Semiconductor microsystem embedded in flexible foil

• US 6,479,890 B1
• Filed: 08/31/2000
• Issued: 11/12/2002
• Est. Priority Date: 01/22/1998
• Status: Expired due to Term

• Current Assignee: III Holdings 1, LLC
• Original Assignee: Fraunhofer Gesellschaft Zur Foerderung Der Angewandten Forsching E.V.
• Inventors: Trieu, Hoc Khiem, Mokwa, Wilfried, Ewe, Lutz
• Primary Examiner(s): Flynn, Nathan J.
• Assistant Examiner(s): Wilson, Scott R
• Application Number:
  US09/600,515
• Time in Patent Office: 803 Days
• Field of Search: 257/415, 257/678, 438/50, 438/106, 438/121
• US Class Current: 257/678
• CPC Class Codes: H01L 2224/24137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 23/5387 Flexible insulating substrates H01L23/5388 takes precedence
• CPC Class Codes: H01L 24/24 of an individual high density interconnect connector
• CPC Class Codes: H01L 25/065 the devices being of a type provided for in group H01L27/00
• CPC Class Codes: H01L 25/0655 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/12044 OLED
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/18162 of a chip with build-up interconnect

Abstract

A microsystem comprises a flexible foil, a plurality of semiconductor elements embedded in said flexible foil, and a connection line arranged substantially on said flexible foil and used for electrically connecting at least two semiconductor elements. For producing the microsystem, electronic components are first integrated in a semiconductor layer provided on a wafer. Subsequently, the semiconductor areas which are not required between the electronic components are etched away, whereupon the flexible foil is applied. A connection line is then applied to the flexible foil so as to interconnect the individual semiconductor elements. Finally, the semiconductor is etched away from the back so as to obtain the microsystem in the case of which the individual semiconductor elements are mechanically connected only by the flexible foil but no longer by the semiconductor substrate.

Claims

1. A microsystem comprising:

a flexible foil;

a plurality of semiconductor elements embedded in said flexible foil, said flexible foil supporting the semiconductor elements without any rigid support being provided; and

at least one connection line arranged substantially on said flexible foil and used for electrically connecting at least two semiconductor elements;

wherein the flexible foil has a locally anisotropic stiffness of such a nature that the microsystem has locally different degrees of flexibility.

2. A microsystem according to claim 1, wherein the semiconductor elements are arranged with respect to said foil in such a way that the microsystem has locally different degrees of flexibility.

3. A microsystem according to claim 1, wherein the flexible foil is geometrically substructured in such a way that the microsystem has locally different degrees of flexibility.

4. A microsystem according to claim 1, wherein the semiconductor elements are at least twice as stiff as the flexible foil.

5. A microsystem according to claim 1, wherein at least some of the semiconductor elements consist of monocrystalline silicon.

6. A microsystem according to claim 1, wherein the semiconductor elements are essentially flat and have dimensions of a few micrometres down to the submicrometre range at right angles to the flat side.

7. A microsystem according to claim 1, wherein the plurality of semiconductor elements includes passive and/or active electronic circuits.

8. A microsystem according to claim 1, wherein the plurality of semiconductor elements includes electromechanical microsensors and/or microactuators.

9. A microsystem according to claim 1, wherein the connection line is a conducting track between two semiconductor elements or a bus structure which connects a plurality of semiconductor elements.

10. A microsystem according to claim 1, wherein the flexible foil comprises a polymer material.

11. A microsystem according to claim 1, wherein the local stiffness of active regions is lower than that of neighbouring regions so as to implement a local sensitiveness of the microsystem to deformations.

12. A microsystem according to claim 1, wherein the semiconductor elements are accommodated in the flexible foil in such a way that they are enclosed by said flexible foil with the exception of a main surface, and wherein the connection line is applied to the foil and the semiconductor elements are contacted through via holes in the foil.

13. A microsystem according to claim 12, wherein an additional flexible foil is applied on top of the connection line in such a way that the connection line is arranged in a sandwich structure between the flexible foil, in which the semiconductor elements are embedded, and said additional flexible foil.

14. A microsystem according to claim 13 having a multilayered structure, wherein several connection line layers are separated by respective flexible foils, and wherein the semiconductor elements and the connection lines of individual layers are electrically connected to one another through via holes in respective flexible foils.

15. A microsystem comprising:

a flexible foil;

a plurality of semiconductor elements embedded in said flexible foil, said flexible foil supporting the semiconductor elements without any rigid support being provided; and

at least one connection line arranged substantially on said flexible foil and used for electrically connecting at least two semiconductor elements;

wherein the semiconductor elements are at least twice as stiff as the flexible foil.

16. A microsystem comprising:

a flexible foil;

a plurality of semiconductor elements embedded in said flexible foil, said flexible foil supporting the semiconductor elements without any rigid support being provided; and

at least one connection line arranged substantially on said flexible foil and used for electrically connecting at least two semiconductor elements;

wherein at least some of the semiconductor elements consist of monocrystalline silicon.

17. A microsystem comprising:

a flexible foil;

a plurality of semiconductor elements embedded in said flexible foil, said flexible foil supporting the semiconductor elements without any rigid support being provided; and

at least one connection line arranged substantially on said flexible foil and used for electrically connecting at least two semiconductor elements;

wherein the local stiffness of active regions of the microsystem is lower than the local stiffness of neighboring regions so as to implement a local sensitiveness of the microsystem to deformations.