for use in an imaging device, said photosensor comprising:

a doped layer formed in a substrate;

an insulating layer formed over the doped layer;

a trench formed in said insulating layer over at least a portion of said doped layer;

an infrared sensitive silicide layer formed of a conductive material in said trench on at least a portion of the doped layer, said infrared sensitive silicide layer permitting image radiation to pass therethrough; and

a conductive layer formed on the sidewalls of said trench, said conductive layer being formed of the same conductive material used to form said infrared sensitive silicide layer.

2. The photosensor according to claim 1, further comprising a reflecting layer formed on the infrared sensitive silicide layer.

3. The photosensor according to claim 2, wherein the reflecting layer is selected from the group consisting of aluminum, tungsten, tungsten silicide, copper and platinum.

4. The photosensor according to claim 3, wherein the reflecting layer is platinum.

5. The photosensor according to claim 3, wherein the reflecting layer is aluminum.

6. The photosensor according to claim 1, wherein said infrared sensitive silicide layer is formed of iridium silicide.

7. The photosensor according to claim 1, wherein said infrared sensitive silicide layer is formed of platinum silicide.

8. The photosensor according to claim 1, wherein said infrared sensitive silicide layer is formed of palladium silicide.

9. The photosensor according to claim 1, wherein said infrared sensitive silicide layer is formed of osmium silicide.

10. The photosensor according to claim 1, wherein said infrared sensitive silicide layer is formed of rhodium silicide.

11. The photosensor according to claim 1, wherein said infrared sensitive silicide layer is formed of rhenium silicide.

12. The photosensor according to claim 1, wherein said infrared sensitive silicide layer is formed of ruthenium silicide.

13. The photosensor according to claim 1, wherein the doped layer is doped p-type.

14. The photosensor according to claim 1, wherein the conductive layer is removed from the upper surface of the insulating layer by chemical-mechanical-polishing.

15. A photosensor for use in an imaging device, said photosensor comprising:

a doped layer formed in a substrate;

an insulating layer formed over said doped layer;

a trench formed in said insulating layer over at least a portion of said doped layer;

an infrared sensitive silicide layer formed of a conductive material in said trench on at least a portion of the doped layer;

a conductive layer formed on the sidewalls of said trench, said conductive layer being formed of the same conductive material used to form said infrared sensitive silicide layer;

a doped region formed in said substrate spaced apart from said infrared sensitive silicide layer for receiving image charge transferred from said doped layer; and

a transfer gate formed in said substrate for gating image charge accumulated in said doped layer to said doped region.

16. The photosensor according to claim 15, wherein said infrared sensitive silicide layer is formed of iridium silicide.

17. The photosensor according to claim 15, wherein said infrared sensitive silicide layer is formed of platinum silicide.

18. The photosensor according to claim 15, wherein said infrared sensitive silicide layer is formed of palladium silicide.

19. The photosensor according to claim 15, wherein said infrared sensitive silicide layer is formed of osmium silicide.

20. The photosensor according to claim 15, wherein said infrared sensitive silicide layer is formed of rhodium silicide.

21. The photosensor according to claim 15, wherein said infrared sensitive silicide layer is formed of rhenium silicide.

22. The photosensor according to claim 15, wherein said infrared sensitive silicide layer is formed of ruthenium silicide.

23. The photosensor according to claim 15, wherein the doped layer is doped p-type.

24. The photosensor according to claim 15, wherein the conductive layer is removed from the upper surface of the insulating layer by chemical-mechanical-polishing.

25. The photosensor according to claim 15, wherein the doped region is doped to a second conductivity type.

26. The photosensor according to claim 25, wherein the second conductivity type is n-type.

27. The photosensor according to claim 15 further comprising a reflecting layer formed over the infrared sensitive silicide layer.

28. The photosensor according to claim 27, wherein the reflecting layer is selected from the group consisting of aluminum, tungsten, tungsten silicide, copper and platinum.

29. The photosensor according to claim 28, wherein the reflecting layer is platinum.

30. The photosensor according to claim 28, wherein the reflecting layer is aluminum.

31. A pixel sensor cell for use with an imaging device, said cell comprising:

a doped layer formed in a substrate;

an insulating layer formed over said doped layer;

a trench formed in said insulating layer over at least a portion of said doped layer;

an infrared sensitive silicide layer formed of a conductive material in said trench on at least a portion of the doped layer;

a conductive layer formed on the sidewalls of said trench, said conductive layer being formed of the same conductive material used to form said infrared sensitive silicide layer;

a doped region formed in said substrate spaced apart from said infrared sensitive silicide layer for receiving image charge transferred from said doped layer;

a transfer gate formed in said substrate for gating image charge accumulated in said doped layer to said doped region;

a reset transistor for periodically resetting said doped layer to a predetermined potential; and

an output transistor having a gate electrically connected to said doped layer for providing a signal representing image charge stored in said doped layer.

