Epoxy resin composition and semiconductor device

• US 6,521,354 B1
• Filed: 04/04/2001
• Issued: 02/18/2003
• Est. Priority Date: 08/06/1999
• Status: Expired due to Term

• Current Assignee: Sumitomo Bakelite Company Limited
• Original Assignee: Toray Industries Incorporated
• Inventors: Shimizu, Hiroo, Niwa, Katsuhiro, Tanaka, Masayuki
• Primary Examiner(s): Dawson, Robert
• Assistant Examiner(s): AYLWARD, DAVID E
• Application Number:
  US09/806,733
• Time in Patent Office: 685 Days
• Field of Search: 523/443, 525/523, 528/121, 257/788, 257/789, 257/793, 257/795, 428/620
• US Class Current: 428/620
• CPC Class Codes: C08K 3/36 Silica
• CPC Class Codes: C08L 63/00 Compositions of epoxy resins; Compositions of derivatives of epoxy resins
• CPC Class Codes: H01L 23/293 Organic, e.g. plastic
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: Y10T 428/12528 Semiconductor component

Abstract

An epoxy resin comprising (A) an epoxy resin, (B) a curing agent and (C) a filler, in which the epoxy resin (A) contains a bisphenol F-type epoxy compound (a), the filler (C) contains spherical silica and the filler (C) accounts for from 88 to 96% by weight of the resin composition, has good soldering heat resistance enough for high-temperature solder reflow and has good moldability. A semiconductor device encapsulated with the resin composition is useful for use in electronic appliances.

Claims

1. A epoxy resin composition comprising (A) an epoxy resin, (B) a curing agent and (C) a filler, which is characterized in that the epoxy resin (A) contains a bisphenol F-type epoxy compound (a) of the following chemical formula (I), that the filler (C) contains spherical silica:

wherein the proportion of the filler (C) is higher than 92% by weight but not higher than 96% by weight of the entire resin composition.

2. The epoxy resin composition as claimed in claim 1, which further contains a silane coupling agent (D).

3. The epoxy resin composition as claimed in claim 1, wherein the curing agent (B) contains a curing agent (b) of the following chemical formula (II) in an amount of about 90% by weight of the compound with m falling between 1 and 3:

4. The epoxy resin composition as claimed in claim 2, wherein the silane coupling agent (D) contains an amino group-containing silane compound (d) of the following chemical formula (III) or (IV) in which the amino groups are all secondary amino groups:

wherein R¹, R² and R³ each represent a monovalent hydrocarbon group having 1 to 30 carbon atoms;

R⁴ represents a divalent hydrocarbon group having from 1 to 20 carbon atoms; and

n indicates an integer of from 1 to 3;

5. The epoxy resin composition as claimed in claim 1 , wherein the particle size distribution of the filler (C) is such that particles not larger than 1 μ

m account for from 4 to 7% by weight and those not smaller than 30 μ

m account for from 20 to 23% by weight.

6. The epoxy resin composition as claimed in claim 1, wherein the proportion of bromine compounds and that of antimony compounds therein are both not higher than 0.03% by weight of the resin entire composition, and that the flame retardancy of the combustion test pieces formed of the epoxy resin composition to have a thickness of not larger than {fraction (1/16)} inches, evaluated according to the UL94 Standard, is V−

0.

7. A semiconductor device encapsulated with the epoxy resin composition of any of claims 1 to 5 and 6.