Semiconductor package and manufacturing method thereof

  • US 6,469,398 B1
  • Filed: 03/21/2002
  • Issued: 10/22/2002
  • Est. Priority Date: 03/29/2001
  • Status: Active Grant
First Claim
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1. A semiconductor package, comprising:

  • a semiconductor chip including first and second electrodes disposed on a top side, and a third electrode disposed on a bottom side;

    a heat spreader bonded to the third electrode;

    first and second conductive leads electrically connected to the first and second electrodes through first and second conductive bonding members, respectively, the first and second leads respectively including foot portions, which laterally extend at lower ends of the first and second leads and are juxtaposed on a first side of the heat spreader; and

    an insulating sealing body arranged to embed and seal therein the semiconductor chip, the heat spreader, and portions of the first and second leads, which extend from the first and second bonding members to at least part of the foot portions, the heat spreader and the foot portions of the first and second leads having bottom faces, which are exposed on a bottom of the sealing body, and are disposed on substantially the same plane.

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