Polishing pad having a grooved pattern for use in chemical mechanical polishing
CAFCFirst Claim
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1. A polishing pad for polishing a substrate in a chemical mechanical polishing system, comprising:
- a layer having a thickness between about 0.06 and 0.12 inches, one side of the layer providing a polishing surface and having a plurality of substantially circular grooves formed therein, the grooves having a depth between about 0.02 and 0.05 inches.
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Abstract
A polishing pad with a layer that provides a polishing surface. The layer has a thickness between about 0.06 and 0.12 inches, and a plurality of substantially circular grooves having a depth between about 0.02 and 0.05 inches are formed in the polishing surface.
102 Citations
20 Claims
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1. A polishing pad for polishing a substrate in a chemical mechanical polishing system, comprising:
a layer having a thickness between about 0.06 and 0.12 inches, one side of the layer providing a polishing surface and having a plurality of substantially circular grooves formed therein, the grooves having a depth between about 0.02 and 0.05 inches. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 18)
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13. A polishing pad for polishing a substrate in a chemical mechanical polishing system, comprising:
a polishing surface having a plurality of grooves, the grooves having a depth of 0.03 inches, a width of 0.02 inches, and a pitch between about 0.09 and 0.24 inches. - View Dependent Claims (14, 15, 16, 17, 19, 20)
Specification