Semiconductor package with improved thermal cycling performance, and method of forming same

• US 6,627,517 B1
• Filed: 11/17/2000
• Issued: 09/30/2003
• Est. Priority Date: 12/08/1999
• Status: Expired due to Term

• Current Assignee: Altera Corporation (Intel Corporation)
• Original Assignee: Altera Corporation (Intel Corporation)
• Inventors: Anderson, Sidney Larry, Cheah, Eng-Chew
• Primary Examiner(s): Niebling, John F.
• Assistant Examiner(s): LATTIN, CHRISTOPHER W
• Application Number:
  US09/715,362
• Time in Patent Office: 1,047 Days
• Field of Search: 438/118, 438/106, 438/107, 438/123, 438/124, 438/127, 438/455
• US Class Current: 438/455
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/2612 Auxiliary members for layer connectors, e.g. spacers
• CPC Class Codes: H01L 2224/274 by blanket deposition of the material of the layer connector
• CPC Class Codes: H01L 2224/2919 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/83192 wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/83193 wherein the layer connectors are disposed on both the semiconductor or solid-state body and another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/8385 using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 23/3121 a substrate forming part of the encapsulation
• CPC Class Codes: H01L 23/562 Protection against mechanical damage H01L23/02, H01L23/28 take precedence
• CPC Class Codes: H01L 24/29 of an individual layer connector
• CPC Class Codes: H01L 24/32 of an individual layer connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/83 using a layer connector
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/0665 : Epoxy resin
• CPC Class Codes: H01L 2924/07802 : not being an ohmic electrical conductor
• CPC Class Codes: H01L 2924/207 : Diameter ranges

Abstract

A semiconductor package includes a relatively thin substrate epoxy attached to a packaging substrate, such as a lead frame. A relatively thick semiconductor epoxy is attached to a semiconductor. The relatively thin substrate epoxy and the relatively thick semiconductor epoxy are attached to one another forming a stack including the packaging substrate, the relatively thin substrate epoxy, the relatively thick semiconductor epoxy, and the semiconductor. A housing encloses the stack.

Claims

1. A method of packaging a semiconductor, comprising:

applying a semiconductor epoxy to a semiconductor;

dispensing a substrate epoxy onto a packaging substrate; and

engaging said substrate epoxy with said semiconductor epoxy wherein said semiconductor epoxy is cured before it is engaged with said substrate epoxy.

2. The method of claim 1 wherein said applying includes applying a relatively thick layer of semiconductor epoxy to said semiconductor.

3. The method of claim 2 wherein said applying includes applying approximately 5 mils or more of semiconductor epoxy to said semiconductor.

4. The method of claim 1 wherein said applying includes applying said semiconductor epoxy to said semiconductor by spinning.

5. The method of claim 1 wherein said applying includes curing said semiconductor epoxy.

6. The method of claim 1 wherein said dispensing includes dispensing a relatively thin layer of substrate epoxy onto said packaging substrate.

7. The method of claim 6 wherein said dispensing includes dispensing approximately 2 mils or less of substrate epoxy onto said packaging substrate.

8. The method of claim 1 wherein said dispensing includes machine dispensing said substrate epoxy onto a lead frame.

9. The method of claim 1 wherein said dispensing results in a substrate epoxy layer and said applying results in a semiconductor epoxy layer that is approximately 2.5 times or more thicker than said substrate epoxy layer.

10. The method of claim 1 further comprising wire bonding said semiconductor to said packaging substrate.

11. The method of claim 10 further comprising enclosing said packaging substrate and said semiconductor in a housing.

12. The method of claim 11 wherein said housing is an injection molded plastic housing.

13. A method of packaging a semiconductor, comprising:

applying a layer of semiconductor epoxy to a semiconductor, said layer being more than 5 mils thick;

dispensing a substrate epoxy onto a packaging substrate; and

engaging said substrate epoxy with said semiconductor epoxy.

14. The method of claim 13 wherein said applying includes applying said semiconductor epoxy to said semiconductor by spinning.

15. The method of claim 13 wherein said applying includes curing said semiconductor epoxy.

16. The method of claim 13 wherein said dispensing includes machine dispensing said substrate epoxy onto a lead frame.

17. The method of claim 13 wherein said dispensing results in a substrate epoxy layer and said applying results in a semiconductor epoxy layer that is approximately 2.5 times or more thicker than said substrate epoxy layer.

18. A method of packaging a semiconductor, comprising:

dispensing a layer of substrate epoxy onto a packaging substrate, said layer being approximately 2 mils thick or less;

applying a semiconductor epoxy to a semiconductor; and

engaging said substrate epoxy with said cured semiconductor epoxy wherein said semiconductor epoxy is cured before it is engaged with said substrate epoxy.

19. The method of claim 18 wherein said dispensing includes machine dispensing said substrate epoxy onto a lead frame.

20. The method of claim 18 wherein said applying includes curing said semiconductor epoxy.