Heat sink dissipator for adapting to thickness change of a combination of a CPU and a CPU carrier

CAFC
  • US 6,476,484 B1
  • Filed: 08/08/2001
  • Issued: 11/05/2002
  • Est. Priority Date: 08/08/2001
  • Status: Expired due to Term
First Claim
Patent Images

1. A heat sink dissipater, comprising:

  • a retaining device having a pair of positioning columns formed on first two opposite sides, a pair of retaining edges formed on second two opposite sides, and a plurality of resilient legs extending inwards from said first or second two opposite sides, said retaining edges each being formed with a barb and said resilient legs each having a bent;

    a heat dissipater having a plurality of fins formed on a top surface and a plurality of a gaps between said fins, said resilient legs failing into said gaps when said retaining device is positioned on said heat dissipater in a first orientation or a second orientation orthogonal to said first orientation; and

    plurality of pads formed between fins on said top surface of said heat dissipater;

    wherein the bent of each resilient leg is placed on a pad when said retaining device is positioned on said heat dissipater in said first orientation, and each resilient leg is placed directly on said top surface when said retaining device is positioned on said heat dissipater in said second orientation.

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