High volume density polycrystalline diamond with working surfaces depleted of catalyzing material

• US 6,544,308 B2
• Filed: 08/30/2001
• Issued: 04/08/2003
• Est. Priority Date: 09/20/2000
• Status: Expired due to Term

• Current Assignee: Reedhycalog UK (National Oilwell Varco Incorporated)
• Original Assignee: Camco International (UK) Limited (Invinity Energy Systems Plc)
• Inventors: Griffin, Nigel Dennis, Hughes, Peter Raymond
• Primary Examiner(s): TURNER, ARCHENE A
• Application Number:
  US09/682,419
• Publication Number:
  US 20020034631A1
• Time in Patent Office: 586 Days
• Field of Search: 428/408, 428/469, 512/95, 513/07, 513/09
• US Class Current: 51/309
• CPC Class Codes: C04B 37/021 in a direct manner, e.g. direct copper bonding [DCB]
• CPC Class Codes: E21B 10/567 with preformed cutting elements mounted on a distinct support, e.g. polycrystalline inserts
• CPC Class Codes: Y10T 407/27 comprising tool of specific chemical composition
• CPC Class Codes: Y10T 428/12493 Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
• CPC Class Codes: Y10T 428/12625 Free carbon containing component
• CPC Class Codes: Y10T 428/24942 including components having same physical characteristic in differing degree
• CPC Class Codes: Y10T 428/26 Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
• CPC Class Codes: Y10T 428/265 1 mil or less
• CPC Class Codes: Y10T 428/30 Self-sustaining carbon mass or layer with impregnant or other layer

Abstract

Disclosed is a polycrystalline diamond or diamond-like element with greatly improved wear resistance without loss of impact strength. These elements are formed with a binder-catalyzing material in a high-temperature, high-pressure (HTHP) process. The PCD element has a body with a plurality of bonded diamond or diamond-like crystals forming a continuous diamond matrix that has a diamond volume density greater than 85%. Interstices among the diamond crystals form a continuous interstitial matrix containing a catalyzing material. The diamond matrix table is formed and integrally bonded with a metallic substrate containing the catalyzing material during the HTHP process. The diamond matrix body has a working surface, where a portion of the interstitial matrix in the body adjacent to the working surface is substantially free of the catalyzing material, and the remaining interstitial matrix contains the catalyzing material. Typically, less than about 70% of the body of the diamond matrix table is free of the catalyzing material.

Claims

1. A preform cutting element comprising a body of a superhard polycrystalline material comprising a plurality of bonded diamond crystals integrally formed with a metallic substrate, the diamond crystals having an average particle size substantially greater than 15 microns, a plurality of interstitial regions among the diamond crystals and a catalyzing material, the body having at least an 85% by volume diamond density and a cutting surface, wherein a first interstitial region adjacent to at least a portion of the cutting surface is substantially free of the catalyzing material and a second interstitial region in a portion of the body in contact with the substrate contains the catalyzing material, wherein the first interstitial region extends beneath the cutting surface at least about 0.1 mm and the second interstitial region has an average thickness greater than 0.15 mm.

2. The preform cutting element of claim 1, wherein the cutting element is mounted upon a cutting face of a fixed cutter rotary drill bit.

3. The preform cutting element of claim 1, wherein the cutting element is mounted upon a body of a rolling cutter drill bit.

4. The preform cutting element of claim 1, comprising a cutting element with the cutting surface adapted for use as a cutting insert in a machining operation.

5. The preform cutting element of claim 1 wherein the substrate comprises tungsten carbide cemented with an iron group binder material.

6. The preform cutting element of claim 1 wherein the first interstitial region extends beneath the cutting surface to a depth of at least an average diameter of the diamond crystals.

7. The preform cutting element of claim 1 wherein the first interstitial region extends beneath the cutting surface to a depth of between about 0.2 mm and about 0.3 mm.