Shielded semiconductor leadframe package
First Claim
Patent Images
1. A semiconductor chip package comprising:
- a plurality of leadframe portions;
a semiconductor die mounted on at least one of the leadframe portions;
a shield element attached to at least one of the leadframe portions; and
a package mold surrounding the semiconductor die and the shield element;
wherein the leadframe portions comprise a plurality of leads, and wherein a surface of at least one of the leads is exposed at a lower surface of the package mold;
wherein the leadframe portions further comprise a die pad, and wherein a surface of the die pad is exposed at the lower surface of the package mold.
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Abstract
A semiconductor chip package includes a plurality of leadframe portions and a semiconductor die mounted on at least one of the leadframe portions. A shield element is attached to at least one of the leadframe portions. A package mold surrounds the semiconductor die and the shield element. Radiation shielding is thereby provided in a practical manner for a leadframe-based semiconductor chip package.
160 Citations
40 Claims
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1. A semiconductor chip package comprising:
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a plurality of leadframe portions;
a semiconductor die mounted on at least one of the leadframe portions;
a shield element attached to at least one of the leadframe portions; and
a package mold surrounding the semiconductor die and the shield element;
wherein the leadframe portions comprise a plurality of leads, and wherein a surface of at least one of the leads is exposed at a lower surface of the package mold;
wherein the leadframe portions further comprise a die pad, and wherein a surface of the die pad is exposed at the lower surface of the package mold. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A semiconductor chip package comprising:
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a plurality of leadframe portions;
a semiconductor die mounted on at least one of the leadframe portions;
a shield element attached to at least one of the leadframe portions; and
a package mold surrounding the semiconductor die and the shield element;
wherein the shield element comprises;
a substantially planar top surface; and
a plurality of substantially planar side surfaces, the side surfaces being joined to the top surface and to each other with rounded corners. - View Dependent Claims (12, 13, 14, 15, 16, 17)
a plurality of legs attached to the leadframe portions;
slots formed in the shield element between adjacent legs.
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13. The semiconductor chip package according to claim 11, wherein the shield element further comprises a plurality of legs, wherein individual legs have a recess formed therein and individual leadframe portions each include a protrusion engaged in the recess of a leg.
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14. The semiconductor chip package according to claim 11, wherein the shield element further comprises a plurality of legs, wherein individual legs have a protrusion formed therein and individual leadframe portions each include a recess, the protrusion of each leg being engaged in the recess of one of the leadframe portions.
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15. The semiconductor chip package according to claim 11, wherein the leadframe portions include opposing first and second surfaces, the second surfaces of the leadframe portions being exposed through the mold compound.
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16. The semiconductor chip package according to claim 11, wherein the leadframe portions include a die pad, the die pad having first and second surfaces, the second surface of the die pad being exposed through the mold compound.
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17. The semiconductor chip package according to claim 11, wherein the leadframe portions include leads and a die pad, the leads having opposing first and second surfaces and the die pad having opposing first and second surfaces, the second surfaces of the leads and the die pad being exposed through the mold compound.
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18. A semiconductor chip package comprising:
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a plurality of leadframe portions;
a semiconductor die mounted on at least one of the leadframe portions;
a shield element attached to at least one of the leadframe portions; and
a package mold surrounding the semiconductor die and the shield element;
wherein the shield element comprises;
a horizontal top surface; and
least one vertical side surface, the side surface being joined to the top surface with a rounded corner. - View Dependent Claims (19)
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20. A semiconductor chip package comprising:
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a plurality of leadframe portions;
a semiconductor die mounted on at least one of the leadframe portions;
a shield element attached to at least one of the leadframe portions; and
a package mold surrounding the semiconductor die and the shield element;
wherein the shield element comprises a plurality of legs attached to a corresponding plurality of the leadframe portions;
slots formed in the shield element between adjacent legs, the package mold filling the slots. - View Dependent Claims (21, 22, 23, 24, 25, 26)
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27. A semiconductor chip package comprising:
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a plurality of leadframe portions;
a semiconductor die mounted on at least one of the leadframe portions;
a shield element attached to at least one of the leadframe portions; and
a package mold surrounding the semiconductor die and the shield element;
wherein the shield element comprises a plurality of legs attached to a corresponding plurality of the leadframe portions;
wherein at least one the legs of the shield element comprises a convex lower surface, and wherein a corresponding one of the leadframe portions comprises a concave upper surface shaped to receive the convex lower surface of the leg.
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28. A semiconductor chip package, comprising:
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a leadframe having a die pad and a plurality of leads, the die pad having first and second surfaces and the leads having first and second surfaces;
a semiconductor die mounted on the first surface of the die pad and electrically connected to the leads;
a shield element mounted on the leads;
a mold compound surrounding the semiconductor die and the shield element, the second surfaces of the leads and the second surface of the die pad being exposed through the mold compound. - View Dependent Claims (29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39)
a substantially planar top surface; and
a plurality of substantially planar side surfaces, the side surfaces being joined to the top surface and to each other.
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30. The semiconductor chip package of claim 28, wherein a set of holes are formed in the shield element, the mold compound filling the holes.
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31. The semiconductor chip package of claim 28, wherein the shield element comprises a plurality of legs attached to a corresponding plurality of the leads.
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32. The semiconductor chip package of claim 31 wherein at least one of the legs of the shield element comprises a concave lower surface shaped to receive a corresponding one of the leads.
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33. The semiconductor chip package of claim 31 wherein at least one of the legs of the shield element comprises a convex lower surface, and wherein a corresponding one of the leads comprises a concave upper surface shaped to receive the convex lower surface of the leg.
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34. The semiconductor chip package of claim 28, wherein the semiconductor die is electrically connected to the die pad.
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35. The semiconductor chip package of claim 28, wherein the semiconductor die is electrically connected to the first surface of the leads by a set of bond wires.
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36. The semiconductor chip package according to claim 28, wherein the leadframe comprises diagonal members connected to the die pad, the shield element being attached to at least one of the diagonal members and to at least one of the leads.
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37. The semiconductor chip package according to claim 28, wherein the shield element further comprises a plurality of legs with slots formed in the shield element between adjacent legs, the legs being attached to the leadframe.
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38. The semiconductor chip package according to claim 28, wherein the shield element further comprises a plurality of legs, wherein individual legs have a recess formed therein and individual leads each include a protrusion engaged in the recess of a leg.
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39. The semiconductor chip package according to claim 28, wherein the shield element further comprises a plurality of legs, wherein individual legs have a protrusion formed therein and individual leads each include a recess, the protrusion of each leg being engaged in the recess of one of the leads.
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40. A semiconductor chip package, comprising:
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a leadframe having a set of leads, the leads having first and second surfaces;
a semiconductor die electrically connected to the first surfaces of the leads;
a shield element mounted on and electrically connected to the first surfaces of the leads;
a mold compound surrounding the semiconductor die, the shield element, and inner portions of the leads, wherein outer portions of the leads are exposed and extend from the mold compound;
wherein the semiconductor die is electrically connected to the first surfaces of the leads by a flip-chip connection.
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Specification