In situ control with lubricant and tracking

  • US 6,656,023 B1
  • Filed: 09/20/2001
  • Issued: 12/02/2003
  • Est. Priority Date: 11/06/1998
  • Status: Expired due to Term
First Claim
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1. A method of finishing a tracked semiconductor wafer having a semiconductor wafer surface and a finishing cycle time, the method comprising the steps of:

  • providing the tracked semiconductor wafer having tracked information;

    providing a finishing element finishing surface;

    providing an organic lubricant to an operative finishing interface comprising the interface formed between the finishing element finishing surface and the semiconductor wafer surface;

    providing a finishing control subsystem having;

    at least three operative process sensors which include at least two operative friction sensors for sensing in situ process information;

    access to the tracked information; and

    a processor to evaluate the in situ process information and the tracked information;

    applying an operative finishing motion in the operative finishing interface forming in the operative finishing interface a uniform region having an organic lubrication and wherein the uniform region has a coefficient of friction; and

    changing a plurality of control parameters in response to an evaluation of both the in situ process information sensed with the at least three operative-process sensors and the tracked information, wherein changing the control parameters changes the coefficient of friction in the uniform region having the organic lubrication during at least a portion of the finishing cycle time.

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