Module card and a method for manufacturing the same

• US 6,565,008 B2
• Filed: 12/04/2001
• Issued: 05/20/2003
• Est. Priority Date: 04/04/2000
• Status: Expired due to Fees

• Current Assignee: Kingpak Technology Inc.
• Original Assignee: Kingpak Technology Inc.
• Inventors: Liu, Joe, Ho, Mon Nan, Tu, Hsiu Wen, Chen, Wen Chuan, Feng, Kuo Feng, Chiu, Yung Sheng, Yeh, Nai Hua, Chen, Allis
• Primary Examiner(s): Pitts, Harold I.
• Application Number:
  US10/018,072
• Publication Number:
  US 20030071129A1
• Time in Patent Office: 532 Days
• Field of Search: 235/492, 361/799
• US Class Current: 235/492
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 23/49855 for flat-cards, e.g. credit cards cards per se G06K19/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

A manufacturing method of a module card comprises steps of: providing a base board having a golden finger; mounting a chip on the base board for electrically connecting to the golden finger; and forming a packing layer on the chip for forming the module card. A module card comprises: a base board; a chip mounting on a surface of the base board; a golden finger on the board and electrically connecting to the chip; and a packing layer forming on the chip for covering the chip.

Claims

1. A manufacturing method of a module card comprising steps of:

providing a base board having a golden finger;

mounting a chip on said base board for electrically connecting to said golden finger; and

forming a packing layer on said chip for forming said module card.

2. A manufacturing method according to claim 1 wherein said base board includes a first surface and a second surface for mounting a plurality of said chips on said first surface and said second surface.

3. A manufacturing method according to claim 1 wherein said base board includes a plurality of package areas for packing a plurality of said module cards once.

4. A manufacturing method according to claim 1 wherein said packing layer includes a material of epoxy mold compound.

5. A manufacturing method according to claim 1 wherein said base board is a circuit board, and said circuit board is a printed circuit board.

6. A module card comprising:

a base board;

a chip mounting on a surface of said base board;

a golden finger on said board and electrically connecting to said chip; and

a packing layer forming on said chip for covering said chip.

7. A module card according to claim 6 wherein said packing layer includes a material of epoxy mold compound.

8. A module card according to claim 6 wherein said surface of said base board includes a first surface and a second surface for packing a plurality of said chips.

9. A module card according to claim 6 wherein said module card is double sided.

10. A module card according to claim 6 wherein said base board is a circuit board, and said circuit board is a printed circuit board.