Polishing pad having a grooved pattern for use in chemical mechanical polishing

CAFC
  • US 6,520,847 B2
  • Filed: 10/29/2001
  • Issued: 02/18/2003
  • Est. Priority Date: 05/15/1997
  • Status: Expired due to Fees
First Claim
Patent Images

1. A polishing pad for polishing a substrate in a chemical mechanical polishing system, comprising:

  • a layer having a thickness between about 0.06 and 0.12 inches, one side of the layer providing a polishing surface and having a plurality of substantially circular grooves formed therein, the grooves having a depth between about 0.02 and 0.05 inches.

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