Hermetic seal and method to create the same

  • US 6,589,625 B1
  • Filed: 08/01/2001
  • Issued: 07/08/2003
  • Est. Priority Date: 08/01/2001
  • Status: Active Grant
  • ×
    • Pin Icon | RPX Insight
    • Pin
First Claim
Patent Images

1. A micro-electromechanical systems based device package comprising:

  • a back plate glass;

    a substrate glass;

    a bead of an adhesive mixed with a zeolite applied between the back plate glass and the substrate glass; and

    a mirror processed on the substrate glass.

View all claims
  • 4 Assignments
    ×
    ×

    Thank you for your feedback

    ×
    ×