Method and apparatus of testing memory device power and ground pins in an array assembly platform
First Claim
1. A method of testing power pins in an electronic device comprising the acts of:
- (a) inserting a semiconductor device into a test socket, the semiconductor device having a plurality of power pins;
(b) providing a power signal to a fanout circuit, the fanout circuit comprising a plurality of switches and configured to receive a power signal and produce a plurality of outputs, each output providing the power signal to a respective one of the plurality of power pins on the electronic device through one of the plurality of switches when the one switch is in a first state;
(c) placing a first of the plurality of switches in the fanout circuit in a first state;
(d) placing the remaining of the plurality of switches in a second state; and
(e) reading a voltage at each of the power pins.
8 Assignments
0 Petitions
Accused Products
Abstract
An apparatus and technique for performing continuity tests of power and ground pins on a packaged integrated circuit. The technique includes using a first and second fanout circuit each including a number of signal paths. Each signal path includes a switch and corresponds to a power or ground socket on a board configured to hold a number of integrated circuit packages. The fanout circuits allow full device testing, as well as testing of individual pins. By controlling the state of the switches, power and ground may be selectively supplied to power and ground pins to check the continuity of the signals from the integrated circuit device within the package to the external pins provided to route the signal to an external device.
25 Citations
33 Claims
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1. A method of testing power pins in an electronic device comprising the acts of:
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(a) inserting a semiconductor device into a test socket, the semiconductor device having a plurality of power pins;
(b) providing a power signal to a fanout circuit, the fanout circuit comprising a plurality of switches and configured to receive a power signal and produce a plurality of outputs, each output providing the power signal to a respective one of the plurality of power pins on the electronic device through one of the plurality of switches when the one switch is in a first state;
(c) placing a first of the plurality of switches in the fanout circuit in a first state;
(d) placing the remaining of the plurality of switches in a second state; and
(e) reading a voltage at each of the power pins. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A method of testing ground pins in an electronic device comprising the acts of:
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(a) inserting a semiconductor device into a test socket, the semiconductor device having a plurality of ground pins;
(b) providing a ground signal to a fanout circuit, the fanout circuit comprising a plurality of switches and configured to receive a ground signal and produce a plurality of outputs, each output providing the ground signal to a respective one of the plurality of ground pins on the semiconductor device through one of the plurality of switches when the switch is in a first state;
(c) placing a first of the plurality of switches in the fanout circuit in a first state;
(d) placing the remaining of the plurality of switches in a second state; and
(e) reading a voltage at each of the ground pins. - View Dependent Claims (8, 9, 10, 11, 12)
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13. A method of verifying the continuity of a plurality of pins on an electronic package inserted in a test socket, the pins comprising a plurality of power pins and a plurality of ground pins, the method comprising the acts of:
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(a) enabling a power signal to only one of the plurality of power pins;
(b) measuring a voltage on each of the plurality of power pins;
(c) enabling a ground signal to only one of the plurality of ground pins; and
(d) measuring a voltage on each of the plurality of ground pins. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20, 21, 27)
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22. An apparatus for testing power and ground pins on an electronic package, the apparatus comprising:
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a socket board configured to couple a plurality of electronic packages to power source and a ground source, the electronic packages each comprising a plurality of power and ground pins;
a first fanout circuit comprising a plurality of switches, each of the plurality of switches, having a first node and a second node and providing an electrical path from the power source to a respective one of the plurality of power pins;
a second fanout circuit comprising a plurality of switches, each of the plurality of switches having a first node and a second node and providing an electrical path from the ground source to each of the plurality of ground pins; and
a control circuit configured to control each of the switches in the first fanout circuit and the second fanout circuit. - View Dependent Claims (23, 24, 25, 26, 28, 33)
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29. A test apparatus comprising:
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a test socket configured to couple an electronic device to a printed circuit board and to provide an electrical path for both parametric testing and power/ground verification;
a plurality of switches configured to transmit signals when the switches are in a first state;
a plurality of conductive traces coupled between each of the plurality of switches and the test socket; and
a control device configured to provide control of the plurality of switches. - View Dependent Claims (30, 31, 32)
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Specification