Molding apparatus for molding light emitting diode lamps

• US 6,682,331 B1
• Filed: 09/20/2002
• Issued: 01/27/2004
• Est. Priority Date: 09/20/2002
• Status: Expired due to Term

• Current Assignee: Document Security Systems, Inc.
• Original Assignee: Agilent Technologies, Inc.
• Inventors: Peh, Thomas Kheng Guan, Lye, Chien Chai
• Primary Examiner(s): DAVIS, ROBERT B
• Application Number:
  US10/247,965
• Time in Patent Office: 494 Days
• Field of Search: 425/112, 425/127, 425/120, 425/572, 425/588
• US Class Current: 425/112
• CPC Class Codes: B29C 45/14655 connected to or mounted on a carrier, e.g. lead frame
• CPC Class Codes: B29C 45/1671 with an insert
• CPC Class Codes: B29C 45/1675 using exchangeable mould halves
• CPC Class Codes: B29C 70/72 Encapsulating inserts having non-encapsulated projections, e.g. extremities or terminal portions of electrical components B29C70/742 takes precedence
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/1815 Shape
• CPC Class Codes: H01L 33/52 Encapsulations
• CPC Class Codes: H01L 33/54 having a particular shape

Abstract

The present invention provides a method and system for molding light emitting diode (LED) lamps. A mold frame is provided around each LED chip in an array. A first mold insert is placed in the mold frame and light converting material comprising a carrier and light converting particles is injected into the first mold insert to form a light converting molding around each LED chip. The first mold insert is removed. A second mold insert is placed in the mold frame and lens material is injected into the first mold insert to form a lens molding around the light converting molding for each LED chip.

Claims

1. A system for molding light emitting diode lamps using light emitting diode (LED) chips comprising:

a mold frame;

a first mold insert locatable in the mold frame, the first mold insert defining first mold voids locatable about the LED chips;

a second mold insert locatable in the mold frame, the second mold insert defining second mold voids; and

an injector;

wherein the injector injects light converting material into the first mold voids and injects lens material into the second mold voids.

2. The system of claim 1 further comprising a mixer, the mixer mixing a carrier and light converting particles to form the light converting material.

3. The system of claim 1 wherein the first mold insert further comprises first runners connecting the first mold voids.

4. The system of claim 1 wherein the second mold insert further comprises second runners connecting the second mold voids.