Semiconductor device and method for fabricating same

  • US 6,653,731 B2
  • Filed: 02/15/2001
  • Issued: 11/25/2003
  • Est. Priority Date: 02/28/2000
  • Status: Active Grant
First Claim
Patent Images

1. A semiconductor device, comprisinga bare chip;

  • plural bumps provided on an active surface of said bare chip; and

    protective members formed on side surfaces and on said active surface of said bare chip between said plural bumps, wherein said side surfaces of said protective members are substantially perpendicular to said active surface and a reverse surface opposite to said active surface of said bare chip, end surfaces of said protective members formed on said side surfaces of said bare chip and said reverse surface of said bare chip are on a common plane, and a sum of a thickness of each of said protective members formed on said side surfaces of said bare chip and a width of said bare chip is more than 100 μ

    m.

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