Single layer capacitor

• US 6,661,639 B1
• Filed: 07/02/2002
• Issued: 12/09/2003
• Est. Priority Date: 07/02/2002
• Status: Expired due to Term

• Current Assignee: Presidio Components Incorporated
• Original Assignee: Presidio Components Incorporated
• Inventors: Devoe, Lambert, Devoe, Alan, Trinh, Hung
• Primary Examiner(s): Reichard, Dean A.
• Assistant Examiner(s): THOMAS, ERIC W
• Application Number:
  US10/188,696
• Time in Patent Office: 525 Days
• Field of Search: 361/301.1, 361/301.3, 361/301.4, 361/303-305, 361/306--30, 361/307, 361/308--30, 361/309, 361/310-313, 361/320
• US Class Current: 361/303
• CPC Class Codes: H01G 4/005 Electrodes
• CPC Class Codes: H01G 4/06 Solid dielectrics
• CPC Class Codes: H01G 4/228 Terminals
• CPC Class Codes: H01G 4/33 Thin- or thick-film capacitors thin- or thick-film circuits H01L27/00; capacitors without a potential-jump or surface barrier specially adapted for integrated circuits, details thereof, multistep manufacturing processes therefor H01L28/40
• CPC Class Codes: Y02E 60/13 Energy storage using capacitors

Abstract

A monolithic or essentially monolithic single layer capacitor with high structural strength and capacitance. Sheets of green-state ceramic dielectric material and ceramic/metal composite material are laminated together, diced into individual chips, and fired to sinter the ceramic together. The composite material may contain an amount of metal sufficient to render the composite conductive whereby the composite may be used for one or both electrodes and for mounting the capacitor. Alternatively, the composite material may contain an amount of metal insufficient to render the composite conductive but sufficient to act as seed points for an electroplating process wherein the composite is preferentially coated with conductive metal, the coated composite is mounted, and the coating provides an electrical connection to an internal electrode. Vertically-oriented surface mountable capacitors and hybrid capacitors are provided.

Claims

1. A capacitor comprising:

an essentially monolithic structure comprising at least one composite portion sintered with a ceramic dielectric portion,

a buried metallization in the dielectric portion and at least one conductive metal-filled via extending from the buried metallization to the composite portion,

wherein the composite portion includes a ceramic and a conductive metal, the capacitor further characterized by a feature selected from the group consisting of;

(a) the composite portion comprises the conductive metal in an amount sufficient to render the composite portion conductive, wherein the composite portion provides an electrical lead for attaching the capacitor to a metallic surface trace on a printed circuit board; and

(b) a metallization area partially between the composite portion and the ceramic dielectric portion, and a conductive metal coating on faces of the composite portion not sintered to the ceramic dielectric portion, whereby the conductive metal coating provides an electrical lead for attaching the capacitor to a metallic surface trace on a printed circuit board.

2. The capacitor of claim 1 wherein the composite portion comprises glass sintered with the ceramic dielectric portion.

3. The capacitor of claim 1 characterized by feature (a) wherein the composite portion comprises a matrix of the ceramic, and particles of the conductive metal arc dispersed in the matrix, and wherein the conductive metal particles comprise about 40-90% of the composite portion.

4. The capacitor of claim 1 characterized by feature (b) wherein the composite portion comprises a matrix of the ceramic, and particles of the conductive metal arc dispersed in the matrix, and wherein the conductive metal particles comprise less than about 40% of the composite portion.

5. The capacitor of claim 1 characterized by feature (b) wherein the composite portion comprises a plurality of ceramic layers in alternating relation with a plurality of conductive metal layers.

6. The capacitor of claim 1, wherein the at least one composite portion includes a pair of composite portions sintered to opposing faces of the ceramic dielectric portion, and wherein feature (b) includes the metallization area partially between each composite portion and the respective opposing face of the ceramic dielectric portion.

7. The capacitor of claim 1, wherein the ceramic dielectric portion is horizontally disposed with the composite portion sintered to a bottom portion thereof, the composite portion adapted to be mounted onto a pc board, and the capacitor further comprising a metallization on a top portion of the ceramic dielectric portion, the metallization adapted to be wire bonded to a pc board.

