Multielement sound probe comprising a composite electrically conducting coating and method for making same

• US 6,522,051 B1
• Filed: 12/05/2000
• Issued: 02/18/2003
• Est. Priority Date: 06/05/1998
• Status: Expired due to Term

• Current Assignee: Thomson-CSF
• Original Assignee: Thomson-CSF
• Inventors: Seres, Nicolas, Nguyen, Ngoc-Tuan
• Primary Examiner(s): Ramirez, Nestor
• Assistant Examiner(s): MEDLEY, PETER M
• Application Number:
  US09/701,560
• Time in Patent Office: 805 Days
• Field of Search: 310/334, 310/336
• US Class Current: 310/336
• CPC Class Codes: B06B 1/0629 Square array

Abstract

The invention relates to a multielement acoustic probe comprising an acoustic support and an electrical circuit with conducting tracks connected to elementary piezoelectric transducers.

In addition, the probe comprises a film of composite conducting material placed between the piezoelectric transducers and the conducting tracks.

Conventionally, the piezoelectric transducers are subcut in order to obtain elements which are acoustically uncoupled and electrically coupled.

The presence of the film of composite conducting material favours the dimensioning of the track with respect to the subelements and constitutes an intermediate element with respect to the differences in thermal expansion between the acoustic support and the piezoelectric transducers.

Application: medical and underwater imaging.

Claims

1. An acoustic probe comprising:

a plurality of elementary transducers, wherein each of the elementary transducers comprises,

an electrical circuit, comprising at least one metal track,

piezoelectric subelements, wherein the piezoelectric subelements are mechanically separated and connected to the same track, and

a film of composite conducting material between the electrical circuit and the elementary transducers, wherein the piezoelectric subelements are mechanically separated by gaps extending into the film of composite conducting material.

2. The acoustic probe according to claim 1, further comprising an acoustic support called a backing, the film of composite material having acoustic properties similar to acoustic properties of the backing.

3. The acoustic probe according to claim 1, wherein the film of composite material comprises conducting particles, the particles having a size much less than the wavelength of the ultrasound wave generated by the probe.

4. The acoustic probe according to claim 1, wherein the composite conducting film is made of an organic material of an epoxy resin or polyimide type, comprising conducting particles.

5. The acoustic probe according to claim 4, wherein the conducting particles are particles of metal such as silver, copper or nickel.

6. The acoustic probe according to claim 5, wherein the film of composite material has a conducting filler content of between 50% and 30% by volume.

7. The acoustic probe according to claim 1, wherein the thickness of the film of composite material is in the region of several tens of microns.

8. The acoustic probe according to claim 1, wherein the elementary transducers are electrically separated by gaps extending right into the electrical circuit.

9. The acoustic probe according to claim 1, wherein the electrical circuit is mechanically separated by gaps extending into an electrical circuit layer.

10. A process for fabricating an acoustic probe comprising a plurality of elementary transducers, wherein each of the elementary transducers comprises an electrical circuit, comprising at least one metal track, piezoelectric subelements, wherein the piezoelectric subelements are mechanically separated and connected to the same track, and a film of composite conducting material between the electrical circuit and the elementary transducers, wherein the piezoelectric subelements are mechanically separated by gaps extending into the film of composite conducting material, the process comprising:

assembling at least one plate of piezoelectric material, at least one film of composite conducting material, and at least one electrical circuit comprising metal tracks;

cutting the plate of piezoelectric material and the film of composite conducting material to define elementary piezoelectric transducers which are electrically separated; and

subcutting the elementary transducers and part of the film of composite material, to define piezoelectric subelements which are mechanically separated and electrically connected.

11. The process for fabricating an acoustic probe according to claim 10, wherein the cutting and subcutting steps are carried out with a diamond saw.

12. The process for fabricating an acoustic probe according to claim 10, wherein the cutting and subcutting steps are carried out simultaneously.

13. Fabrication process according to claim 10 further comprising:

placing the electrical circuit on a surface of an acoustic support; and

cutting into the acoustic support to define the elementary piezoelectric transducers.