Flip chip metallization
First Claim
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1. An integrated circuit package comprising:
- a. an integrated circuit (IC) chip attached to a support substrate, b. an aluminum layer on the IC chip, the aluminum layer having a surface free of native oxide, c. a copper layer directly on the surface of the aluminum layer, d. a solder bump directly on the copper layer.
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Abstract
The specification describes techniques for applying under bump metallization (UBM) for solder bump interconnections on IC chips with Al bonding sites. The UBM of the invention comprises a copper layer applied directly to the aluminum bonding sites. Reliable bonds are obtained if the Al surface is a nascent surface. Such a surface can be provided by back sputtering an aluminum bonding site, or by a freshly sputtered aluminum layer. The copper layer is deposited on the nascent aluminum surface in e.g. a cluster tool without breaking vacuum. The UBM can be patterned using subtractive techniques.
17 Citations
1 Claim
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1. An integrated circuit package comprising:
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a. an integrated circuit (IC) chip attached to a support substrate, b. an aluminum layer on the IC chip, the aluminum layer having a surface free of native oxide, c. a copper layer directly on the surface of the aluminum layer, d. a solder bump directly on the copper layer.
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Specification