32. The pixel sensor according to claim 31, wherein said infrared sensitive silicide layer is formed of iridium silicide.

33. The pixel sensor according to claim 31, wherein said infrared sensitive silicide layer is formed of platinum silicide.

34. The pixel sensor according to claim 31, wherein said infrared sensitive silicide layer is formed of palladium silicide.

35. The pixel sensor according to claim 31, wherein said infrared sensitive silicide layer is formed of osmium silicide.

36. The pixel sensor according to claim 31, wherein said infrared sensitive silicide layer is formed of rhodium silicide.

37. The pixel sensor according to claim 31, wherein said infrared sensitive silicide layer is formed of rhenium silicide.

38. The pixel sensor according to claim 31, wherein said infrared sensitive silicide layer is formed of ruthenium silicide.

39. The pixel sensor according to claim 31, wherein the doped layer is doped p-type.

40. The pixel sensor according to claim 31, wherein the conductive layer is removed from the upper surface of the insulating layer by chemical-mechanical-polishing.

41. The pixel sensor according to claim 31, wherein the doped region is doped to a second conductivity type.

42. The pixel sensor according to claim 41, wherein the second conductivity type is n-type.

43. The pixel sensor according to claim 31 further comprising a reflecting layer formed over the infrared sensitive silicide layer.

44. The pixel sensor according to claim 43, wherein the reflecting layer is selected from the group consisting of aluminum, tungsten, tungsten silicide, copper and platinum.

45. The pixel sensor according to claim 44, wherein the reflecting layer is platinum.

46. The pixel sensor according to claim 44, wherein the reflecting layer is aluminum.

47. A CMOS imager comprising:

a doped layer formed in a substrate;

an insulating layer formed over said doped layer;

a trench formed in said insulating layer over at least a portion of said doped layer;

an array of pixel sensor cells formed in said doped layer, wherein each pixel sensor cell has a photodiode, said photodiode comprising an infrared sensitive silicide layer formed of a conductive material in said trench on at least a portion of the doped layer, and a conductive layer formed on the sidewalls of said trench, said conductive layer being formed of the same conductive material used to form said infrared sensitive silicide layer, each of said cells having a respective doped region for receiving and outputting image charge received from said doped layer; and

signal processing circuitry formed in said substrate and electrically connected to the array for receiving and processing signals representing image charge outputted by the array.

48. The CMOS imager according to claim 47, wherein the pixel sensor cells further comprise a reflecting layer on the infrared sensitive silicide layer.

49. The CMOS imager according to claim 48, wherein the reflecting layer is selected from the group consisting of aluminum, tungsten, tungsten silicide, copper and platinum.

50. The CMOS imager according to claim 49, wherein the reflecting layer is platinum.

51. The CMOS imager according to claim 49, wherein the reflecting layer is aluminum.

52. The CMOS imager according to claim 47, wherein said infrared sensitive silicide layer is formed of iridium silicide.

53. The CMOS imager according to claim 47, wherein said infrared sensitive silicide layer is formed of platinum silicide.

54. The CMOS imager according to claim 47, wherein said infrared sensitive silicide layer is formed of palladium silicide.

55. The CMOS imager according to claim 47, wherein said infrared sensitive silicide layer is formed of osmium silicide.

56. The CMOS imager according to claim 47, wherein said infrared sensitive silicide layer is formed of rhodium silicide.

57. The CMOS imager according to claim 47, wherein said infrared sensitive silicide layer is formed of rhenium silicide.

58. The CMOS imager according to claim 47, wherein said infrared sensitive silicide layer is formed of ruthenium silicide.

59. The CMOS imager according to claim 47, wherein the doped layer is doped p-type.

60. The CMOS imager according to claim 47, wherein the conductive layer is removed from the upper surface of the insulating layer by chemical-mechanical-polishing.

61. The CMOS imager according to claim 47, wherein the doped region is doped to a second conductivity type.

62. The CMOS imager according to claim 61, wherein the second conductivity type is n-type.

63. An integrated circuit imager comprising:

an array of pixel sensor cells formed in a substrate, wherein each pixel sensor cell has a photodiode, said photodiode comprising an iridium silicide layer on said substrate and a conductive iridium layer formed on the sidewalls of a trench formed in an insulating layer over said substrate;

signal processing circuitry formed in said substrate and electrically connected to the array for receiving and processing signals representing an image output by the array and for providing output data representing said image; and

a processor for receiving and processing data representing said image.

