Liquid cooled circuit device and a manufacturing method thereof

• US 6,588,647 B2
• Filed: 08/27/2002
• Issued: 07/08/2003
• Est. Priority Date: 09/18/2001
• Status: Expired due to Fees

• Current Assignee: Hitachi, Ltd.
• Original Assignee: Hitachi, Ltd.
• Inventors: Saito, Ryuichi, Ogawa, Toshio, Nakamura, Takayoshi, Tamba, Akihiro, Okamura, Hisanori, Yamada, Kazuji
• Primary Examiner(s): TOLIN, GERALD P
• Application Number:
  US10/228,295
• Publication Number:
  US 20030053298A1
• Time in Patent Office: 315 Days
• Field of Search: 228/112.1, 228/114.5, 298/900.3, 165/80.3, 165/80.4, 165/185, 165/104.33, 165/168, 165/170, 363/141, 361/679, 361/699, 361/707-713, 361/715-722, 361/784, 257/713, 257/714
• US Class Current: 228/112.1
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 7/20872 Liquid coolant without phase change
• CPC Class Codes: H05K 7/20927 Liquid coolant without phase change
• CPC Class Codes: Y10T 29/49126 Assembling bases
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/4935 Heat exchanger or boiler making

Abstract

A liquid-cooled circuit device including: a module having a circuit element and a module base plate on surface of which the circuit element is mounted; a circuit case for accommodating the module; and a cooling liquid chamber for flowing a cooling liquid in contact with a back face of the module base plate of said module. The module base plate of the module is fitted into an opening provided in a member forming the cooling liquid chamber and welded without a gap.

Claims

1. A method for manufacturing a circuit device in which circuit elements are mounted on base plates and the base plates are fixed to other members of the circuit device, wherein said base plates and said other members are joined to each other by welding, using a friction stir welding method utilizing a plastic flow due to friction heat generated by rotation of a rotary tool.

2. The method for manufacturing a circuit device as claimed in claim 1, wherein all of said base plates and said other members contain the same metallic element.