Method and apparatus for improving the durability of a sensor

• US 6,681,126 B2
• Filed: 12/03/2002
• Issued: 01/20/2004
• Est. Priority Date: 12/23/1993
• Status: Expired due to Fees

• Current Assignee: Nellcor Puritan Bennett Incorporated (Medtronic Plc)
• Original Assignee: Nellcor Puritan Bennett Incorporated (Medtronic Plc)
• Inventors: Solenberger, Stephen D.
• Primary Examiner(s): WINAKUR, ERIC FRANK
• Application Number:
  US10/310,130
• Publication Number:
  US 20030139657A1
• Time in Patent Office: 413 Days
• Field of Search: 600/310-316, 600/322-324, 600/326, 600/340, 600/344, 600/473, 600/476, 356/39-41, 206/305
• US Class Current: 600/310
• CPC Class Codes: A61B 2046/205 Adhesive drapes
• CPC Class Codes: A61B 46/10 specially adapted for instruments, e.g. microscopes
• CPC Class Codes: A61B 5/14552 Details of sensors specially adapted therefor
• CPC Class Codes: Y10T 29/49002 Electrical device making

Abstract

The present invention relates to a method and apparatus for improving the durability of a sensor, specifically one attached by an adhesive material to a subject. Specifically, the present invention discloses a method and apparatus for laminating a sensor and inserting the sensor into a protective shield for use. The shield includes some adhesive material to affix the sensor to the subject. A dirty, damaged, or worn out shield may be discarded and the sensor inserted into a new shield for continued use of the sensor.

Claims

1. A method for improving the durability of an otherwise disposable sensor, wherein said disposable sensor includes at least one light emitter and at least one light detector, and an attached first adhesive, comprising the steps of:

modifying a layer of said disposable sensor;

enclosing said sensor with a shield to form a shielded sensor;

attaching said shielded sensor to an adhesive strip having a second adhesive and an appropriate shape for attaching to a patient; and

attaching said shielded sensor to said patient with said adhesive strip.

2. The method of claim 1 wherein said step of modifying comprises sterilizing said sensor before enclosing said sensor.

3. The method of claim 1 wherein said step of modifying comprises at least partially removing said first adhesive before enclosing said sensor.