Microelectromechanical mirror and mirror array

• US 6,533,947 B2
• Filed: 06/27/2001
• Issued: 03/18/2003
• Est. Priority Date: 02/07/2001
• Status: Expired due to Fees

• Current Assignee: Intel Corporation
• Original Assignee: Transparent Optical, Inc.
• Inventors: Marx, David Lambe, Nasiri, Steven, Smith, James H., Novack, Mitchell Joseph
• Primary Examiner(s): ALANKO, ANITA KAREN
• Application Number:
  US09/894,021
• Publication Number:
  US 20020131682A1
• Time in Patent Office: 629 Days
• Field of Search: 216/2, 216/24, 216/33, 438/29
• US Class Current: 216/2
• CPC Class Codes: B81B 3/0062 Devices moving in two or more dimensions, i.e. having special features which allow movement in more than one dimension
• CPC Class Codes: G02B 26/0841 the reflecting element being moved or deformed by electrostatic means

Abstract

Method for manufacturing microelectromechanical mirror and mirror array. Control electrodes and addressing circuitry are etched from a metallic layer deposited onto a reference layer substrate. Standoff-posts are etched from a subsequently deposited polyimide layer. A freely movable plate flexibly suspended from a plurality of electrostatic actuators that are flexibly suspended from a support frame is etched from an actuation layer substrate using a high aspect ratio etch. A mirror support post and surface are etched from a mirror substrate using a high aspect ratio etch. The mirror and actuation layer substrates are fusion bonded together. The reference and actuation layer substrates are bonded together and held apart by the standoff posts. A reflective metallic layer is deposited onto the mirror surface and polished. The mirror is etched from the mirror surface to free the microelectromechanical mirror. Mirror arrays are made by performing the aforementioned steps using standard IC processing techniques.

Claims

1. A method for manufacturing an electrostatically actuated plate, comprising:

depositing a plurality of control electrodes on a reference layer substrate;

depositing a plurality of standoff posts on the reference layer substrate;

etching an actuation layer from an actuation layer substrate, the actuation layer comprising a freely movable plate flexibly suspended from a plurality of electrostatic actuators that are flexibly suspended from a support frame; and

bonding the reference layer substrate to the actuation layer substrate so that the actuation layer substrate is held above the reference layer substrate by the plurality of standoff posts.

2. The method of claim 1, wherein the step of etching an actuation layer from an actuation layer substrate further comprises etching a plurality of pairs of torsional flexures in the actuation layer substrate to flexibly suspend each electrostatic actuator from the support frame by a respective pair of torsional flexures.

3. The method of claim 1, wherein the step of etching an actuation layer from an actuation layer substrate further comprises etching a plurality of torsional flexures in the actuation layer substrate to flexibly suspend the freely movable plate from the plurality of electrostatic actuators.

4. The method of claim 1, wherein the step of depositing a plurality of control electrodes on the surface of the reference layer substrate further comprises depositing a metallic layer on the surface of the reference layer substrate;

and etching the plurality of control electrodes from the metallic layer.

5. The method of claim 4, further comprising etching addressing circuitry out of the metallic layer deposited on the reference layer substrate to address the plurality of control electrodes formed thereon.

6. The method of claim 1, wherein the actuation layer substrate is etched with a high aspect ratio etch.

7. The method of claim 1, further comprising etching a plurality of divots in the surface of the reference layer substrate.

8. The method of claim 1, further comprising depositing a mechanical stopping layer on the surface of the reference layer substrate to electrically isolate the plurality of electrostatic actuators from the plurality control electrodes.

9. The method of claim 1, wherein the step of depositing the plurality of standoff posts on the surface of the reference layer substrate further comprises depositing a photoimageable layer on the surface of the reference layer substrate;

and etching the photoimageable layer to form the plurality of standoff posts.

10. The method of claim 9, wherein the photoimageable layer comprises a polyimide layer.

11. The method of claim 1, wherein the standoff posts serve as both a separation layer to hold the actuation layer substrate above the reference layer substrate, and as a bonding layer to bond the actuation layer substrate to the reference layer substrate.

12. The method of claim 1, wherein a low temperature bonding technique is used to bond the reference layer substrate to the actuation layer substrate.

13. The method of claim 12, wherein the low temperature bonding technique is chosen from the group consisting of solder bonding, eutectic bonding, polymeric bonding, and thermo-compression bonding.

