Method and apparatus for separating semiconductor elements, and mounting method of semiconductor elements

• US 6,544,819 B2
• Filed: 06/11/2001
• Issued: 04/08/2003
• Est. Priority Date: 03/03/1999
• Status: Expired due to Fees

• Current Assignee: Hitachi, Ltd.
• Original Assignee: Hitachi, Ltd.
• Inventors: Odajima, Hitoshi, Matsuoka, Makoto, Futagi, Kazuyuki
• Primary Examiner(s): COLEMAN, WILLIAM D
• Assistant Examiner(s): Collins, D. M.
• Application Number:
  US09/877,007
• Publication Number:
  US 20010029064A1
• Time in Patent Office: 666 Days
• Field of Search: 438/118, 438/106, 438/110, 438/460, 438/464
• US Class Current: 438/118
• CPC Class Codes: H01L 21/67132 Apparatus for placing on an insulating substrate, e.g. tape
• CPC Class Codes: H01L 21/67144 Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
• CPC Class Codes: H01L 21/6835 using temporarily an auxiliary support
• CPC Class Codes: H01L 21/6836 Wafer tapes, e.g. grinding or dicing support tapes adhesive tapes in general C09J7/20
• CPC Class Codes: H01L 2221/68327 used during dicing or grinding
• CPC Class Codes: H01L 2221/6839 using peeling wedge or knife or bar
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/07811 Extrinsic, i.e. with electrical conductive fillers
• CPC Class Codes: Y10S 156/93 Semiconductive product delaminating, e.g. delaminating emiconductive wafer from underlayer
• CPC Class Codes: Y10T 156/11 Methods of delaminating, per se; i.e. , separating at bonding face

Abstract

A method and an apparatus wherein the thin semiconductor wafer is cut into a unit of a thin semiconductor element under the condition of being stuck on an adhesive sheet. A group of the semiconductor elements are removed from the adhesive sheet at high speed without incurring and breaking each semiconductor element thereof, and the semiconductor elements are picked up from the removed group of the semiconductor elements by a predetermined unit.

Claims

1. A mounting method of semiconductor elements, comprising:

a separation step for holding on a chuck a group of semiconductor elements as an object, being stuck on an adhesive sheet under a condition of a semiconductor wafer and cut out into a unit of the semiconductor element, and for striping said adhesive sheet from the group of semiconductor elements;

a convey step for carrying the semiconductor elements to a position to be mounted, by picking up the semiconductor element(s) from the group of semiconductor elements, being stripped with the adhesive sheet therefrom and held on the chuck, by a desired unit thereof; and

a mounting step for mounting the semiconductors carried in by said convey step into a tray or on a board to be mounted.

2. A mounting method of semiconductor elements comprising:

a separation step for holding on a chuck a group of semiconductor elements, by positioning an object, being stuck on an adhesive sheet which is fixed on a frame at periphery thereof, under condition of a semiconductor wafer and cut out into a unit of a semiconductor element, for cutting the adhesive sheet around the group of semiconductor elements being held, and for striping the cut adhesive sheet from said group of semiconductor elements being held;

a convey step for carrying the semiconductor elements to a position to be mounted, by picking up the semiconductor(s) element from the group of semiconductor elements, being stripped with the adhesive sheet therefrom and held on the chuck, by a desired unit thereof; and

a mounting step for mounting the semiconductor(s) carried in by said convey step in a tray or a board to be mounted.

3. A mounting method of semiconductor elements comprising:

separation step for holding on a chuck group of semiconductor elements as an object, being stuck on an adhesive sheet under condition of a semiconductor wafer and cut out into a unit of the semiconductor element under the condition of a semiconductor wafer, and for striping said adhesive sheet from the group of semiconductor elements under the condition of a semiconductor wafer

a pickup step for picking up the semiconductor element independently from the group of semiconductor elements being stripped with the adhesive sheet therefrom in said separating step and being held on the chuck;

a convey step for carrying the semiconductor elements to a position to be mounted by picking up the semiconductor element in said above pickup step; and

a mounting step for mounting the semiconductors carried in by said convey step into a tray or on a board to be mounted.

4. A separating method of semiconductor elements comprising:

a separation step for holding on a chuck group of semiconductor elements, by positioning an object stuck on an adhesive sheet which is fixed on a frame at periphery thereof, under condition of a semiconductor wafer and being Cut out into a unit of a semiconductor element under the condition of a semiconductor wafer, for cutting the adhesive sheet around the group of semiconductor elements being held, and for stripping the cut adhesive sheet from said group of semiconductor elements being held under the condition of a semiconductor wafer;

a pickup step for picking up the semiconductor element independently from the group of semiconductor elements being stripped with the adhesive sheet therefrom in said separating step and being held on the chuck;

a convey step for carrying the semiconductor elements to a position to be mounted by picking up the semiconductor element in said above pickup step; and

a mounting step for mounting the semiconductors carried in by said convey step into a tray or on a board to be mounted.