Module card and a method for manufacturing the same

  • US 6,565,008 B2
  • Filed: 12/04/2001
  • Issued: 05/20/2003
  • Est. Priority Date: 04/04/2000
  • Status: Expired due to Fees
First Claim
Patent Images

1. A manufacturing method of a module card comprising steps of:

  • providing a base board having a golden finger;

    mounting a chip on said base board for electrically connecting to said golden finger; and

    forming a packing layer on said chip for forming said module card.

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