8. A capacitor comprising:

an essentially monolithic structure comprising first and second composite end blocks each having an internal face and a plurality of external faces and a ceramic dielectric portion therebetween, the ceramic dielectric portion having first and second opposed substantially coplanar surfaces at least partially sintered to the internal face of the respective first and second composite end blocks,

a pair of buried metallizations in the ceramic dielectric portion and at least one conductive metal-filled via extending from each buried metallization to the respective first and second composite end blocks,

wherein the first and second composite end blocks each include a ceramic and a conductive metal, the capacitor further characterized by a feature selected from the group consisting of;

(a) the first and second composite end blocks each comprise the conductive metal in an amount sufficient to render the composite end blocks conductive, wherein the composite end blocks provide electrical leads for attaching the capacitor to a metallic surface trace on a printed circuit board; and

(b) first and second metallization areas on a portion of the respective first and second coplanar surfaces with the remaining portion being sintered to the respective internal faces of the first and second composite end blocks, and a conductive metal coating on the plurality of external faces of the first and second composite end blocks, whereby the conductive metal coating provides electrical leads for attaching the capacitor to a metallic surface trace on a printed circuit board.

9. The capacitor of claim 8 wherein the internal faces of the first and second composite end blocks comprise glass.

10. The capacitor of claim 8 characterized by feature (a) wherein the composite end blocks comprise a matrix of the ceramic, and particles of the conductive metal are dispersed in the matrix, and wherein the conductive metal particles comprise about 40-90% of the composite end blocks.

11. The capacitor of claim 8 characterized by feature (b) wherein the composite end blocks comprise a matrix of the ceramic, and particles of the conductive metal are dispersed in the matrix, and wherein the conductive metal particles comprise less than about 40% of the composite end blocks.

12. The capacitor of claim 8 characterized by feature (b) wherein the composite end blocks comprise a plurality of ceramic layers in alternating relation with a plurality of conductive metal layers.

13. A capacitor comprising:

a ceramic dielectric layer having first and second opposed substantially coplanar surfaces;

at least one first metallization area on a first portion of the first surface of the ceramic dielectric layer and at least one second metallization area on a first portion of the second surface of the ceramic dielectric layer;

a first composite end block having an internal face and a plurality of external faces, the internal face in contacting relation with the at least one first metallization area and sintered to a second portion of the first surface of the ceramic dielectric layer, wherein the composite comprises a ceramic and a conductive metal in an amount less than about 40% of the composite; and

a first conductive metal coating on the external faces of the first composite end block, whereby the coated first composite end block is adapted to be mounted directly on a printed circuit board to provide an electrical connection between the first metallization area and a metallic surface trace on said printed circuit board.

14. The capacitor of claim 13 wherein the composite comprises a plurality of ceramic sheets in alternating relation with a plurality of conductive metal sheets.

15. The capacitor of claim 13 wherein the composite comprises a matrix of the ceramic, and particles of the conductive metal are dispersed in the matrix.

16. The capacitor of claim 13 wherein the composite comprises ceramic particles coated with conductive metal.

17. The capacitor of claim 13 further comprising at least one buried metallization in the ceramic dielectric layer intermediate the opposed coplanar surfaces, and having at least one metal-filled via extending from the buried metallization to one of the first and second metallization areas.

18. The capacitor of claim 13 further comprising:

a second composite end block having an internal face and a plurality of external faces, the internal face in contacting relation with the at least one second metallization area and sintered to a second portion of the second surface of the ceramic dielectric layer, and

a second conductive metal coating on the external faces of the second composite end block, whereby the coated second composite end block is adapted to be mounted directly on a printed circuit board to provide an electrical connection between the second metallization area and a metallic surface trace on said printed circuit board.

19. A surface mountable, monolithic capacitor comprising:

a center ceramic dielectric portion having opposed coplanar surfaces;

a pair of composite end portions comprising a ceramic and a conductive metal in an amount sufficient to render the composite conductive, each end portion having an internal face and a plurality of external faces, each internal face sintered to a respective opposed coplanar surface of the center ceramic dielectric portion, whereby the conductive end portions are adapted to serve as electrodes for the capacitor and to provide electrical leads for attaching the capacitor to metallic surface traces on a printed circuit board, and

at least one buried metallization in the center ceramic dielectric portion intermediate the opposed coplanar surfaces, and having at least one metal-filled via extending from the buried metallization to one of the composite end portions.

20. The capacitor of claim 19 wherein the internal faces of the composite end portions comprise glass.

21. The capacitor of claim 19 wherein the conductive metal comprises about 90% of the composite end portions.