Coaxial type signal line and manufacturing method thereof

• US 6,466,112 B1
• Filed: 12/27/1999
• Issued: 10/15/2002
• Est. Priority Date: 12/28/1998
• Status: Expired due to Fees

• Current Assignee: Dynamic Solutions International, Inc. (Divestco Inc)
• Original Assignee: Dynamic Solutions International, Inc. (Divestco Inc)
• Inventors: Kwon, Young-Se, Jeong, In-Ho
• Primary Examiner(s): Pascal, Robert
• Assistant Examiner(s): GLENN, KIMBERLY E
• Application Number:
  US09/472,584
• Time in Patent Office: 1,023 Days
• Field of Search: 333/243, 333/238, 333/246, 333/247, 333/248, 333/250
• US Class Current: 333/243
• CPC Class Codes: H01L 2223/6622 Coaxial feed-throughs in active or passive substrates
• CPC Class Codes: H01L 2223/6627 Waveguides, e.g. microstrip line, strip line, coplanar line
• CPC Class Codes: H01L 23/5225 Shielding layers formed together with wiring layers
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/1903 including wave guides
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H01P 11/005 Manufacturing coaxial lines
• CPC Class Codes: H01P 3/06 Coaxial lines
• CPC Class Codes: H05K 1/0221 Coaxially shielded signal lines comprising a continuous shielding layer partially or wholly surrounding the signal lines
• CPC Class Codes: H05K 1/0272 Adaptations for fluid transport, e.g. channels, holes
• CPC Class Codes: H05K 2201/09809 Coaxial layout reduction of cross-talk, noise or interference by printed shielding conductors for shielding around a single via or around a group of vias H05K1/0222
• CPC Class Codes: H05K 2201/09981 Metallised walls
• CPC Class Codes: H05K 2203/0733 Method for plating stud vias, i.e. massive vias formed by plating the bottom of a hole without plating on the walls

Abstract

Disclosed is a coaxial type signal line that solves problems associated with signal interference and the connection of signal lines that are generated in a radio frequency (RF) electrical system. A method for manufacturing the coaxial type signal line includes the steps of forming a groove on a substrate, forming a first ground line on a surface of the groove and a plain surface of the substrate, forming a first dielectric layer including dielectric material on the first ground line formed on the surface of the groove, forming a signal line on the first dielectric layer the signal line for transmitting signals, forming a second dielectric layer including dielectric material on the signal line and the first dielectric layer, and forming a second ground line on the first ground line and the second dielectric layer. Since the signal line in the signal line structure according to the present invention is electrically shielded by the first and second ground lines, interference between the signal line and other signal lines on the semiconductor substrate can be prevented, and accordingly, the signal lines may be designed compactly on a semiconductor substrate and the system size can be reduced.

Claims

1. A coaxial type signal line, comprising:

a substrate including a groove;

a first ground line formed on a surface of the groove and on a plain surface of the substrate;

a supporter formed on the first ground line formed on the surface of the groove;

a signal line, formed on the supporter, transmitting signals; and

a second ground line connected to the first ground line formed on the plain surface of the substrate, and enclosing a space surrounding the signal line,

wherein the second ground line has an open part in an upper portion.

5. The coaxial type signal line of claim 1, wherein the upper ground line has openings.

2. A coaxial type signal line, comprising:

an insulating substrate;

a first ground wall including at least one sacrificial metal layer and formed on the substrate;

a second ground wall including at least one sacrificial metal layer, formed on the substrate and separated in a distance from the first ground wall;

an upper ground line including at least one sacrificial metal layer and supported by the first and second ground walls; and

a signal line formed in the space that is surrounded by the insulating substrate, the first and second ground walls and the upper ground line, and electrically separated from the ground line and the first and second ground walls, wherein the signal line is formed on a dielectric supporter on the upper ground line.

3. The coaxial type signal line of claim 2, wherein the first and second ground walls have a multi layered structure that includes a first sacrificial metal layer, a first metal layer formed on the first sacrificial metal layer, a second metal layer formed on the first metal layer and having a narrower width than the first metal layer, a second sacrificial metal layer formed on the second metal layer, and a third and forth metal layers sequentially formed on the second metal layer, and a third and forth metal layers sequentially formed on the second sacrificial layer;

and;

the signal line has a supporting part including the first sacrificial layer, the first metal layer and the second metal layer, and a signal part including the second sacrificial layer and the third metal layer and having a wider width than the supporting part.

4. The coaxial type signal line of claim 3, wherein the sacrificial layers are formed of Ti and the metal layers are formed of Au.