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Epoxy resin composition, prepreg, and roll made of resin reinforced with reinforcing fibers

  • US 6,620,510 B1
  • Filed: 06/25/2001
  • Issued: 09/16/2003
  • Est. Priority Date: 12/25/1998
  • Status: Expired due to Term
First Claim
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1. An epoxy resin composition having a water absorption rate of no greater than 3.5% by weight,wherein the water absorption rate is the water absorption rate of a resin board cured at 180°

  • C. for three hours to form a cured resin board of 2 mm thickness then cut into a 60 mm×

    12 mm×

    2 mm test piece and exposed to a saturated vapor at 150°

    C. for 60 hours.

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