Methods and structures for reducing lateral diffusion through cooperative barrier layers
First Claim
1. A covered substrate comprising:
- a flexible substrate layer; and
a plurality of cooperative barrier layers disposed on said substrate layer, said plurality of cooperative barrier layers further comprising a planarizing layer and a high-density layer, wherein said high-density layer is disposed over said planarizing layer in a manner such that said high-density layer extends to said substrate layer and, in conjunction with said substrate layer, completely surrounds said planarizing layer, and wherein said covered substrate is disposed between an organic optoelectronic device and an outside environment.
1 Assignment
0 Petitions
Accused Products
Abstract
A covered substrate is described, which comprises: (a) a flexible substrate layer; and (b) a plurality of cooperative barrier layers disposed on the substrate layer. The plurality of cooperative barrier layers further comprise one or more planarizing layers and one or more high-density layers. Moreover, at least one high-density layer is disposed over at least one planarizing layer in a manner such that the at least one high-density layer extends to the substrate layer and cooperates with the substrate layer to completely surround the at least one planarizing layer. When combined with an additional barrier region, such covered substrates are effective for enclosing organic optoelectronic devices, such organic light emitting diodes, organic electrochromic displays, organic photovoltaic devices and organic thin film transistors. Preferred organic optoelectronic devices are organic light emitting diodes.
-
Citations
13 Claims
-
1. A covered substrate comprising:
-
a flexible substrate layer; and
a plurality of cooperative barrier layers disposed on said substrate layer, said plurality of cooperative barrier layers further comprising a planarizing layer and a high-density layer, wherein said high-density layer is disposed over said planarizing layer in a manner such that said high-density layer extends to said substrate layer and, in conjunction with said substrate layer, completely surrounds said planarizing layer, and wherein said covered substrate is disposed between an organic optoelectronic device and an outside environment. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
-
Specification