Inexpensive, reliable, planar RFID tag structure and method for making same

  • US 6,509,217 B1
  • Filed: 10/22/1999
  • Issued: 01/21/2003
  • Est. Priority Date: 10/22/1999
  • Status: Expired due to Fees
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First Claim
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1. A process for making an RFID tag on a plastic or glass or plastic laminated to glass substrate, comprising the steps of:

  • 1) forming an antenna for an RFID tag on a plastic or glass or plastic laminated to glass substrate;

    2) using a flat panel display manufacturing machine or any machine capable of performing the same functions as a flat panel display manufacturing machine on a plastic, glass or plastic laminated to glass substrate to perform processing to form an integrated circuit RFID tag transceiver with an antenna port on a plastic or glass or plastic laminated to glass substrate; and

    3) electrically connecting said antenna port of said RFID tag transceiver to said antenna;

    wherein said step

         2) comprises;

    forming a first layer of insulating material on both surfaces of said substrate, said first layer of insulating material having a thickness and Young'"'"'s modulus which is selected in light of the thickness and Young'"'"'s modulus of said substrate so as to reduce differential strain to a level which will not cause failure of said substrate or any structure formed on said substrate at anticipated temperatures to be encountered in the future;

    forming a layer of amorphous semiconductor on said first layer of insulating material;

    forming gate insulator layer;

    forming layer of gate conductor material over said gate insulator layer;

    photolithographically etching to form the gate islands of one or more transistors to expose at least areas of said layer of amorphous semiconductor where source and drain doping is to occur;

    crystallizing and doping the amorphous silicon semiconductor to form source and drain regions for each transistor thereby leaving an undoped semiconductor region below each island;

    etching to form thin film transistor islands to isolate each transistor from the others;

    forming an insulating layer over all the transistors formed on said substrate and etching via holes therein to allow contacts to source and drain regions and the gate of each transistor;

    forming a layer of conductive material to fill all via holes and make electrical contact with said source, drain and gate structures of each transistor;

    etching said layer of conductive material to form the pattern of electrical connections between source, drain and gate structures of said transistors to form said RFID tag transceiver circuit and to form antenna contact leader lines;

    forming a layer of insulation over said pattern of electrical connections and forming via holes where contacts to said antenna contact leader lines can be made; and

    forming a conductive antenna pattern over said layer of insulation over said pattern of electrical connections so as to make electrical contact with said antenna contact leader lines.

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