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Surface-mounted devices of light-emitting diodes with small lens

  • US 6,610,598 B2
  • Filed: 06/20/2002
  • Issued: 08/26/2003
  • Est. Priority Date: 11/14/2001
  • Status: Active Grant
First Claim
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1. Surface-mounted devices of light-emitting diodes with small lens, consisting of:

  • lead frame or substrate, with electric conducting electrode fitted on it;

    light-emitting chip, usually with D.C passing through its positive and negative electrodes to emit light of specific wavelength;

    electric conducting wire or material, used for connecting said light-emitting chip and said lead frame or substrate;

    encapsulating resin, used for protect said light-emitting chip and electric conducting wire or materials;

    with said electric conducting material or adhesive, fix said light-emitting chip on said lead frame or machine plate, then, connecting positive and negative electrodes of said light-emitting chip and electric conducting electrodes on said substrate by welding, next, with molding for encapsulating resin to wrap said light-emitting chip and electric conducting wires into SMD LED characterized with several small lens on surface, with this design to enhance brightness and centralize direction of light.

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