Microelectro-mechanical system actuator device and reconfigurable circuits utilizing same

• US 6,646,525 B2
• Filed: 06/20/2001
• Issued: 11/11/2003
• Est. Priority Date: 11/17/1997
• Status: Expired due to Term

• Current Assignee: Massachusetts Institute of Technology
• Original Assignee: Massachusetts Institute of Technology
• Inventors: Parr, Robert J., Drangmeister, Richard G., Kushner, Lawrence J., Bozler, Carl O.
• Primary Examiner(s): Summons, Barbara
• Application Number:
  US09/885,713
• Publication Number:
  US 20020030566A1
• Time in Patent Office: 874 Days
• Field of Search: 333/101, 333/33, 333/105, 333/202, 333/262, 333/263, 333/246, 336/10, 338/92, 338/96, 338/97, 338/200-202, 330/66, 361/277, 361/278, 361/281, 361/287, 361/292
• US Class Current: 333/246
• CPC Class Codes: B81B 2201/014 having a cantilever fixed on one side connected to one or more dimples
• CPC Class Codes: B81B 2203/0118 Cantilevers
• CPC Class Codes: B81B 3/0021 Transducers for transforming electrical into mechanical energy or vice versa dynamo-electric machines H02K99/00; electrostatic machines H02N1/00; piezoelectric devices H10N30/00
• CPC Class Codes: B81C 1/00214 Processes for the simultaneaous manufacturing of a network or an array of similar microstructural devices
• CPC Class Codes: H01G 5/18 due to change in inclination, e.g. by flexing, by spiral wrapping
• CPC Class Codes: H01G 5/40 Structural combinations of variable capacitors with other electric elements not covered by this subclass, the structure mainly consisting of a capacitor, e.g. RC combinations
• CPC Class Codes: H01H 2059/0081 with a tapered air-gap between fixed and movable electrodes
• CPC Class Codes: H01H 59/0009 making use of micromechanics
• CPC Class Codes: H01P 1/12 by mechanical chopper
• CPC Class Codes: H01P 1/20327 Electromagnetic interstage coupling
• CPC Class Codes: H01P 1/20363 Linear resonators
• CPC Class Codes: H01P 1/20381 Special shape resonators
• CPC Class Codes: H01P 1/2039 Galvanic coupling between Input/Output
• CPC Class Codes: H01P 5/04 with variable factor of coupling

Abstract

A microelectro-mechanical device which includes a fixed electrode formed on a substrate, the fixed electrode including a transparent, high resistance layer, and a moveable electrode formed with an anisotropic stress in a predetermined direction and disposed adjacent the fixed electrode. The device includes first and second electrically conductive regions which are isolated from one another by the fixed electrode. The moveable electrode moves to cover the fixed electrode and to electrically couple to the second conductive region, thus electrically coupling the first and second conductive regions, in response to a potential being applied across the fixed and moveable electrodes. The fixed electrode is transparent to electromagnetic signals or waves and the moveable electrode impedes or allows transmission of electromagnetic signals or waves.

Claims

1. A microelectric mechanical device comprising:

a fixed electrode formed on a substrate, said fixed electrode including an electrically conducting transparent, high resistance layer and is transparent to electromagnetic signals or waves;

a moveable electrode disposed adjacent said fixed electrode; and

a first and second electrically conductive regions which are isolated from one another by said fixed electrode, said moveable electrode being electrically coupled to said first conductive region, wherein said moveable electrode moves to cover said fixed electrode and to electrically couple to said second conductive region, thus electrically coupling said first and second conductive regions, in response to a potential being applied across said fixed and moveable electrodes.

2. The device of claim 1, wherein said fixed and moveable electrodes are configured within an array of similar devices.

3. The device of claim 2, wherein each device or groups of devices in said array are individually addressable to actuate said moveable electrodes.

4. The device of claim 1, wherein said potential is applied directly to said fixed and moveable electrodes.

5. The device of claim 1, wherein said potential is applied directly to said fixed electrode and capacitively to said moveable electrode via a second fixed electrode.

6. The device of claim 5, wherein said second fixed electrode comprises a transparent, high resistance layer.

7. The device of claim 1, wherein the electrical coupling between said moveable electrode and said second conductive region comprises a low resistance contact.

8. The device of claim 1, wherein said moveable electrode impedes transmission of electromagnetic signals or waves.

9. A microelectro-mechanical device comprising:

a fixed electrode formed on a substrate, said fixed electrode including an electrically conducting transparent, high resistance layer that is transparent to electromagnetic waves;

a moveable electrode disposed adjacent said fixed electrode; and

at least one insulating layer between said fixed electrode and said moveable electrode.

10. A microelectro-mechanical device comprising:

a fixed electrode formed on a substrate, said fixed electrode including an electrically conducting transparent, high resistance layer that is transparent to electromagnetic waves; and

a moveable electrode disposed adjacent said fixed electrode, wherein

said moveable electrode and said fixed electrode are isolated from each other by an insulating layer.

11. A microelectro-mechanical device comprising:

a fixed electrode formed on a substrate, said fixed electrode including an electrically conducting transparent, high resistance layer that is transparent to electromagnetic waves; and

a moveable electrode disposed adjacent said fixed electrode, wherein

said high resistance layer has a resistance higher than 1000 ohms per square.

12. A microelectro-mechanical device comprising:

a fixed electrode formed on a substrate, said fixed electrode including an electrically conducting transparent, high resistance layer that is transparent to electromagnetic waves; and

a moveable electrode disposed adjacent said fixed electrode, wherein

said fixed electrode is configured on an insulating layer,.

13. A microelectro-mechanical device comprising:

a fixed electrode formed on a substrate, said fixed electrode including an electrically conducting transparent, high resistance layer that is transparent to electromagnetic waves; and

a moveable electrode disposed adjacent said fixed electrode and, wherein

a layer of molybdenum is utilized as a release layer to configure said moveable electrode.

14. A microelectro-mechanical device in which a layer of molybdenum is utilized as a release layer to configure a moveable member, said layer of molybdenum has a thickness less than or equal to 3000 Å

and is etched away using hydrogen peroxide to form said release layer.

15. A method of fabricating a microelectro-mechanical device comprising:

providing a first layer of molybdenum on a substrate;

providing a second layer on said first layer; and

removing said first layer using hydrogen peroxide in a manner such that at least a portion of said second layer is moveable relative to said substrate.

16. The method of claim 15, wherein said first layer is patterned.

17. The method of claim 15, wherein said second layer is patterned.