Integrated circuit inductors

• US 6,646,534 B2
• Filed: 03/18/2002
• Issued: 11/11/2003
• Est. Priority Date: 07/09/1999
• Status: Expired due to Term

• Current Assignee: Micron Technology, Inc.
• Original Assignee: Micron Technology, Inc.
• Inventors: Ahn, Kie Y., Forbes, Leonard
• Primary Examiner(s): MAI, ANH T
• Application Number:
  US10/101,419
• Publication Number:
  US 20020101320A1
• Time in Patent Office: 603 Days
• Field of Search: 336/200, 336/223, 336/232
• US Class Current: 336/200
• CPC Class Codes: H01F 17/0033 with the coil helically wound around a magnetic core
• CPC Class Codes: H01F 27/2804 Printed windings
• CPC Class Codes: H01F 37/00 Fixed inductances not covered by group H01F17/00
• CPC Class Codes: H01L 27/08 including only semiconductor components of a single kind
• CPC Class Codes: Y10S 257/924 with passive device, e.g. capacitor, or battery, as integral part of housing or housing element, e.g. cap
• CPC Class Codes: Y10T 29/4902 Electromagnet, transformer or inductor
• CPC Class Codes: Y10T 29/49037 Using reference point/surface to facilitate measuring
• CPC Class Codes: Y10T 29/49069 Data storage inductor or core
• CPC Class Codes: Y10T 29/49071 by winding or coiling
• CPC Class Codes: Y10T 29/49073 by assembling coil and core
• CPC Class Codes: Y10T 29/49075 including permanent magnet or core

Abstract

An inductor comprises a plurality of interconnected conductive segments interwoven with a substrate. The inductance of the inductor is increased through the use of coatings and films of ferromagnetic materials such as magnetic metals, alloys, and oxides. The inductor is compatible with integrated circuit manufacturing techniques and eliminates the need in many systems and circuits for large off chip inductors. A sense and measurement coil, which is fabricated on the same substrate as the inductor, provides the capability to measure the magnetic field or flux produced by the inductor. This on chip measurement capability supplies information that permits circuit engineers to design and fabricate on chip inductors to very tight tolerances.

Claims

1. An inductor comprising:

a substrate having a plurality of surfaces wherein at least one of the plurality of surfaces is planarized and has a first coating, and wherein another one of the surfaces includes a second coating; and

a coil for generating a magnetic field that is substantially parallel to the planarized surface and penetrating the first and second coatings, the coil is partially embedded in the substrate.

2. The inductor of claim 1, wherein the one of the first and second coatings includes a magnetic material.

3. The inductor of claim 2, wherein the magnetic material is a magnetic oxide.

4. The inductor of claim 2, wherein one of the first and second coatings includes an insulator layer.

5. The inductor of claim 1, wherein the substrate comprises a semiconductor material.

6. An inductor comprising:

a substrate having a rectangular cross-section and four planar surfaces;

a first coating on one of the four planar surfaces;

a second coating on another one of the four planar surfaces; and

a coil at least partially surrounding the substrate for generating a magnetic field substantially parallel to each of the four planar surfaces and penetrating the first and second coatings.

7. The inductor of claim 6, wherein the coil is partially embedded in the substrate.

8. The inductor of claim 6, wherein the coating comprises a magnetic material.

9. The inductor of claim 8, wherein the coating includes an insulating layer.

10. The inductor of claim 6, wherein the coil is formed from two or more conducting materials.

11. The inductor of claim 6, wherein the coil comprises at least one of aluminum, copper and gold.

12. The inductor of claim 6, further including leads connected to the coil.

13. The inductor of claim 12, including a circuit connected to the leads.

14. An inductor comprising:

a substrate having a rectangular cross-section and four planar surfaces;

a coating on at least one of the four planar surfaces;

a coil at least partially surrounding the substrate and operable to generate magnetic field substantially parallel to each of the planar surfaces and that penetrates the coating; and

a sense coil formed on the substrate for sensing the magnetic field.

