Molding system with integrated film heaters and sensors

• US 6,575,729 B2
• Filed: 07/02/2002
• Issued: 06/10/2003
• Est. Priority Date: 06/12/1998
• Status: Expired due to Fees

• Current Assignee: Husky Injection Molding Systems Limited
• Original Assignee: Husky Injection Molding Systems Limited
• Inventors: Godwin, Harold, Olaru, George, Whiffen, David
• Primary Examiner(s): HEITBRINK, TIMOTHY W
• Application Number:
  US10/187,331
• Publication Number:
  US 20020182285A1
• Time in Patent Office: 343 Days
• Field of Search: 425/549, 425/570, 425/572
• US Class Current: 425/549
• CPC Class Codes: B29C 2045/2722 Nozzles or runner channels provided with a pressure sensor
• CPC Class Codes: B29C 2045/274 Thermocouples or heat sensors
• CPC Class Codes: B29C 2045/2741 Plurality of independent thermocouples or heat sensors
• CPC Class Codes: B29C 2045/2745 Film-like electrical heaters
• CPC Class Codes: B29C 2045/2746 Multilayered electrical heaters
• CPC Class Codes: B29C 45/02 Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
• CPC Class Codes: B29C 45/1603 Multi-way nozzles specially adapted therefor
• CPC Class Codes: B29C 45/2701 Details not specific to hot or cold runner channels B29C45/2725 takes precedence
• CPC Class Codes: B29C 45/2711 Gate inserts
• CPC Class Codes: B29C 45/2737 Heating or cooling means therefor B29C45/7331 takes precedence
• CPC Class Codes: B29K 2067/00 Use of polyesters or derivatives thereof, as moulding material

Abstract

Improved mold manifold and hot runner nozzle using thin film elements include at least one active or passive thin film element disposed along a melt channel between the manifold inlet and the hot runner nozzle. Preferably, the thin film element may comprise a thin film heater in direct contact with the molten resin and position to aid in the heat and flow management of the resin within the melt channel. Thin film temperature sensors, pressure sensors, and leak detectors may also be provided in the vicinity of the melt channel to enhance process control in the injection molding machine.

Claims

1. A heater for an injection molding runner nozzle, comprising:

a cylindrical, heat-conducting band substrate adapted to be placed over an outer surface of the nozzle;

a first dielectric layer directly deposited on an outer cylindrical surface of said band;

a conductive-ink resistive heating element directly deposited on said first dielectric layer, said heating element being formed in a pattern to apply heat through said band to the nozzle, said heating element having first and second ends, each said end having an electrical terminal; and

a second dielectric layer directly deposited over said heating element, but not over the terminals.

2. A heater according to claim 1, wherein said heating element is disposed in a spiral pattern.

3. A heater according to claim 1, further comprising first and second electrical contacts respectively coupled to said electrical terminals.

4. A heater according to claim 1, wherein said second dielectric layer comprises an electrically insulating and mechanically protective layer.