Process for wafer level treatment to reduce stiction and passivate micromachined surfaces and compounds used therefor
DCFirst Claim
Patent Images
1. A chip having anti-stiction properties, said chip comprising:
- a substrate having a micromachined structure fabricated on one surface thereof; and
a layer of a linear organo silicon compound disposed on said micromachined structure, wherein the organic substituents on the silicon atom of said silicon compound are phenyl substituents.
1 Assignment
Litigations
0 Petitions
Accused Products
Abstract
This invention discloses a process for forming durable anti-stiction surfaces on micromachined structures while they are still in wafer form (i.e., before they are separated into discrete devices for assembly into packages). This process involves the vapor deposition of a material to create a low stiction surface. It also discloses chemicals which are effective in imparting an anti-stiction property to the chip. These include polyphenylsiloxanes, silanol terminated phenylsiloxanes and similar materials.
58 Citations
12 Claims
-
1. A chip having anti-stiction properties, said chip comprising:
-
a substrate having a micromachined structure fabricated on one surface thereof; and
a layer of a linear organo silicon compound disposed on said micromachined structure, wherein the organic substituents on the silicon atom of said silicon compound are phenyl substituents. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 11)
-
-
10. A chip having anti-stiction properties, said chip comprising:
-
a substrate having a micromachined structure fabricated on one surface thereof; and
a layer of an organo silicon compound disposed on said micromachined structure, wherein said organo silicon compound is selected from the group consisting of phenylsilanols and phenylsilanes having at least one hydrogen substituent, and wherein the organic substituents on the silicon atom of said silicon compound are phenyl substituents. - View Dependent Claims (12)
-
Specification