Monitoring system for determining progress in a fabrication activity

• US 6,569,690 B1
• Filed: 08/31/2000
• Issued: 05/27/2003
• Est. Priority Date: 08/31/2000
• Status: Expired due to Term

• Current Assignee: Bell Semiconductor, LLC (Hilco Inc. (d/b/a Hilco Global))
• Original Assignee: Agere Systems Guardian Corp. (Broadcom, Inc.)
• Inventors: Kizilyalli, Isik C., McIntosh, John Martin, Vartuli, Catherine, Houge, Erik Cho, Stevie, Fred Anthony
• Primary Examiner(s): Powell, William A.
• Application Number:
  US09/653,364
• Time in Patent Office: 999 Days
• Field of Search: 438/8, 438/9, 438/14, 438/691, 438/692, 438/693, 438/745, 438/753, 156/345.LC, 156/345.LP, 216/38, 216/88, 216/89, 216/84
• US Class Current: 438/8
• CPC Class Codes: B24B 37/013 Devices or means for detecting lapping completion
• CPC Class Codes: B24B 37/042 operating processes therefor
• CPC Class Codes: B24B 49/04 involving measurement of the workpiece at the place of grinding during grinding operation

Abstract

Method for fabricating a structure. According to an exemplary embodiment, a structure is made by forming a layer of removable material with a first surface spaced a part from a second surface. The first surface is formed along a first region from which the material is removable. The first surface is altered by removal of material from the layer. Removed material from the first surface is monitored to detect fluctuations in a variable of composition in the layer, and removal of material from the first surface is terminated when the composition of monitored material meets a predetermined criterion. In an alternate embodiment a variable characteristic is imparted to a layer of material as a function of layer thickness and an operation is performed on the layer resulting in removal of material. Samples of removed material are monitored for variation in the characteristic and the operation is modified when a variation conforms with a criterion.

Claims

1. A method for making a structure, comprising:

forming a layer of removable material with a first surface spaced apart from a second surface, the first surface formed along a first region from which the material is removable;

altering the first surface by removal of material from the layer;

monitoring material removed from the first surface to detect fluctuations in composition; and

terminating removal of material from the first surface when the composition of monitored material meets a criterion.

2. The method of claim 1 wherein the step of monitoring removed material is performed by sequentially analyzing samples of the material for the presence of an isotope.

3. The method of claim 1 wherein the step of altering the first surface displaces the first surface relative to the second surface to reduce the thickness of the layer between the first and second surfaces.

4. The method of claim 3 wherein the removed material is monitored for variations in concentration of an isotope.

5. The method of claim 4 wherein the removal material is monitored for variations in the concentration of an isotope according to a digital sequence.

6. The method of claim 1 wherein the step of forming the layer of removable material is performed by depositing silicon oxide on a semiconductor structure.

7. The method of claim 6 wherein the criterion corresponds to presence of an isotope of Si.

8. Method for manufacturing comprising the steps of:

imparting a variable characteristic to a layer of material as a function of layer thickness;

performing an operation on the layer;

monitoring samples of the material for variation in the characteristic; and

modifying the operation when a variation conforms with a criterion.

9. Method of claim 8 wherein the step of modifying the operation terminates the operation when a variation is monitored.