Manufacturing system using solder self-alignment with optical component deformation fine alignment

• US 6,543,114 B2
• Filed: 03/08/2001
• Issued: 04/08/2003
• Est. Priority Date: 03/08/2001
• Status: Expired due to Term

• Current Assignee: Excelitas Technologies Corporation (Excelitas Technologies Holdings LLC)
• Original Assignee: Axsun Technologies Incorporated
• Inventors: Fitch, Eric E., Conover, Steven D., OʼConnor, Sean P., Atia, Walid A., Murdza, Randal A.
• Primary Examiner(s): Bryant, David P.
• Application Number:
  US09/802,731
• Publication Number:
  US 20020124375A1
• Time in Patent Office: 761 Days
• Field of Search: 294/45, 294/64, 294/68, 294/695, 294/070.1, 294/070.4, 294/070.5, 294/070.9, 294/071, 298/40, 228/180.22, 228/103, 228/105, 228/155
• US Class Current: 29/407.04
• CPC Class Codes: G02B 6/4226 Positioning means for moving the elements into alignment, e.g. alignment screws, deformation of the mount
• CPC Class Codes: G02B 6/4232 using the surface tension of fluid solder to align the elements, e.g. solder bump techniques flip-chip mounting techniques in assembly of semiconductor devices H01L24/81
• CPC Class Codes: G02B 6/4238 Soldering
• CPC Class Codes: H05K 2201/2036 Permanent spacer or stand-off in a printed circuit or printed circuit assembly pattern for applying drops or paste H05K2203/0545
• CPC Class Codes: H05K 2203/0186 Mask formed or laid on PCB, the mask having recesses or openings specially designed for mounting components or body parts thereof
• CPC Class Codes: H05K 3/303 Surface mounted components, e.g. affixing before soldering, aligning means, spacing means H05K3/32 takes precedence
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product
• CPC Class Codes: Y10T 29/49144 by metal fusion
• CPC Class Codes: Y10T 29/49769 Using optical instrument [excludes mere human eyeballing]
• CPC Class Codes: Y10T 29/49771 Quantitative measuring or gauging
• CPC Class Codes: Y10T 29/49778 with aligning, guiding, or instruction
• CPC Class Codes: Y10T 29/49861 Sizing mating parts during final positional association
• CPC Class Codes: Y10T 29/53174 Means to fasten electrical component to wiring board, base, or substrate
• CPC Class Codes: Y10T 428/24917 including metal layer

Abstract

A process for assembling micro-optical systems, such as optoelectronic and/or fiber optic components uses solder self-alignment to achieve a coarse, passive alignment of optical components relative to the optical bench. The fine, final alignment is performed using plastic deformation of the optical components to thereby improve the alignment of the optical components. As a result, the sub-micrometer alignment accuracies are attainable, if required.

Claims

1. A process for assembling micro optical systems, comprising:

depositing bond pads at locations on an optical benche determined by intended engagement points between optical components and the optical benche;

placing optical components on the bond pads;

performing a solder reflow process to join the optical components to the optical benche using the bond pads while allowing self alignment of the optical components that is initiated by solder surface tension; and

after solidification of the solder, improving alignment of the optical components by plastically deforming the optical components on the optical benche.

2. A process as claimed in claim 1, wherein the solder reflow process results in positioning of the optical components to an accuracy of between 2 and 10 micrometers.

3. A process as claimed in claim 1, wherein the step of improving the alignment comprises plastically deforming the optical components to align the optical components to better than a micrometer.

4. A process as claimed in claim 3, wherein the step of plastically deforming the optical components comprises directing optical signals at the optical components and deforming the optical components in response to the optical signals after interaction with the optical components.

5. A process as claimed in claim 1, further comprising depositing solder onto feet of the optical components.

6. A process as claimed in claim 1, further comprising positioning solder preforms between feet of the optical components and the bond pads of the bench.

7. A process as claimed in claim 1, wherein the step of placing the optical components on the bond pads comprises manually placing the optical components on the bond pads using vacuum wands.

8. A process as claimed in claim 1, wherein the step of placing the optical components on the bond pads comprises registering the optical components against registration features on the optical benche or on a template.

9. A process as claimed in claim 1, wherein the step of placing the optical components on the bond pads comprises placing the optical components using a pick-and-place machine.

10. A process as claimed in claim 1, further comprising tack bonding the optical components to the benche prior to the step of performing the solder reflow process.

11. A process as claimed in claim 1, further comprising fixturing the optical components to the optical benche with a magnetic field at least after the placing step.

12. A process as claimed in claim 1, wherein the step of plastically deforming the optical components comprises deforming the optical components in response to metrology data describing positions of the optical components relative to the benche and desired positions of the optical components.

13. A process as claimed in claim 1, wherein the solder pads comprise gold.

14. A process as claimed in claim 1, wherein the solder pads comprise tin.

15. A process as claimed in claim 1, wherein the solder pads comprise indium.

16. A process for assembling micro optical systems, comprising:

placing optical components on an optical benche;

registering the optical components against registration features on the optical benche or on a template;

joining the optical components to the optical benche; and

after the optical components have been joined to the optical benche, improving alignment of optical components by plastically deforming the optical components.

17. A process as claimed in claim 16, wherein the step of plastically deforming the optical components comprises directing optical signals at the optical components and deforming the optical components in response to the optical signals after interaction with the optical components.

18. A process as claimed in claim 16, wherein the step of joining the optical components comprises solder bonding the optical components to the optical benche.