64. An integrated circuit imager comprising:

a CMOS imager, said CMOS imager comprising an array of pixel sensor cells formed in a doped layer on a substrate, wherein each pixel sensor cell has a photodiode, said photodiode comprising an infrared sensitive silicide layer formed of a conductive material in a trench formed in an insulating layer formed on said doped layer, said trench being formed over at least a portion of said doped layer; and

a conductive layer formed on the sidewalls of said trench, said conductive layer being formed of the same conductive material used to form said infrared sensitive silicide layer, each of said cells having a respective doped region for receiving and outputting image charge received from said doped layer, and signal processing circuitry formed in said substrate and electrically connected to the array for receiving and processing signals representing an image output by the array and for providing output data representing said image; and

a processor for receiving and processing data representing said image.

65. The circuit according to claim 64, wherein said infrared sensitive silicide layer is formed of iridium silicide.

66. The circuit according to claim 64, wherein said infrared sensitive silicide layer is formed of platinum silicide.

67. The circuit according to claim 64, wherein said infrared sensitive silicide layer is formed of palladium silicide.

68. The circuit according to claim 64, wherein said infrared sensitive silicide layer is formed of osmium silicide.

69. The circuit according to claim 64, wherein said infrared sensitive silicide layer is formed of rhodium silicide.

70. The circuit according to claim 64, wherein said infrared sensitive silicide layer is formed of rhenium silicide.

71. The circuit according to claim 64, wherein said infrared sensitive silicide layer is formed of ruthenium silicide.

72. A method of forming a photodiode for use in an imaging device, said method comprising the steps of:

forming a doped layer in a substrate;

forming an insulating layer over said doped layer;

forming an opening in said insulating layer to expose at least a portion of said doped layer;

forming a metal layer on said portion of said doped layer and also on sidewalls of said opening;

forming an infrared sensitive silicide layer from said metal layer; and

removing the unreacted metal by chemical mechanical polishing.

73. The method according to claim 72, wherein the doped layer forming step further comprises ion implantation of at least one dopant into the substrate.

74. The method according to claim 72, wherein the doped layer is doped to a first conductivity type.

75. The method according to claim 74, wherein the first conductivity type is p-type.

76. The method according to claim 74, wherein the first conductivity type is n-type.

77. The method according to claim 72, wherein the step of forming the metal layer comprises forming the metal layer using chemical vapor deposition.

78. The method according to claim 72, wherein the step of forming the metal layer comprises forming the metal layer using evaporation.

79. The method according to claim 72, wherein the step of forming the metal layer comprises forming the metal layer using sputtering.

80. The method according to claim 72, wherein the step of forming the infrared sensitive silicide layer comprises annealing the metal layer.

81. The method according to claim 80, wherein the annealing is carried out at a temperature within the range of approximately 300 to 800 degrees Celsius.

82. The method according to claim 72, wherein said metal layer is iridium.

83. The method according to claim 72, wherein said metal layer is platinum.

84. The method according to claim 72, wherein said metal layer is palladium.

85. The method according to claim 72, wherein said metal layer is osmium.

86. The method according to claim 72, wherein said metal layer is rhodium.

87. The method according to claim 72, wherein said metal layer is rhenium.

88. The method according to claim 72, wherein said metal layer is ruthenium.

89. The method according to claim 72, further comprising forming a reflective layer on the infrared sensitive silicide layer.

90. The method according to claim 89, wherein said reflecting layer is selected from the group consisting of aluminum, tungsten, tungsten silicide, copper and platinum.

91. A method of forming a photodiode for use in an imaging device, said method comprising the steps of:

forming a doped layer in a substrate having devices formed thereon and a protective layer over the devices;

removing at least a portion of the protective layer to expose a portion of the doped layer;

forming a metal layer on the exposed portion of the doped layer and also on sidewalls of a trench formed in said protective layer;

forming an infrared sensitive silicide layer from said metal layer; and

removing the unreacted metal by chemical-mechanical-polishing.

92. The method according to claim 91, wherein the doped layer is doped to a first conductivity type.

93. The method according to claim 92, wherein the doped layer forming step further comprises ion implantation of at least one dopant into the substrate.

94. The method according to claim 91, wherein the protective layer is a layer of silicon dioxide.

95. The method according to claim 91, wherein the step of removing the protective layer further comprises wet etching.

96. The method according to claim 91, wherein the step of removing the protective layer further comprises dry etching.

97. The method according to claim 91, wherein the doped layer is doped to a first conductivity type.

98. The method according to claim 97, wherein the first conductivity type is p-type.

99. The method according to claim 91, wherein the step of forming the metal layer comprises forming the metal layer using chemical vapor deposition.

100. The method according to claim 91, wherein the step of forming the metal layer comprises forming the metal layer using evaporation.

