Circuit device and method of manufacturing the same
First Claim
Patent Images
1. A circuit device comprising:
- a plurality of conductive paths that are electrically isolated;
a circuit element having a front electrode fixed on a desired conductive path;
a metal connecting plate for connecting a back electrode of said circuit element with a desired conductive path; and
an insulating resin for covering said circuit element and integrally supporting said conductive paths.
5 Assignments
0 Petitions
Accused Products
Abstract
After a trench 54 is formed in a conductive foil 60, a circuit element is mounted in a flip chip method. Then, an insulating resin 50 is covered on the conductive foil 60 as a support substrate. After reversion, the conductive foil 60 is polished over the insulating resin 50 as a support substrate at this time to separate the conductive paths. Accordingly, a circuit device having the conductive paths 51 and the circuit elements 52 supported by the insulating resin 50 can be produced without employing the support substrate.
59 Citations
10 Claims
-
1. A circuit device comprising:
-
a plurality of conductive paths that are electrically isolated;
a circuit element having a front electrode fixed on a desired conductive path;
a metal connecting plate for connecting a back electrode of said circuit element with a desired conductive path; and
an insulating resin for covering said circuit element and integrally supporting said conductive paths. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
-
Specification