15. The inductor of claim 14, wherein the coil is partially embedded in the substrate.

16. The inductor of claim 14, wherein the coating comprises a magnetic material.

17. The inductor of claim 16, wherein the coating includes an insulating layer.

18. The inductor of claim 14, wherein the coil is formed from two or more conducting materials.

19. The inductor of claim 14, wherein the coil comprises at least one of aluminum, copper and gold.

20. The inductor of claim 14, further including leads connected to the coil.

21. The inductor of claim 20, including a circuit connected to the leads.

22. An inductor comprising:

a substrate having a first planar surface with a first magnetic film and a second planar with a second magnetic film;

a coil partially embedded in the substrate for generating a magnetic field substantially parallel to the first and second surfaces and penetrating the first and second magnetic films.

23. The inductor of claim 22, further including an insulating layer over one of the first and second magnetic films.

24. The inductor of claim 22, wherein the coil comprises first and second conductive segments, with the first conductive segments passing through the substrate.

25. The inductor of claim 22, wherein the coil has a rectangular cross-section.

26. The inductor of claim 22, wherein the coil has a triangular cross-section.

27. An inductor comprising:

a substrate having a plurality of surfaces including at least one planarized surface;

a first coating on one of the surfaces;

a second coating on another one of the surfaces;

a coil for generating a magnetic field substantially parallel to the at least one planarized surface and penetrating the first and second coatings; and

wherein the coil includes first conductive segments passing through the substrate from one surface to another.

28. The inductor of claim 27, further including second conductive segments exterior to the substrate that connect to the first conductive segments to form the coil.

29. The inductor of claim 28, wherein one of the first and second coatings includes at least one magnetic material.

30. The inductor of claim 29, wherein one of the first and second coatings further includes at least one insulating layer.

31. The inductor of claim 30, further including leads connected to the coil.

32. The inductor of claim 31, further including a circuit connected to the leads.

33. An inductor comprising:

a substrate with a first planar surface and a second surface;

a first coating formed upon the planar surface;

a second coating formed upon the second surface; and

a conductive path that passes through the substrate, the conductive path for generating a magnetic field that is substantially parallel to the first planar surface and that penetrates the coating penetrating the first and second coatings.

34. The inductor of claim 33, wherein one of the first and second coatings includes a magnetic film.

35. The inductor of claim 34, wherein the magnetic film includes nickel and iron.

36. The inductor of claim 33, wherein the conductive path has a triangular cross-section.

37. The inductor of claim 33, wherein the conductive path has a rectangular cross-section.

38. The inductor of claim 33, wherein the conductive path includes a section that passes over one of the first and second coatings.

39. An inductor comprising:

a substrate with a plurality of surfaces;

a coil having an inductance, the coil at least partially surrounding the substrate and a portion of the coil is embedded in the substrate;

a first coating atop the substrate formed on one of the surfaces, the first coating designed to increase the coil inductance;

a second coating formed on another one of the surfaces; and

a magnetic field formed by the coil that is substantially parallel to at least one of the plurality of surfaces and penetrating the first and second coatings.

40. The inductor of claim 39, wherein one of the first and second coatings includes a magnetic material.

41. The inductor of claim 40, wherein one of the first and second coatings further includes an insulating material.

42. The inductor of claim 41, wherein the substrate has a rectangular cross-section and four planar surfaces.

43. The inductor of claim 42, wherein the coil has a triangular cross-section.

44. An inductor comprising:

a semiconductor substrate having at least one planarized surface;

a first magnetic film formed atop one of the at least one planarized surface;

a second magnetic film formed on another surface of the substrate;

a first conductive path formed through the substrate; and

a second conductive path formed outside the substrate and connected to the first conductive path to form a coil for generating a magnetic field that is substantially parallel to the at least one planarized surface and penetrating the first and second magnetic films.

45. The inductor of claim 44, wherein one of the first and second magnetic films is covered by an insulating layer.

46. An inductor comprising:

a semiconductor substrate having at least one planarized surface;

a magnetic film formed atop one of the at least one planarized surface;

a first conductive path formed through the substrate;

a second conductive path formed outside of the substrate and connected to the first conductive path to form a coil operable for generating a magnetic field that is substantially parallel to the at least one planarized surface and that penetrates the magnetic film; and

a sense inductor formed on or within the substrate to sense the magnetic field generated by the coil.

47. The inductor of claim 46, wherein one of the first and second magnetic films is covered by an insulating layer.