14. The method of claim 1, wherein one or more of the reference and actuation layer wafers are chosen with low total thickness variations.

15. A method for manufacturing a microelectromechanical mirror, comprising:

depositing a plurality of control electrodes on a reference layer substrate;

depositing a plurality of standoff posts on the reference layer substrate;

etching an actuation layer from an actuation layer substrate, the actuation layer comprising a freely movable plate flexibly suspended from a plurality of electrostatic actuators that are flexibly suspended from a support frame;

etching a mirror support post from a mirror layer substrate;

bonding the freely moveable plate in the actuation layer substrate to the mirror support post in the mirror layer substrate;

bonding the reference layer substrate to the actuation layer substrate so that the actuation layer substrate is held above the reference layer substrate by the plurality of standoff posts;

depositing a reflective layer on the surface of the mirror layer substrate; and

etching through the reflective layer and the mirror layer substrate to release the microelectromechanical mirror.

16. The method of claim 15, wherein the step of etching an actuation layer from an actuation layer substrate further comprises etching a plurality of pairs of torsional flexures in the actuation layer substrate to flexibly suspend-each electrostatic actuator from the support frame by a respective pair of torsional flexures.

17. The method of claim 15, wherein the step of etching an actuation layer from an actuation layer substrate further comprises etching a plurality of torsional flexures in the actuation layer substrate to flexibly suspend the freely movable plate from the plurality of electrostatic actuators.

18. The method of claim 15, wherein the step of depositing a plurality of control electrodes on the reference layer substrate further comprises depositing a metallic layer on the surface of the reference layer substrate;

and etching the plurality of control electrodes from the metallic layer.

19. The method of claim 18, further comprising etching addressing circuitry out of the metallic layer deposited on the reference layer substrate to address the plurality of control electrodes formed thereon.

20. The method of claim 15, wherein the actuation layer substrate is etched with a high aspect ratio etch.

21. The method of claim 15, further comprising etching a plurality of divots in the surface of the reference layer substrate.

22. The method of claim 15, further comprising depositing a mechanical stopping layer on the surface of the reference layer substrate to electrically isolate the plurality of electrostatic actuators from the plurality of control electrodes.

23. The method of claim 15, wherein the plurality of standoff posts are made from a photoimageable material.

24. The method of claim 23, wherein the step of depositing a plurality of standoff posts on the surface of the reference layer substrate further comprises depositing a polyimide layer on the surface of the reference layer substrate;

and etching the polyimide layer to form the plurality of standoff posts.

25. The method of claim 15, wherein the standoff posts serve as both a separation layer to hold the actuation layer substrate above the reference layer substrate, and as a bonding layer to bond the actuation layer substrate to the reference layer substrate.

26. The method of claim 15, wherein a low temperature bonding technique is used to bond the reference layer substrate to the actuation layer substrate.

27. The method of claim 26, wherein the low temperature bonding technique is chosen from the group consisting of solder bonding, eutectic bonding, polymeric bonding, and thermo-compression bonding.

28. The method of claim 15, wherein one or more of the reference, actuation, and mirror layer wafers are chosen with low total thickness variations.

29. The method of claim 15, wherein the reflective layer deposited on the surface of the mirror layer substrate comprises a metallic layer.

30. The method of claim 15, wherein the step of bonding the mirror support post of the mirror layer substrate to the freely movable plate of the actuation layer substrate further comprises fusion bonding the mirror support post to the freely movable plate.

31. The method of claim 15, wherein the step of etching through the reflective layer and the mirror layer substrate to release the microelectromechanical mirror further comprises protecting the actuation layer from the release etch.

32. The method of claim 31, wherein the step of protecting the actuation layer from the release etch comprises one or more of the steps chosen from the group consisting of using the mirror surface as a protective etch mask, using a two step release etch, or using an oxide mask to protect the actuation layer.

33. The method of claim 15, further comprising:

etching a plurality of alignment marks in the actuation layer wafer;

etching a respective plurality of alignment bores in the mirror layer wafer; and

aligning the plurality of alignment marks in the actuation layer wafer with the respective plurality of alignment bores in the mirror layer wafer to bond the mirror support post in the mirror layer wafer with the freely movable plate in the actuation layer wafer.

