Thermal head lapping apparatus

• US 6,688,951 B2
• Filed: 03/27/2000
• Issued: 02/10/2004
• Est. Priority Date: 03/26/1999
• Status: Expired due to Fees

• Current Assignee: Fujifilm Corporation (Fujifilm Holdings Corporation)
• Original Assignee: Fuji Photo Film Co Limited (Fujifilm Holdings Corporation)
• Inventors: Nakada, Junji, Kashiwaya, Makoto
• Primary Examiner(s): NGUYEN, DUNG V
• Application Number:
  US09/534,555
• Publication Number:
  US 20030060146A1
• Time in Patent Office: 1,415 Days
• Field of Search: 451/168, 451/166, 451/169, 451/296, 451/303, 451/304, 451/305, 451/313
• US Class Current: 451/168
• CPC Class Codes: B24B 19/26 for grinding workpieces with arcuate surfaces, e.g. parts of car bodies, bumpers or magnetic recording heads grinding of spherical surfaces in general B24B11/00, of optical surfaces on lenses or surfaces of similar shape on other work B24B13/00
• CPC Class Codes: B24B 21/004 using abrasive rolled strips
• CPC Class Codes: B24B 27/0023 grinding machines with a plurality of working posts
• CPC Class Codes: B41J 2/3353 Protective layers

Abstract

A thermal head lapping apparatus includes a pallet for holding at least one thermal head, a transport device for transporting the thermal head held on the pallet successively to a specified processing position, and a lapping device for forcing a lapping material being moved onto the thermal head that has been transported to said processing position. As a result, the apparatus is capable of advantageously performing lapping treatment with a good efficiency on surfaces to be coated with protective layers or the formed protective layers in a process of fabricating a thermal head, thereby improving the production efficiency of the thermal head and fabricating with a good productivity the suitably lapped thermal head of high quality that ensures high quality image recording.

Claims

1. A thermal head lapping apparatus, comprising:

a pallet holding at least one thermal head that has heating elements;

a transport device transporting the thermal head held on the pallet to a specified processing position; and

a lapping device for forcing a lapping material being moved onto the thermal head that has been transported to said processing position,

wherein the pallet and the thermal head move together to said processing position.

2. The thermal head lapping apparatus according to claim 1, wherein said transport device moves the pallet in a direction in which the heating elements of the thermal head are arranged while said lapping device forces the lapping material being moved onto the thermal head, so that the thermal head is lapped.

3. The thermal head lapping apparatus according to claim 1, wherein said lapping device comprises of at least one polishing section.

4. The thermal head lapping apparatus according to claim 3, wherein said at least one polishing section uses said lapping material that has a width covering a whole area of the heating elements of the thermal head.

5. The thermal head lapping apparatus according to claim 4, wherein said lapping material further comprises of a lapping tape, the count of the lapping tape varies in the range of #1000 to #20000.

6. The thermal head lapping apparatus according to claim 5, wherein said at least one polishing section further comprises of a forcing unit and moving unit, said forcing unit forces said lapping tape onto the thermal head, and said moving unit moves said lapping tape.

7. The thermal head lapping apparatus according to claim 6, wherein said moving unit comprises of a feed roller, a take-up roller, a moving roller pair, and guide rollers, said feed roller, moving roller pair, take-up roller are engaged with a motor, a servo motor, and a motor respectively.

8. The thermal head lapping apparatus according to claim 6, wherein said forcing unit comprises a moving device.

9. The thermal head lapping apparatus according to claim 1, wherein said transport device comprises a linear motion guide.

20. The thermal head lapping apparatus according to claim 1, wherein said lapping device comprises a plurality of polishing sections and wherein the lapping material is moved onto the thermal heads in each of said polishing section.

10. A thermal head lapping apparatus, comprising:

a pallet for holding at least one thermal head;

a transport device for transporting the thermal head held on the pallet to a specified processing position; and

a lapping device for forcing a lapping material being moved onto the thermal head that has been transported to said processing position,

wherein said pallet holds a plurality of thermal heads arranged in a direction perpendicular to a direction in which heating elements of each of the thermal heads are arranged;

said lapping device uses the lapping material that has a width covering a whole area of the heating elements of each of the thermal heads; and

said transport device transports the pallet discontinuously in the direction in which the thermal heads are arranged so that the thermal heads held on the pallet are successively transported to said processing position.

11. A thermal head lapping apparatus, comprising:

a plurality of pallets holding a plurality of thermal heads, each of the thermal heads having heating elements;

a transport device transporting the thermal heads held on said plurality of pallets successively to a specified processing position; and

a lapping device for forcing a lapping material being moved onto the thermal heads that have been transported to said processing position,

wherein each pallet moves together with the thermal head held thereby to said processing position.

12. The thermal head lapping apparatus according to claim 11, wherein said lapping device comprises of at least one polishing section.

13. The thermal head lapping apparatus according to claim 12, wherein said at least one polishing section uses said lapping material that has a width covering a whole area of the heating elements of the thermal head.

14. The thermal head lapping apparatus according to claim 13, wherein said lapping material further comprises of a lapping tape, the count of the lapping tape varies in the range of #1000 to #20000.

15. The thermal head lapping apparatus according to claim 14, wherein said at least one polishing section further comprises of a forcing unit and moving unit, said forcing unit forces said lapping tape onto the thermal head, and said moving unit moves said lapping tape.

16. The thermal head lapping apparatus according to claim 15, wherein said moving unit comprises of a feed roller, a take-up roller, a moving roller pair, and guide rollers, said feed roller, moving roller pair, take-up roller are engaged with a motor, a servo motor, and a motor respectively.

17. The thermal head lapping apparatus according to claim 16, wherein said forcing unit comprises a moving device.

18. The thermal head lapping apparatus according to claim 11, wherein said transport device comprises a linear motion guide.

19. A thermal head lapping apparatus, comprising:

a plurality of pallets for holding a plurality of thermal heads;

a transport device for transporting the thermal heads held on said plurality of pallets successively to a specified processing position; and

a lapping device for forcing a lapping material being moved onto the thermal heads that have been transported to said processing position,

wherein said transport device moves said plurality of pallets in a direction in which heating elements of said plurality of thermal heads are arranged while said lapping device forces.