Apparatus and method for use in manufacturing a semiconductor device

  • US 6,576,063 B2
  • Filed: 01/24/2001
  • Issued: 06/10/2003
  • Est. Priority Date: 03/30/2000
  • Status: Expired due to Term
First Claim
Patent Images

1. A semiconductor manufacturing apparatus, comprising:

  • a reaction chamber in which one or more substrates to be processed are disposed;

    a plasma source arranged outside of and in proximity to the reaction chamber;

    an active species supply port for providing active species generated by the plasma source to the reaction chamber and arranged at a side of the reaction chamber; and

    an exhaust port provided at a substantially opposite side to the active species supply port, wherein the substrates are disposed between the active species supply port and the exhaust port and the active species flow substantially parallel to the surfaces of the substrates and wherein two or more substrates are simultaneously processed in the reaction chamber.

View all claims
    ×
    ×

    Thank you for your feedback

    ×
    ×