34. A method of manufacturing a freely movable plate, comprising:

etching an actuation layer from an actuation layer substrate, the actuation layer comprising a freely movable plate flexibly suspended from a plurality of actuators that are flexibly suspended from a support structure;

forming a respective plurality of actuation means on a reference layer substrate to respectively actuate the plurality of actuators;

forming means for separating the actuation layer substrate from the reference layer substrate on one of the actuation layer substrate or the reference layer substrate; and

bonding the reference layer substrate to the actuation layer substrate so that the actuation layer substrate is separated from and held above the reference layer substrate by the separation means.

35. The method of claim 34, wherein the step of forming means for separating the actuation layer substrate from the reference layer substrate further comprises depositing a photoimageable layer on the surface of the reference layer substrate;

and etching the photoimageable layer to form a plurality of standoff posts.

36. The method of claim 35, wherein the photoimageable layer comprises a polyimide layer.

37. The method of claim 34, wherein the means for separating the reference layer substrate from the actuation layer substrate further comprise means for bonding the reference layer substrate to the actuation layer substrate.

38. The method of claim 34, wherein a low temperature bonding technique is used to bond the reference layer substrate to the actuation layer substrate.

39. The method of claim 38, wherein the low temperature bonding technique is chosen from the group consisting of solder bonding, eutectic bonding, polymeric bonding, and thermo-compression bonding.

40. The method of claim 34, further comprising forming addressing means on the reference layer substrate to selectively address the actuation means formed thereon.

41. The method of claim 34, wherein the plurality of actuators are chosen from among the group consisting of electrostatic, electromagnetic, piezoelectric, and thermal actuators.

42. The method of claim 34, wherein the actuation means for respectively actuating the plurality of actuators are chosen from among the group consisting of electrostatic, electromagnetic, piezoelectric, and thermal actuation means.

43. The method of claim 34, wherein the step of forming a plurality of actuation means on the reference layer wafer for respectively actuating the plurality of actuators comprises forming a plurality of rotation means for respectively rotating the plurality of actuators.

44. The method of claim 34, wherein the step of forming a plurality of actuation means on the reference layer wafer for respectively actuating the plurality of actuators comprises forming a plurality of translation means for respectively translating the plurality of actuators.

45. The method of claim 34, wherein the actuation layer substrate is etched with high aspect ratio etch.

46. A method for manufacturing a microelectromechanical mirror, comprising:

etching an actuation layer from an actuation layer substrate, the actuation layer comprising a freely movable plate flexibly suspended from a plurality of actuators that are flexibly suspended from a support structure;

forming a respective plurality of actuation means on a reference layer substrate to respectively actuate the plurality of actuators;

etching a mirror support post from a mirror layer substrate;

bonding the freely movable plate in the actuation layer substrate to the mirror support post in the mirror layer substrate;

forming means for separating the actuation layer substrate from the reference layer substrate on one of the actuation layer substrate or the reference layer substrate;

bonding the reference layer substrate to the actuation layer substrate so that the actuation layer substrate is separated from and held above the reference layer substrate by the separation means;

depositing a reflective layer on the surface of the mirror layer substrate; and

etching through the reflective layer and the mirror layer substrate to release the microelectromechanical mirror.

47. The method of claim 46, wherein the step of forming means for separating the actuation layer substrate from the reference layer substrate further comprises depositing a photoimageable layer on the surface of the reference layer substrate;

and etching the photoimageable layer to form a plurality of standoff posts.

48. The method of claim 46, wherein the photoimageable layer comprises a polyimide layer.

49. The method of claim 46, wherein the means for separating the reference layer substrate from the actuation layer substrate further comprise means for bonding the reference layer substrate to the actuation layer substrate.

50. The method of claim 46, wherein a low temperature bonding technique is used to bond the reference layer substrate to the actuation layer substrate.

51. The method of claim 50, wherein the low temperature bonding technique is chosen from the group consisting of solder bonding, eutectic bonding, polymeric bonding, and thermo-compression bonding.

52. The method of claim 46, further comprising forming addressing means on the reference layer substrate to selectively address the actuation means formed thereon.

53. The method of claim 46, wherein the plurality of actuators are from among the group comprising electrostatic, electromagnetic, piezoelectric, and thermal actuators.

54. The method of claim 46, wherein the actuation means for respectively actuating the plurality of actuators are respectively from among the group comprising electrostatic, electromagnetic, piezoelectric, and thermal actuation means.

