Low inductance four terminal capacitor lead frame

• US 6,473,291 B1
• Filed: 03/28/2001
• Issued: 10/29/2002
• Est. Priority Date: 03/16/1999
• Status: Expired due to Term

• Current Assignee: Greatbatch Limited (Greatbatch Incorporated)
• Original Assignee: GB Acquisition Co., Inc.
• Inventors: Stevenson, Robert A.
• Primary Examiner(s): Reichard, Dean A.
• Assistant Examiner(s): Thomas, Eric W.
• Application Number:
  US09/820,998
• Time in Patent Office: 580 Days
• Field of Search: 361/301--30, 361/302, 361/303, 361/304, 361/310-313, 361/306--30, 361/307, 361/308--30, 361/309, 361/321--32, 361/328-330, 361/807-810, 361/811, 361/782, 248/200, 439/73, 257/726-727
• US Class Current: 361/306.3
• CPC Class Codes: H01G 4/228 Terminals
• CPC Class Codes: H01G 4/232 electrically connecting two or more layers of a stacked or rolled capacitor
• CPC Class Codes: H05K 3/308 Adaptations of leads connectors to printed circuits H01R12/00
• CPC Class Codes: H05K 3/3426 characterised by the leads
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

A chip capacitor is conductively coupled to spaced-apart (i.e., non-conductively coupled) circuit traces of an integrated circuit to provide a four terminal network. The chip capacitor includes a casing of dielectric material having first and second sets of electrode plates disposed therein, a first conductive lead frame which is conductively coupled to the first set of electrode plates, and a second conductive lead frame which is conductively coupled to the second set of electrode plates. The first and second lead frames are, in turn, conductively coupled to the circuit traces so as to route the output (or input) current of an electronic device through the capacitor.

Claims

1. A capacitor conductively coupled to circuit traces of an integrated circuit to provide a four terminal network, the capacitor comprising:

a casing of dielectric material having first and second sets of electrode plates disposed therein;

a first metallization band disposed along one side of the casing and conductively coupled to the first set of electrode plates;

a second metallization band disposed along another side of the casing and conductively coupled to the second set of electrode plates;

a first conductive lead frame conductively coupled to the first metallization band, the first conductive lead frame including a first connector attachable to a first circuit trace of an integrated circuit, and a second connector attachable to a second circuit trace of the integrated circuit, such that the first conductive lead frame conductively couples the first circuit trace to the second circuit trace; and

a second conductive lead frame conductively coupled to the second metallization band, the second conductive lead frame including a first connector attachable to a third circuit trace of the integrated circuit, and a second connector attachable to a fourth circuit trace of the integrated circuit, such that the second conductive lead frame conductively couples the third circuit trace to the fourth circuit trace;

wherein at least one of the connectors for the conductive lead frames comprises a pin for through-hole mounting to the integrated circuit, and wherein at least one of the conductive lead frames includes additional connectors for attachment to a capacitor-supporting substrate, make no electrical connection to any point or circuit of the substrate.

2. The capacitor of claim 1, wherein the first and second sets of electrode plates are disposed within the casing in generally parallel relation, the first conductive lead frame lies generally perpendicular to the first set of electrode plates, and wherein the second conductive lead frame lies generally perpendicular to the second set of electrode plates.

3. The capacitor of claim 1, wherein one of the sets of electrode plates comprises ground electrode plates for the capacitor, the other set of electrode plates comprises active electrode plates for the capacitor, the conductive lead frame conductively coupled to said ground electrode plates is, in turn, conductively coupled to ground traces of the integrated circuit, and wherein the conductive lead frame conductively coupled to said active electrode plates is, in turn, conductively coupled to active traces of the integrated circuit.

4. A chip capacitor conductively coupled to spaced-apart, non-conductively coupled circuit traces of an integrated circuit to provide a four terminal network, the chip capacitor comprising:

a casing of dielectric material having first and second sets of electrode plates disposed therein;

a first metallization band disposed along one side of the casing and conductively coupled to the first set of electrode plates;

a second metallization band disposed along another side of the casing and conductively coupled to the second set of electrode plates;

a first conductive lead frame conductively coupled to the first metallization band, the first conductive lead frame including a first connector attachable to a first circuit trace of the integrated circuit, and a second connector attachable to a second circuit trace of the integrated circuit, such that the first conductive lead frame conductively couples the first circuit trace to the second circuit trace; and

a second conductive lead frame conductively coupled to the second metallization band, the second conductive lead frame including a first connector attachable to a third circuit trace of the integrated circuit, and a second connector attachable to a fourth circuit trace of the integrated circuit, such that the second conductive lead frame conductively couples the third circuit trace to the fourth circuit trace;

wherein at least one of the connectors for the conductive lead frames comprises a pin for through-hole mounting to the integrated circuit, a flush tab for substrate mounting onto the integrated circuit, fold under tabs for surface mounting onto the integrated circuit, or mounting tabs spaced from a capacitor-supporting surface of the integrated circuit.

5. The capacitor of claim 4, wherein the first and second sets of electrode plates are disposed within the casing in generally parallel relation, the first conductive lead frame lies generally perpendicular to the first set of electrode plates, and wherein the second conductive lead frame lies generally perpendicular to the second set of electrode plates.

6. The capacitor of claim 4, wherein one of the sets of electrode plates comprises ground electrode plates for the capacitor, the other set of electrode plates comprises active electrode plates for the capacitor, the conductive lead frame conductively coupled to said ground electrode plates is, in turn, conductively coupled to ground traces of the integrated circuit, and wherein the conductive lead frame conductively coupled to said active electrode plates is, in turn, conductively coupled to active traces of the integrated circuit.

7. A chip capacitor conductively coupled to spaced-apart, non-conductively coupled circuit traces of an integrated circuit to provide a four terminal network, the chip capacitor comprising:

a casing of dielectric material having first and second sets of electrode plates disposed therein;

a first metallization band disposed along one side of the casing and conductively coupled to the first set of electrode plates;

a second metallization band disposed along another side of the casing and conductively coupled to the second set of electrode plates;

a first conductive lead frame conductively coupled to the first metallization band, the first conductive lead frame including a first connector attachable to a first circuit trace of the integrated circuit, and a second connector attachable to a second circuit trace of the integrated circuit, such that the first conductive lead frame conductively couples the first circuit trace to the second circuit trace; and

a second conductive lead frame conductively coupled to the second metallization band, the second conductive lead frame including a first connector attachable to a third circuit trace of the integrated circuit, and a second connector attachable to a fourth circuit trace of the integrated circuit, such that the second conductive lead frame conductively couples the third circuit trace to the fourth circuit trace;

wherein at least one of the conductive lead frames includes additional connectors for attachment to a capacitor-supporting substrate, wherein the additional connectors make no electrical connection to any point or circuit of the substrate.