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Methods and structures for reducing lateral diffusion through cooperative barrier layers

  • US 6,664,137 B2
  • Filed: 03/29/2001
  • Issued: 12/16/2003
  • Est. Priority Date: 03/29/2001
  • Status: Expired due to Term
First Claim
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1. A covered substrate comprising:

  • a flexible substrate layer; and

    a plurality of cooperative barrier layers disposed on said substrate layer, said plurality of cooperative barrier layers further comprising a planarizing layer and a high-density layer, wherein said high-density layer is disposed over said planarizing layer in a manner such that said high-density layer extends to said substrate layer and, in conjunction with said substrate layer, completely surrounds said planarizing layer, and wherein said covered substrate is disposed between an organic optoelectronic device and an outside environment.

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