Formation of an embedded capacitor plane using a thin dielectric

• US 6,657,849 B1
• Filed: 08/24/2000
• Issued: 12/02/2003
• Est. Priority Date: 08/24/2000
• Status: Expired due to Term

• Current Assignee: Mitsui Mining and Smelting Company Limited
• Original Assignee: Oak-Mitsui Inc. (Mitsui Mining and Smelting Company Limited)
• Inventors: Smith, Gordon, Zimmerman, Scott, Andresakis, John A., Skorupski, Edward C.
• Primary Examiner(s): Reichard, Dean A.
• Assistant Examiner(s): Ha, Nguyen T.
• Application Number:
  US09/644,959
• Time in Patent Office: 1,195 Days
• Field of Search: 361/311, 361/312, 361/303, 361/308, 361/309, 361/310, 361/304, 361/305, 361/318, 361/306.1, 361/306.3, 361/313, 361/321.1
• US Class Current: 361/311
• CPC Class Codes: H05K 1/162 incorporating printed capacitors
• CPC Class Codes: H05K 2201/0195 Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
• CPC Class Codes: H05K 2201/0209 Inorganic, non-metallic particles
• CPC Class Codes: H05K 2201/0355 Metal foils
• CPC Class Codes: H05K 2201/09309 Core having two or more power planes; Capacitive laminate of two power planes
• CPC Class Codes: H05K 3/146 By vapour deposition

Abstract

A capacitor, which has a pair of conductive foils each having a dielectric layer on its surface, wherein the dielectric layers are attached to one another. In one process for its production, a capacitor is formed by applying a first dielectric layer onto a surface of a first conductive foil; applying a second dielectric layer onto a surface of a second conductive foil; and then attaching the first and second dielectric layers to one another. The resulting capacitor exhibits excellent void resistance.

Claims

1. A capacitor, which is comprised of a pair of electrically conductive foils comprising a copper substrate and a metal layer on a surface of the copper substrate which metal layer comprises nickel, a pair of dielectric layers, one dielectric layer being on a surface of each of the metal layers and substantially the entirety of the dielectric layers being attached to one another.

2. The capacitor of claim 1 wherein the dielectric layers have a dielectric strength of at least about 2000 volts per mil thickness.

3. The capacitor of claim 1 wherein the dielectric layers comprise a material selected from the group consisting of thermosetting polymers, thermoplastic polymers, inorganic materials, and combinations thereof.

4. The capacitor of claim 1 wherein the dielectric layers comprise a material selected from the group consisting of epoxies, polyesters, polyester containing copolymers, polyarylene ethers, fluorinated polyarylene ethers, polyimides, benzocyclobutenes, liquid crystal polymers, allylated polyphenylene ethers, amines, and combinations thereof.

5. The capacitor of claim 1 wherein at least one of the dielectric layers comprises about 100% of an inorganic material.

6. The capacitor of claim 1 wherein at least one of the dielectric layers comprises about 100% of an inorganic material selected from the group consisting of ceramics, barium titanate, boron nitride, aluminum oxide, silica, strontium titanate, barium strontium titanate, quartz, and combinations thereof.

7. The capacitor of claim 1 wherein the composition of at least one of the dielectric layers is comprised of a polymer and a filler.

8. The capacitor of claim 7 wherein the filler in the dielectric is selected from the group consisting of ceramics, barium titanate, boron nitride, aluminum oxide, silica, strontium titanate, barium strontium titanate, quartz, nonceramic fillers and combinations thereof.

9. The capacitor of claim 1 wherein at least one of the dielectric layers is comprised of a filler and a polymer wherein the filler is present in an amount of from about 5% to about 80% by volume of the dielectric layer.

10. The capacitor of claim 1 wherein each of the conductive foils has a thickness of from about 0.5 to about 200 microns.

11. The capacitor of claim 1 wherein each of the dielectric layers has a thickness of from about 2 to about 200 microns.

12. The capacitor of claim 1 wherein a reinforcing layer is incorporated in the dielectric layer.

13. The capacitor of claim 1 further comprising a reinforcing layer in the dielectric layer, which reinforcing layer comprises fiberglass, paper, polybenzoxolate paper, or combinations thereof.

14. The capacitor of claim 1 which has a capacitance of at least about 250 pF/cm².

15. The capacitor of claim 1 in which at least one of the conductive foils comprises a part of an electrical circuit.

16. A printed circuit board which comprises the capacitor of claim 1.

17. A chip carrier for a microelectronic device which comprises the capacitor of claim 1.

18. The capacitor of claim 1 wherein the dielectric layer comprises a polyimide.

19. A capacitor which comprises an electrically conductive foil comprising a copper substrate and a metal layer on a surface of the copper substrate which metal layer comprises nickel, a first dielectric layer on a surface of the metal layer, a second dielectric layer on substantially the entirely of the first dielectric layer and an electrically conductive layer on the second dielectric layer.

20. The capacitor of claim 19 wherein the conductive layer is applied on the second dielectric layer by sputtering, evaporation or vapor deposition.

21. The capacitor of claim 19 wherein the conductive layer comprises a foil.

22. The capacitor of claim 19 in which at least one of the conductive foil or conductive layer comprises a part of an electrical circuit.

23. A printed circuit board which comprises the capacitor of claim 19.

24. A chip carrier for a microelectronic device which comprises the capacitor of claim 19.

25. A process for forming a capacitor which comprises providing a first and a second electrically conductive foil, each conductive foil comprising a copper substrate and a metal layer on a surface of the copper substrate which metal layer comprises nickel;

applying a first dielectric layer onto a surface of the metal layer of the first conductive foil;

applying a second dielectric layer onto a surface of the metal layer of the second conductive foil and then attaching substantially the entirety of the first and second dielectric layers to one another.

26. The process of claim 25 wherein the first and second dielectric layers are applied as liquids onto the first and second conductive foils.

27. The process of claim 25 wherein the first and second dielectric layers are applied as liquids onto the first and second conductive foils and then at least partially dried.

28. The process of claim 25 wherein the first and second dielectric layer are in the form of sheets which are laminated to the first and second conductive foils.

29. The process of claim 25 wherein the first and second dielectric layer are attached to one another by lamination.