Method of forming a capacitive element

• US 6,625,857 B2
• Filed: 02/01/2001
• Issued: 09/30/2003
• Est. Priority Date: 11/05/1998
• Status: Expired due to Fees

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Lauffer, John M., Appelt, Bernd K.
• Primary Examiner(s): Tugbang, A. Dexter
• Assistant Examiner(s): Kim, Paul D
• Application Number:
  US09/773,998
• Publication Number:
  US 20010005304A1
• Time in Patent Office: 971 Days
• Field of Search: 361/301.4, 361/323, 361/763, 361/762, 361/761, 361/312, 29/250.3, 29/254.1, 29/254.2, 29/171, 29/335, 295/921, 298/40, 298/32
• US Class Current: 29/25.42
• CPC Class Codes: H05K 1/0366 reinforced, e.g. by fibres, fabrics H05K1/036 takes precedence
• CPC Class Codes: H05K 1/162 incorporating printed capacitors
• CPC Class Codes: H05K 2201/0195 Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
• CPC Class Codes: H05K 2201/0209 Inorganic, non-metallic particles
• CPC Class Codes: H05K 2201/0355 Metal foils
• CPC Class Codes: H05K 2201/09309 Core having two or more power planes; Capacitive laminate of two power planes
• CPC Class Codes: H05K 3/429 Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
• CPC Class Codes: H05K 3/4641 having integrally laminated metal sheets or special power cores
• CPC Class Codes: Y10T 29/435 Solid dielectric type
• CPC Class Codes: Y10T 29/49002 Electrical device making
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49144 by metal fusion
• CPC Class Codes: Y10T 29/5102 Binding or covering and cutting

Abstract

A method of forming a capacitive element for a circuit board or chip carrier having improved capacitance is provided. The element is formed from a pair of conductive sheets having a dielectric component laminated therebetween. The dielectric component is formed of two or more dielectric sheets, at least one of which can be partially cured followed by being fully cured. The lamination takes place by laminating a partially cured sheet to at least one other sheet of dielectric material and one of the conductive sheets. The total thickness of the two sheets of the dielectric component does not exceed about 4 rolls and preferably does not exceed about 3 mils; thus, the single dielectric sheet does not exceed about 2 mils and preferably does not exceed about 1.5 mils in thickness.

Claims

1. A method of forming a capacitive element comprising the steps of:

selecting first and second sheets of electrically conducting material;

providing first and second layers of dielectric material between said sheets of electrically conducting material, each of said layers comprising a glass cloth impregnated with a thermoset resin, the resin in at least one of said layers being partially cured, each of said layers being no thicker than about 2 mils;

laminating at least one of said layers of impregnated glass cloth to one of said sheets of conducting material prior to the lamination of both of the sheets of conducting material to both sheets of glass cloth;

laminating said layers of dielectric material together and to the other sheet of conducting material, and

fully curing said layers of dielectric material to form a capacitive structure with a dielectric component having a thickness of less than about 4 mils.

2. The method as defined in claim 1 wherein each of said layers of glass cloth are laminated to one of said sheets of conducting material before the sheets of conducting material are laminated to both layers of glass cloth.

4. The method as defined in claim 1 wherein at least one of the layers of dielectric material is provided as a dry film.

5. The method as defined in claim 1 wherein a third layer of dielectric material is laminated between said first and second sheets of dielectric material.

6. The method as defined in claim 1 wherein said first and second layers of dielectric material are different materials.

3. The method as defined claim wherein the thermoset resin is an epoxy.

7. A method of forming a capacitive element comprising the steps of:

selecting first and second sheets of electrically conducting material;

providing first and second layers of dielectric material between said sheets of electrically conducting material, each of said layers being no thicker than about 2 mils;

coating at least one of the sheets with a layer of dielectric material comprising a thermoset resin;

partially curing the coated material;

laminating said layers of dielectric material together and to the other sheet of conducting material; and

fully curing the layers of dielectric material to form a capacitive structure with a dielectric component having a thickness of less than about 4 mils.

8. The method as defined claim 7 wherein the thermoset resin is an epoxy.

9. The method as defined in claim 7 wherein at least one of the layers of dielectric material is provided as a dry film.

10. The method as defined in claim 7 wherein a third layer of dielectric material is laminated between said first and second sheets of dielectric material.

11. The method as defined in claim 7 wherein said first and second layers of dielectric material are different materials.