101. The method according to claim 91, wherein the step of forming the metal layer comprises forming the metal layer using sputtering.

102. The method according to claim 91, wherein the step of forming the infrared sensitive silicide layer comprises annealing the metal layer.

103. The method according to claim 102, wherein the annealing is carried out at a temperature within the range of approximately 300 to 800 degrees Celsius.

104. The method according to claim 91, wherein said metal layer is iridium.

105. The method according to claim 91, wherein said metal layer is platinum.

106. The method according to claim 91, wherein said metal layer is palladium.

107. The method according to claim 91, wherein said metal layer is osmium.

108. The method according to claim 91, wherein said metal layer is rhodium.

109. The method according to claim 91, wherein said metal layer is rhenium.

110. The method according to claim 91, wherein said metal layer is ruthenium.

111. The method according to claim 91, further comprising forming a reflecting layer over the infrared sensitive silicide layer.

112. The method according to claim 111, wherein said reflecting layer is selected from the group consisting of aluminum, tungsten, tungsten silicide, copper and platinum.

113. A method of forming a photodiode for use in an imaging device, said method comprising the steps of:

forming a doped layer in a substrate having devices formed thereon and a protective layer over the devices;

forming a trench in the protective layer, wherein the trench bottom exposes said doped layer;

forming a blocking layer on the sides of the trench;

forming a metal layer on the bottom and sides of the trench;

forming an infrared sensitive silicide layer from said metal layer; and

removing the unreacted metal by chemical-mechanical-polishing.

114. The method according to claim 113, wherein the doped layer is doped to a first conductivity type.

115. The method according to claim 113, wherein the step of removing the protective layer further comprises dry etching.

116. The method according to claim 113, wherein the step of removing the protective layer further comprises wet etching.

117. The method according to claim 113, wherein the photodiode is a p-n junction photodiode.

118. The method according to claim 113, wherein the step of forming the infrared sensitive silicide layer comprises annealing the metal layer at a temperature within the range of approximately 300 to 600 degrees Celsius.

119. The method according to claim 113, further comprising forming a reflective layer on the infrared sensitive silicide layer.

120. The method according to claim 113, wherein the blocking layer is a silicon nitride layer.

121. The method according to claim 113, wherein the blocking layer is a silicon dioxide layer.

122. The method according to claim 113, wherein said metal layer is iridium.

123. The method according to claim 113, wherein said metal layer is platinum.

124. The method according to claim 113, wherein said metal layer is palladium.

125. The method according to claim 113, wherein said metal layer is osmium.

126. The method according to claim 113, wherein said metal layer is rhodium.

127. The method according to claim 113, wherein said metal layer is rhenium.

128. The method according to claim 113, wherein said metal layer is ruthenium.

129. The method according to claim 113, further comprising forming a reflecting layer over the infrared sensitive silicide layer.

130. The method according to claim 129, wherein said reflecting layer is selected from the group consisting of aluminum, tungsten, tungsten silicide, copper and platinum.

131. A method of forming a photodiode for use in an imaging device, said method comprising the steps of:

forming a doped layer in a substrate;

forming an insulating layer on said substrate;

forming a trench in said insulating layer to said doped layer;

forming a conductive layer on sidewalls and on the bottom of said trench;

forming an infrared sensitive silicide layer with said conductive layer on at least a portion of said doped layer in said trench; and

removing the conductive layer from an upper surface of said insulating layer.

132. The method according to claim 131, wherein the doped layer forming step further comprises ion implantation of at least one dopant into the substrate.

133. The method according to claim 131, wherein the doped layer is doped to a first conductivity type.

134. The method according to claim 133, wherein the first conductivity type is p-type.

135. The method according to claim 133, wherein the first conductivity type is n-type.

136. The method according to claim 131, wherein said infrared silicide layer is iridium silicide.

137. The method according to claim 131, wherein said infrared silicide layer is platinum silicide.

138. The method according to claim 131, wherein said infrared silicide layer is palladium silicide.

139. The method according to claim 131, wherein said infrared silicide layer is osmium silicide.

140. The method according to claim 131, wherein said infrared silicide layer is rhodium silicide.

141. The method according to claim 131, wherein said infrared silicide layer is rhenium silicide.

142. The method according to claim 131, wherein said infrared silicide layer is ruthenium silicide.

143. The method according to claim 131, further comprising forming a reflecting layer on the infrared sensitive silicide layer.

144. The method according to claim 143, wherein said reflecting layer is selected from the group consisting of aluminum, tungsten, tungsten silicide, copper and platinum.

145. The method according to claim 131, wherein said infrared silicide layer is removed by chemical-mechanical-polishing.