55. The method of claim 46, wherein the step of forming a plurality of actuation means for respectively actuating the plurality of actuators comprises forming a plurality of rotation means for respectively rotating the plurality of actuators.

56. The method of claim 46, wherein the step of forming a plurality of actuation means for respectively actuating the plurality of actuators comprises forming a plurality of translation means for respectively translating the plurality of actuators.

57. The method of claim 46, wherein the actuation layer substrate is etched with high aspect ratio etch.

58. The method of claim 46, wherein the reflective layer deposited on the surface of the mirror layer substrate comprises a metallic layer.

59. The method of claim 46, wherein the step of bonding the mirror support post of the mirror layer substrate to the freely movable plate of the actuation layer substrate further comprises fusion bonding the mirror support post to the freely movable plate.

60. The method of claim 46, wherein one or more of the reference, actuation, and mirror layer wafers are chosen with low total thickness variations.

61. The method of claim 46, wherein the step of etching through the reflective layer and the mirror layer substrate to release the microelectromechanical mirror further comprises protecting the actuation layer from the release etch.

62. The method of claim 46, wherein the step of protecting the actuation layer from the release etch comprises one or more of the steps chosen from the group consisting of using the mirror surface as a protective etch mask, using a two step release etch, and using an oxide mask to protect the actuation layer.

63. The method of claim 46,

further comprising:

etching a plurality of alignment marks in the actuation layer wafer;

etching a respective plurality of alignment bores in the mirror layer wafer; and

aligning the plurality of alignment marks in the actuation layer wafer with the respective plurality of alignment bores in the mirror layer wafer to bond the mirror support post in the mirror layer wafer with the freely movable plate in the actuation layer wafer.

64. A method for manufacturing a microelectromechanical mirror array comprising a plurality of microelectromechanical mirrors, the method of manufacture comprising:

depositing a metallic layer on a reference layer substrate and forming an arrayed pattern comprising a plurality of control electrodes on the metallic layer;

forming an arrayed pattern comprising a plurality of standoff posts on the reference layer substrate;

etching an arrayed pattern of actuation layers from an actuation layer substrate, each actuation layer in the arrayed pattern comprising a freely movable plate flexibly suspended from a plurality of electrostatic actuators that are flexibly suspended from a support frame;

etching an arrayed pattern of mirror support posts from a mirror layer substrate;

bonding the actuation layer substrate to the mirror layer substrate so that the freely movable plates in the arrayed pattern of actuation layers are bonded to respective ones of the mirror support posts in the arrayed pattern of mirror support posts;

bonding the reference layer substrate to the actuation layer substrate so that the arrayed pattern of actuation layers is held above the arrayed pattern of control electrodes by the arrayed plurality of standoff posts;

depositing a reflective layer on the surface of the mirror layer substrate; and

etching in an arrayed pattern through the reflective layer and the mirror layer substrate to release the arrayed pattern of microelectromechanical mirrors in the microelectromechanical mirror array.

65. A method for manufacturing a microelectromechanical mirror array, comprising a plurality of microelectromechanical mirrors, the method comprising:

etching an arrayed pattern of actuation layers from an actuation layer substrate, each actuation layer in the arrayed pattern comprising a freely movable plate flexibly suspended from a plurality of actuators that are flexibly suspended from a support structure;

etching an arrayed pattern of mirror support posts from a mirror layer substrate;

bonding the actuation layer substrate to the mirror layer substrate so that the freely movable plates in the arrayed pattern of actuation layers are bonded to respective ones of the mirror support posts in the arrayed pattern of mirror support posts;

forming an arrayed pattern comprising a plurality of actuation means on a reference layer substrate to respectively actuate the arrayed plurality of actuators;

forming an arrayed means for separating the actuation layer substrate from the reference layer substrate on one of the actuation layer substrate or the reference layer substrate;

bonding the reference layer substrate to the actuation layer substrate so that the arrayed pattern of actuation layers are held above the arrayed pattern of actuation means by the arrayed pattern of separation means;

depositing a reflective layer on the surface of the mirror layer substrate; and

etching in an arrayed pattern through the reflective layer and the mirror layer substrate to release the arrayed plurality of microelectromechanical mirrors in the microelectromechanical mirror array.