Chip crack stop design for semiconductor chips

CAFC
  • US 6,495,918 B1
  • Filed: 09/05/2000
  • Issued: 12/17/2002
  • Est. Priority Date: 09/05/2000
  • Status: Expired due to Term
First Claim
Patent Images

1. A semiconductor chip, comprising:

  • a substrate; and

    a crack stop structure comprising;

    a first conductive line disposed over the substrate;

    at least two first contacts connected to the substrate and to the first conductive line, the at least two first contacts being spaced apart from each other and extending longitudinally along a length of the first conductive line;

    a second conductive line disposed over a portion of the first conductive line; and

    at least two second contacts connected to the first conductive line and the second conductive line, the at least two second contacts being spaced apart from each other and extending longitudinally along a length of the second conductive line; and

    wherein said first and second contacts are of substantially greater longitudinal dimension than lateral dimension.

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