Single layer capacitor

CAFC
  • US 6,661,639 B1
  • Filed: 07/02/2002
  • Issued: 12/09/2003
  • Est. Priority Date: 07/02/2002
  • Status: Active Grant
First Claim
Patent Images

1. A capacitor comprising:

  • an essentially monolithic structure comprising at least one composite portion sintered with a ceramic dielectric portion, a buried metallization in the dielectric portion and at least one conductive metal-filled via extending from the buried metallization to the composite portion, wherein the composite portion includes a ceramic and a conductive metal, the capacitor further characterized by a feature selected from the group consisting of;

    (a) the composite portion comprises the conductive metal in an amount sufficient to render the composite portion conductive, wherein the composite portion provides an electrical lead for attaching the capacitor to a metallic surface trace on a printed circuit board; and

    (b) a metallization area partially between the composite portion and the ceramic dielectric portion, and a conductive metal coating on faces of the composite portion not sintered to the ceramic dielectric portion, whereby the conductive metal coating provides an electrical lead for attaching the capacitor to a metallic surface trace on a printed circuit board.

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